Wire harness
US-2020269779-A1 · Aug 27, 2020 · US
Wiring member
US12057247B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12057247-B2 |
| Application number | US-202017628714-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 8, 2020 |
| Priority date | Jul 26, 2019 |
| Publication date | Aug 6, 2024 |
| Grant date | Aug 6, 2024 |
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- Title
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- Abstract
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- Assignees and inventors
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- First independent claim
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Abstract
Official abstract text for this publication.
A wiring member includes: a wire-like transmission member having a transmission wire body and a covering layer covering the transmission wire body; an adherend having an inorganic layer on a surface; and an adhesive agent intervening between the covering layer and the inorganic layer to be bonded to the covering layer and the inorganic layer, wherein the adhesive agent contains a chemical compound including at least one resin side functional group and at least one inorganic material side functional group in a molecular structure, the resin side functional group is chemically bonded to resin constituting the covering layer, and the inorganic material side functional group is chemically bonded to an inorganic material constituting the inorganic layer.
First claim
Opening claim text (preview).
The invention claimed is: 1. A wiring member, comprising: a wire-like transmission member including a transmission wire body and a covering layer covering the transmission wire body; an adherend including an inorganic layer on a surface; and an adhesive agent intervening between the covering layer and the inorganic layer to be bonded to the covering layer and the inorganic layer, wherein the adhesive agent contains a chemical component including at least one resin side functional group and at least one inorganic material side functional group in a molecular structure, the resin side functional group is chemically bonded to resin constituting the covering layer, the inorganic material side functional group is chemically bonded to an inorganic material constituting the inorganic layer, wherein the inorganic material is metal, and the inorganic material side functional group is a chelate group. 2. The wiring member according to claim 1 , wherein the inorganic material side functional group is an alkoxy group, and the chemical compound further includes silicon bonding the alkoxy group and the resin side functional group in the molecular structure. 3. The wiring member according to claim 1 , wherein the resin is polyvinyl chloride, and the resin side functional group is one type or two or more types of functional group selected from a group made up of an amino group, a thiol group, and an epoxy group. 4. The wiring member according to claim 1 , wherein the resin is polyolefin, and the resin side functional group is one type or two or more types of functional group selected from a group made up of an amino group, a thiol group, a vinyl group, an acrylic group, a methacryl group, and an epoxy group. 5. The wiring member according to claim 1 , wherein the chemical compound is a polymer in which the plurality of resin side functional groups and the plurality of inorganic material side functional groups are bonded to a molecular chain. 6. The wiring member according to claim 1 , wherein the adherend is a sheet-like member, and the wire-like transmission member is disposed on a main surface of the inorganic layer in the sheet-like member.
Assignees
Inventors
Classifications
- H01B3/441Primary
from alkenes · CPC title
Presence of polysiloxane · CPC title
in the pretreated surface to be joined · CPC title
in the pretreated surface to be joined · CPC title
in the pretreated surface to be joined · CPC title
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US12057247B2 cover?
- A wiring member includes: a wire-like transmission member having a transmission wire body and a covering layer covering the transmission wire body; an adherend having an inorganic layer on a surface; and an adhesive agent intervening between the covering layer and the inorganic layer to be bonded to the covering layer and the inorganic layer, wherein the adhesive agent contains a chemical compo…
- Who is the assignee on this patent?
- Autonetworks Technologies Ltd, Sumitomo Wiring Systems, Sumitomo Electric Industries
- What technology area does this patent fall under?
- Primary CPC classification H01B3/441. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Aug 06 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).