Apparatus for plating and method of plating

Patent metadata

Field	Value
Publication number	US-12054841-B2
Application number	US-202217895558-A
Country	US
Kind code	B2
Filing date	Aug 25, 2022
Priority date	Nov 5, 2021
Publication date	Aug 6, 2024
Grant date	Aug 6, 2024

Abstract

One object of the present disclosure is to improve the accuracy of detection of an abnormality of various devices, and/or to advance the timing of detection of an abnormality. There is provided an apparatus for plating a substrate, comprising: an anode placed to be opposed to the substrate; an electric field regulating member placed between the substrate and the anode, provided with an opening, and equipped with an opening adjustment member configured to change a dimension of the opening; a motor configured to drive the opening adjustment member; and a control device configured to obtain an electric current value or a load factor of the motor, to calculate an amount of change in the load factor of the motor per unit time from the obtained electric current value or the obtained load factor of the motor, and to detect an abnormality of the electric field regulating member when it is detected that the amount of change in the load factor of the motor per unit time exceeds a predetermined threshold value.

First claim

What is claimed is:

1. An apparatus for plating a substrate, comprising:
a plating cell comprising an anode placed to be opposed to the substrate;
an electric field regulating member placed between the substrate and the anode, provided with an opening, and equipped with an opening adjustment member configured to change a dimension of the opening, and
a motor configured to drive the opening adjustment member; and
a control device configured to obtain an electric current value or a load factor of the motor, to calculate an amount of change in the load factor of the motor per unit time from the obtained electric current value or the obtained load factor of the motor, and to detect an abnormality of the electric field regulating member when it is detected that the amount of change in the load factor of the motor per unit time exceeds a predetermined threshold value,
wherein the control device starts driving the opening adjustment member of the electric field regulating member prior to placement of the substrate into the plating cell,
obtains the electric current value or the load factor of the motor to calculate an amount of change in the load factor of the motor per unit time at the start of operation of the opening adjustment member that is a time period from a start of an increase in electric current of the motor to saturation of the electric current of the motor, and
when it is detected that the amount of change in the load factor of the motor per unit time exceeds the predetermined threshold value, stops the placement of the substrate into the plating cell.

2. The apparatus for plating according to claim 1 ,
wherein the control device further detects that the amount of change in the load factor of the motor per unit time exceeds the predetermined threshold value, based on the electric current value or the load factor of the motor, and detects an abnormality of the electric field regulating member, before the load factor of the motor exceeds a predetermined reference value in middle of operation after the start of the operation of the opening adjustment member to change the dimension of the opening.

3. The apparatus for plating according to claim 1 , comprising:
a plurality of the plating cells, wherein
the control device specifies a plating cell that is to be used to process the substrate by a plating process, starts driving the opening adjustment member of the electric field regulating member prior to placement of the substrate into the specified plating cell, and when it is detected that the amount of change in the load factor of the motor per unit time exceeds the predetermined threshold value with regard to the specified plating cell, stops the placement of the substrate into the specified plating cell.

4. The apparatus for plating according to claim 3 ,
wherein the control device determines whether there is another plating cell that is usable for placement of the substrate, which is stopped to be placed into the specified plating cell, and when there is another plating cell that is usable for placement of the substrate, places the substrate into the another plating cell.

5. The apparatus for plating according to claim 3 ,
wherein the control device performs changing the dimension of the opening of the electric field regulating member multiple times with regard to the plating process for one substrate, and
every time changing the dimension of the opening of the electric field regulating member is performed, the control device performs a process of detecting an abnormality of the electric field regulating member, based on the amount of change in the load factor of the motor per unit time.

6. The apparatus for plating according to claim 5 ,
wherein the control device performs changing the dimension of the opening of the electric field regulating member after a start of the plating process of the substrate, continues the plating process of the substrate when an abnormality of the electric field regulating member is detected with regard to the specified plating cell, and subsequently sets the specified plating cell to be unused or unusable.

7. The apparatus for plating according to claim 1 ,
wherein the electric field regulating member is an anode mask placed between the substrate and the anode to be located at a position closer to the anode than the substrate.

Assignees

• Ebara Corp

Inventors

• Ideguchi Kazuma
• Wakabayashi Hideki
• Koizumi Ryuya

Classifications

• C25D17/008 Primary

  Current shielding devices · CPC title

• C25D17/001 Primary

  Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells · CPC title

• C25D5/022

  using masking means · CPC title

• C25D17/12

  Shape or form (C25D17/14 takes precedence) · CPC title

• C25D21/12 Primary

  Process control or regulation (controlling or regulating in general G05) · CPC title