Support, bonding apparatus including the support, and method of fabricating display device using the bonding apparatus
US-2021384480-A1 · Dec 9, 2021 · US
US12052906B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12052906-B2 |
| Application number | US-202117188744-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 1, 2021 |
| Priority date | Jun 5, 2020 |
| Publication date | Jul 30, 2024 |
| Grant date | Jul 30, 2024 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
A bonding device includes a first panel support, a second panel support disposed below the first panel support, a diaphragm disposed on and extending along the first panel support, the diaphragm being disposed between the first panel support and the second panel support, and a window fixing chuck disposed on the diaphragm, the window fixing chuck including a groove facing the diaphragm. A through-hole extends from the second panel support to the first panel support, and the diaphragm is disposed on the through-hole.
Opening claim text (preview).
What is claimed is: 1. A bonding device comprising: a first panel support; a second panel support disposed below the first panel support; a diaphragm disposed on and extending along the first panel support, the diaphragm being disposed between the first panel support and the second panel support; and a window fixing chuck disposed on the diaphragm, the window fixing chuck including a groove facing the diaphragm, wherein a through-hole extends from the second panel support to the first panel support, and the diaphragm is disposed on the through-hole, the through-hole is defined in a direction perpendicular to an upper end of the first panel support from a lower end of the second panel support, wherein a thickness of the diaphragm gradually decreases from an upper end of the first panel support to a portion between the first panel support and the second panel support, and the thickness of the diaphragm is defined as dimension between a front surface of the diaphragm facing the window fixing chuck and a back surface of the diaphragm facing the first panel support. 2. The bonding device of claim 1 , wherein the second panel support has a plate shape and extends in a third direction intersecting a plane defined by a first direction and a second direction intersecting the first direction, the plate shape being defined by the first direction and the third direction, and the first panel support and the groove extend in the first direction. 3. The bonding device of claim 2 , wherein the diaphragm is not disposed on side surfaces of the second panel support, the side surfaces of the second panel support are opposite to each other in the first direction and the second direction. 4. The bonding device of claim 2 , wherein the first panel support or the second panel support and the diaphragm are disposed in the groove of the window fixing chuck upon the window fixing chuck or the first panel support or the second panel support being moved in the third direction. 5. The bonding device of claim 2 , wherein the diaphragm overlaps the first panel support, and the first panel support includes a curved surface convex in an upward direction corresponding to the third direction, and the window fixing chuck includes a concave curved surface at an inner end of the groove of the window fixing chuck facing the curved surface of the first panel support. 6. The bonding device of claim 5 , wherein the first panel support has a maximum width greater than a width of the second panel support based on the second direction. 7. The bonding device of claim 5 , wherein the diaphragm comprises: a first portion disposed on the curved surface of the first panel support; and a second portion disposed between the first panel support and the second panel support. 8. The bonding device of claim 7 , wherein the first portion of the diaphragm is disposed on the through-hole extending from the second panel support to the first panel support and expanded by air injected through the through-hole, and the second portion of the diaphragm does not overlap the through-hole. 9. The bonding device of claim 7 , further comprising: a fastening unit that fastens the second panel support to the first panel support and that does not overlap the through-hole. 10. The bonding device of claim 9 , wherein the fastening unit passes through the second panel support and the second portion of the diaphragm and is inserted into the first panel support. 11. The bonding device of claim 9 , wherein the fastening unit passes through the second panel support, is inserted into the first panel support, and does not pass through the second portion of the diaphragm. 12. The bonding device of claim 2 , wherein the through-hole extends from an upper end of the first panel support in the first direction. 13. The bonding device of claim 2 , wherein the first panel support has a maximum width equal to a width of the second panel support based on the second direction.
Self-supporting sealing arrangements · CPC title
Manufacture or treatment specially adapted for the organic devices covered by this subclass · CPC title
of non-flat surfaces, e.g. curved, profiled (B29C63/042 takes precedence) · CPC title
being a fluid inflatable bag or bladder, a diaphragm or a vacuum bag for applying isostatic pressure (inflatable element positioned between the joining tool and a backing-up part B29C66/82421) · CPC title
Displays, monitors, TV-sets, computer screens · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.