Cost effective, mass producible temperature controlled thermal imaging calibration source

Patent metadata

Field	Value
Publication number	US-12055446-B2
Application number	US-202117202084-A
Country	US
Kind code	B2
Filing date	Mar 15, 2021
Priority date	Mar 17, 2020
Publication date	Aug 6, 2024
Grant date	Aug 6, 2024

Abstract

A temperature controlled calibration source for thermal imaging that provides for extremely inexpensive, mass producible, field deployable thermal calibration in specific, relatively low temperature ranges, and in particular temperatures near nominal human body temperature. A calibration source suitable for such applications may be implemented primarily as a suitable designed Printed Circuit Board (PCB), packaged in a thermally isolating housing and powered of commonly available power sources such as USB chargers.

First claim

What is claimed is:

1. A temperature-controlled calibration source, comprising:
a housing;
a power supply element;
a printed circuit board (PCB) comprising at least one copper layer, wherein a resistive heater spanning a heated region is disposed on a first side of the PCB, and wherein a heat conductive layer spanning at least a portion of the heated region is disposed on a copper layer of the PCB opposite the heater;
a calibrated temperature sensor disposed to measure a temperature of the heat conductive layer; and
a controller circuit configured to read the temperature sensor and to power the heater in feedback to the temperature sensor to maintain a predetermined temperature of the heat conductive layer;
wherein the heat conductive layer functions as an even temperature blackbody calibration source for thermal camera calibration.

2. The temperature controlled calibration source of claim 1 , wherein the controller circuit includes at least one of analog circuits or a programmable microcontroller.

3. The temperature controlled calibration source of claim 1 , wherein the heat conductive layer is a metal layer, including at least a portion of the at least one copper layer of the PCB.

4. The temperature controlled calibration source of claim 1 , wherein the controller circuit and the power supply element are disposed on the first side of the PCB, and wherein the temperature sensor is thermally connected to the heat conductive layer.

5. The temperature controlled calibration source of claim 1 , wherein the heat conductive layer is at least one of painted or coated with a layer of a color having a predetermined emissivity.

6. The temperature controlled calibration source of claim 5 , wherein the layer of the color is chosen to have an emissivity matching human skin, including an emissivity of one of 0.95 or 0.98+/−0.01.

7. The temperature controlled calibration source of claim 1 , wherein the heat conductive layer is at least one of painted or coated with a layer of a color that provides a recognizable color for pattern recognition detection of the calibration source.

8. The temperature controlled calibration source of claim 1 , wherein the resistive heater is a serpentine pattern and the heated region is a suitable shape, including one of square, circular, or rectangular.

9. The temperature controlled calibration source of claim 8 , wherein the heated region is a rectangle or a square having a minimum lateral dimension greater than at least one of 2, 3, or 4 inches.

10. The temperature controlled calibration source of claim 1 , wherein the power supply element includes a USB connection, a battery, an ac-dc converter, an ac-dc battery charger, a traditional ac power supply, or a solar cell power supply.

11. The temperature controlled calibration source of claim 1 , further comprising a thermal insulation layer encasing at least a portion of the PCB and other components.

12. The temperature controlled calibration source of claim 1 , wherein the housing includes a bezel that masks off one or more edges of the heat conductive layer, thereby masking off a part of the heat conductive layer where a temperature gradient is greatest.

13. The temperature controlled calibration source of claim 1 , wherein the predetermined temperature is within a range corresponding to within at least one of 15, 10, or 5 degrees of nominal human body temperature.

14. The temperature controlled calibration source of claim 1 , wherein the predetermined temperature is nominally one of 41 or 42.5 degrees C., selected to be likely the highest temperature in a scene.

15. The temperature controlled calibration source of claim 14 , wherein the calibration source comprises a portion of a system including a thermal imager, the calibration source operable in conjunction with the thermal imager to calibrate the system for detection of body temperature corresponding to fever conditions.

16. The temperature controlled calibration source of claim 1 , wherein the PCB comprises at least four copper layers including:
a bottommost layer covering at least a portion of a substrate of the PCB and serving as a heat spreader;
a second layer adjacent to the bottommost layer, the second layer covering at least a portion of the PCB substrate and serving as a heat spreader;
a third layer adjacent to the second layer opposite the bottommost layer, the third layer having a heater etched therein; and
a top layer adjacent to the third layer opposite the second layer, the top layer including the controller circuit, the heated region, and the temperature sensor, connected directly to the heated region.

17. The temperature controlled calibration source of claim 1 wherein the heated region includes an etched gap disposed inside at least one edge of the heated region to improve temperature uniformity across the heated region.

18. The temperature controlled calibration source of claim 17 , wherein the gap is at least 1 mm wide.

19. The temperature controlled calibration source of claim 1 , further comprising a heat spreading element in the form of metal sheet bonded in a thermally conductive manner to the temperature controlled surface.

20. The temperature controlled calibration source of claim 1 , further comprising a data connection, wherein the controller is further configured to allow for data communication and control functions over the data connection.

Assignees

• Seek Thermal Inc

Inventors

• Parrish William J
• Duerner Andrew
• Nehring Brian
• Buckley Matt
• Meyer Charles

Classifications

• H05K2201/10151

  Sensor · CPC title

• H05K1/0212

  Printed circuits or mounted components having integral heating means · CPC title

• G01K15/005

  Calibration · CPC title

• G01J5/53

  Reference sources, e.g. standard lamps; Black bodies · CPC title

• G01J5/80

  Calibration (using comparison with reference sources G01J5/52) · CPC title