Clamping jig and cleaning device

Patent metadata

Field	Value
Publication number	US-12057328-B2
Application number	US-202017633080-A
Country	US
Kind code	B2
Filing date	Jun 25, 2020
Priority date	Aug 8, 2019
Publication date	Aug 6, 2024
Grant date	Aug 6, 2024

Abstract

A clamping jig according to the present disclosure includes a supporting portion extending in a vertical direction, and a bent portion connected to a top side of the supporting portion and configured to come into contact with an outer peripheral portion of a substrate. The bent portion includes a base end portion located on a side of the supporting portion and a tip portion connected to the base end portion. At least the tip portion contains a ceramic containing silicon carbide or aluminum oxide as a main component.

First claim

The invention claimed is:

1. A clamping jig comprising:
a supporting portion extending in a vertical direction; and
a bent portion connected to a top side of the supporting portion and configured to come into contact with an outer peripheral portion of a substrate,
the bent portion comprising a base end portion located on a side of the supporting portion, and a tip portion connected to the base end portion, wherein
the supporting portion comprises a first facing surface configured to face the substrate,
the tip portion comprises a connecting surface that connects a surface configured to come into contact with the substrate and the first facing surface,
the first facing surface and the connecting surface comprise a first electrically conductive portion comprising a layer or film with electrical conductivity,
the tip portion comprises a ceramic containing silicon carbide or aluminum oxide as a main component, and
a mass change C per unit area indicated by the following Equation (1) when immersion is performed in hydrochloric acid having a concentration of 35 mass % and after 72 hours elapse from start of the immersion is equal to or less than 0.3 g/cm 2 ,
C =( W 0 −W 1 )/ A   (1)

where, in the Equation (1), W 0 indicates mass of a test piece before the immersion, W 1 indicates mass of the test piece after the 72 hours elapse from the start of the immersion, and A indicates a surface area of the test piece (cm 2 ) before the immersion.

2. The clamping jig according to claim 1 , wherein
a second facing surface of the tip portion configured to face the substrate comprises a second electrically conductive portion comprising a layer or film with electrical conductivity, and
a main surface of the second electrically conductive portion is configured to come into contact with the substrate.

3. The clamping jig according to claim 2 , wherein
a cut level difference (Rδc) representing a difference between a cut level at a load length ratio of 25% in a roughness curve of the main surface of the second electrically conductive portion and a cut level at a load length ratio of 75% in the roughness curve of the main surface of the second electrically conductive portion is equal to or greater than 0.065 μm and equal to or less than 0.7 μm.

4. The clamping jig according to claim 3 , wherein
an arithmetic mean roughness (Ra) in the roughness curve of the main surface of the second electrically conductive portion is equal to or greater than 0.06 μm and equal to or less than 3.7 μm.

5. The clamping jig according to claim 4 , wherein
a variation coefficient of the arithmetic mean roughness (Ra) in the roughness curve of the main surface of the second electrically conductive portion is equal to or greater than 0.15 and equal to or less than 0.35.

6. The clamping jig according to claim 3 , wherein
a variation coefficient of the cut level difference (Rδc) is equal to or greater than 0.2 and equal to or less than 0.35.

7. The clamping jig according to claim 1 , wherein
a cut level difference (Rδc) representing a difference between a cut level at a load length ratio of 25% in a roughness curve of a surface of the tip portion configured to come into contact with the substrate and a cut level at a load length ratio of 75% in the roughness curve of the surface of the tip portion is equal to or greater than 0.065 μm and equal to or less than 0.7 μm.

8. The clamping jig according to claim 7 , wherein
an arithmetic mean roughness (Ra) in the roughness curve of the surface of the tip portion configured to come into contact with the substrate is equal to or greater than 0.06 μm and equal to or less than 3.7 μm.

9. The clamping jig according to claim 8 , wherein
a variation coefficient of the arithmetic mean roughness (Ra) is equal to or greater than 0.15 and equal to or less than to 0.35.

10. The clamping jig according to claim 7 , wherein
a variation coefficient of the cut level difference (Rδc) is equal to or greater than 0.2 and equal to or less than 0.35.

11. The clamping jig according to claim 1 , wherein
the supporting portion and the bent portion are integrally formed.

12. A cleaning device comprising:
the clamping jig according to claim 1 .

Assignees

• Kyocera Corp

Inventors

• Hamashima Hiroshi

Classifications

• H10P72/7616

  characterised by a coating, a hardness or a material · CPC title

• H10P72/7602 Primary

  the wafers being placed on a robot blade or gripped by a gripper for conveyance · CPC title

• H10P72/0416 Primary

  with the semiconductor substrates being dipped in baths or vessels · CPC title

• H10P72/7626

  characterised by the construction of the shaft · CPC title

• H10P72/3306

  Horizontal transfer of a single workpiece · CPC title