High frequency, surface mountable microstrip band pass filter

Patent metadata

Field	Value
Publication number	US-12051840-B2
Application number	US-202217894214-A
Country	US
Kind code	B2
Filing date	Aug 24, 2022
Priority date	Feb 28, 2019
Publication date	Jul 30, 2024
Grant date	Jul 30, 2024

Abstract

A high frequency, stripline filter may have a bottom surface for mounting to a mounting surface. The filter may include a monolithic base substrate having a top surface and a plurality of thin-film microstrips, including a first thin-film microstrip and a second thin-film microstrip, formed over the top surface of the substrate. Each of the plurality of thin-film microstrips may have a first arm, a second arm parallel to the first arm, and a base portion connected with the first and second arms. A port may be exposed along the bottom surface of the filter. A conductive path may include a via formed in the substrate. The conductive path may electrically connect the first thin-film microstrip with the port on the bottom surface of the filter. The filter may exhibit an insertion loss that is greater than −3.5 dB at a frequency that is greater than about 15 GHz.

First claim

What is claimed is:

1. A high frequency, stripline filter having a bottom surface for mounting to a mounting surface, the filter comprising:
a monolithic base substrate having a top surface, a length in an X-direction, a width in a Y-direction that is perpendicular to the X-direction, and a thickness in a Z-direction that is perpendicular to each of the X-direction and Y-direction;
a plurality of thin-film microstrips comprising a first thin-film microstrip and a second thin-film microstrip, each of the plurality of thin-film microstrips having a first arm, a second arm parallel to the first arm, and a base portion connected with the first and second arms, the base portion being perpendicular each of the first and second arms; and wherein the plurality of thin-film microstrips are formed over the top surface of the monolithic base substrate;
a port exposed along the bottom surface of the filter; and
a conductive path comprising a via formed in the monolithic base substrate, the conductive path electrically connecting the first thin-film microstrip with the port on the bottom surface of the filter;
wherein the filter exhibits an insertion loss that is greater than −3.5 dB at a frequency that is greater than about 15 GHz, and
wherein the conductive path comprises a bottom conductive strip connected with each of the via and the port.

2. The filter of claim 1 , wherein the frequency is about 28 GHz.

3. The filter of claim 1 , wherein the filter exhibits an insertion loss response that is greater than −3.5 dB across a frequency range that ranges from about 27 GHz to about 29 GHz.

4. The filter of claim 1 , wherein the filter exhibits a return loss that is less than about −10 dB at the frequency.

5. The filter of claim 1 , wherein the filter exhibits a return loss response that is less than about −10 dB from about 27 GHz to about 29 GHz.

6. The filter of claim 1 , wherein:
the conductive path comprises a top conductive strip connected with each of the via and the first arm of the first thin-film microstrip;
the top conductive strip has a top conductive strip effective length in the X-direction between the first arm of the first thin-film microstrip and the via;
the bottom conductive strip has a bottom conductive strip effective length in the X-Y plane between the via and the port;
the via has a via length in the Z-direction; and
the effective length of the conductive path is equal to a sum of the top conductive strip effective length, the bottom conductive strip effective length, and the via length.

7. The filter of claim 1 , wherein the bottom conductive strip is elongated in the Y-direction.

8. The filter of claim 1 , wherein the first thin-film microstrip has at least one rounded outer corner between the base portion of the first thin-film microstrip and at least one of the first arm or second arm of the first thin-film microstrip.

9. The filter of claim 1 , wherein at least one of the first arm or second arm of the first thin-film microstrip has a width that is less than about 200 microns.

10. The filter of claim 1 , wherein:
the second arm of the second thin-film microstrip is elongated in the Y-direction; and
the plurality of thin-film microstrips comprises a third thin-film microstrip, the first arm of the third thin-film microstrip being elongated in the Y-direction and spaced apart in the X-direction from the second arm of the second thin-film microstrip by a second spacing distance that is less than about 150 microns.

11. The filter of claim 10 , wherein a ratio of the second spacing distance to the first spacing distance ranges from about 1.1 to about 10.

12. The filter of claim 10 , wherein:
the first arm of the second thin-film microstrip and the second arm of the first thin-film microstrip overlap in the Y-direction along a first overlapping length;
the second arm of the second thin-film microstrip and the first arm of the third thin-film microstrip overlap in the Y-direction along a second overlapping length; and
the second overlapping length ranges from about 75% to about 96% of the first overlapping length or ranges from about 104% to about 125% of the first overlapping length.

13. The filter of claim 1 , wherein the monolithic base substrate has a bottom surface opposite the top surface, and wherein the filter further comprises a ground plane formed over the bottom surface of the base substrate.

14. The filter of claim 1 , wherein the thickness of the monolithic base substrate is less than about 500 microns.

15. The filter of claim 1 , wherein the monolithic base substrate comprises a material having a dielectric constant that is less than about 30 as determined in accordance with ASTM D2520-13 at an operating temperature of 25° C. and frequency of 28 GHz.

16. A method of forming a high frequency, stripline filter having a bottom surface for mounting to a mounting surface, the method comprising:
providing a monolithic base substrate having a top surface;
forming a plurality of thin-film microstrips comprising a first thin-film microstrip and a second thin-film microstrip over the top surface of the monolithic base substrate;
depositing a port along the bottom surface of the filter; and
forming a via in the monolithic base substrate that electrically connects the first thin-film microstrip with the port on the bottom surface of the filter;
wherein the filter exhibits an insertion loss that is greater than −3.5 dB at a frequency that is greater than about 15 GHz.

17. The method of claim 16 , wherein each of the plurality of thin-film microstrips has a first arm, a second arm parallel to the first arm, and a base portion connected with the first and second arms, the base portion being perpendicular each of the first and second arms, and wherein the filter exhibits a return loss that is less than about −10 dB at the frequency.

18. A high frequency, stripline filter having a bottom surface for mounting to a mounting surface, the filter comprising:
a monolithic base substrate having a top surface, a length in an X-direction, a width in a Y-direction that is perpendicular to the X-direction, and a thickness in a Z-direction that is perpendicular to each of the X-direction and Y-direction, the thickness less than about 500 microns;
a first thin-film microstrip and a second thin-film microstrip, each of the first thin-film microstrip and the second thin-film microstrip having a first arm, a second arm parallel to the first arm, and a base portion connected with the first and second arms, the base portion being perpendicular each of the first and second arms, the first thin-film microstrip and the second thin-film microstrip each formed over the top surface of the monolithic base substrate;
a port exposed along the bottom surface of the filter; and
a conductive path comprising a via formed in the monolithic base substrate, the conductive path electrically connecting the first thin-film microstrip with the port on the bottom surface of the filter;
wherein the filter exhibits an insertion loss that is greater than −3.5 dB at a frequency that is greater than about 15 GHz.

19. The filter of claim 18 , wherein the monolithic base substrate comprises a material having a dielectric constant that is less than about 30 as determined in accordance with ASTM D2520-13 at an operating temperature of 25° C. and frequency of 28 GHz.

20. The filter of claim 18 , wherein the monolithic base substrate comprises alumina.

Assignees

• Kyocera Avx Components Corp

Inventors

• Marek Michael
• O'Neill Elinor
• Nissim Ronit

Classifications

• H01P3/081

  Microstriplines · CPC title

• H01P11/007

  Manufacturing frequency-selective devices (resonators H01P11/008) · CPC title

• H01P11/003

  Manufacturing lines with conductors on a substrate, e.g. strip lines, slot lines · CPC title

• H01P1/203 Primary

  Strip line filters · CPC title

• H01P1/20372 Primary

  Hairpin resonators · CPC title