Lighting module and lighting assembly including same

Patent metadata

Field	Value
Publication number	US-12051676-B2
Application number	US-201917270911-A
Country	US
Kind code	B2
Filing date	Sep 9, 2019
Priority date	Sep 11, 2018
Publication date	Jul 30, 2024
Grant date	Jul 30, 2024

Abstract

The lighting assembly disclosed in the embodiment of the invention includes a substrate, light emitting devices on the substrate, a first resin layer covering the light emitting devices, and at least one second resin layer on the first resin layer, and a first cover disposed on an outer periphery of the substrate along an outer periphery of the substrate of the lighting module. The second resin layer is disposed on upper and side surfaces of the first resin layer, and the second resin layer includes at least one of phosphor and ink particles. The first cover includes an opening portion from which the second resin layer protrudes, a substrate cover portion disposed on an upper surface of the substrate around the opening portion, and a side cover portion extending lower than a side surface of the substrate from the substrate cover portion. An upper surface of the substrate cover portion may be disposed lower than the upper surface of the first resin layer.

First claim

What is claimed is:

1. A lighting assembly comprising:
a lighting module including a substrate, a plurality of light emitting devices on the substrate, a first resin layer covering the plurality of light emitting devices, and at least one second resin layer on the first resin layer; and
a first cover disposed on an outer portion of the substrate along an outer periphery of the substrate of the lighting module,
wherein the second resin layer is disposed on an upper surface and side surfaces of the first resin layer,
wherein the second resin layer includes at least one of wavelength conversion means and ink particles,
wherein the first cover includes an opening portion from which the second resin layer protrudes, a substrate cover portion disposed on an outer portion of an upper surface of the substrate and around the opening portion, and a side cover portion extending lower than a side surface of the substrate from the substrate cover portion,
wherein an upper surface of the substrate cover portion is disposed lower than the upper surface of the first resin layer,
wherein an area of the upper surface of the substrate is greater than an area of a lower surface of the first resin layer,
wherein the outer portion of the upper surface of the substrate extends further outward from an edge of the second resin layer,
wherein an edge of the substrate extends more outward than a lower periphery of the second resin layer, and
wherein a thickness of the lighting module is 5.5 mm or less.

2. The lighting assembly of claim 1 , further comprising a second cover including a substrate support portion under the substrate of the lighting module and a stepped coupling portion around an outer periphery of the substrate support portion,
wherein the side cover portion of the first cover is coupled to the coupling portion of the second cover.

3. The lighting assembly of claim 2 , wherein the first cover and the second cover include a cable lead portion protruding outward from a region between the first and second covers and from which a power cable connected to the substrate is drawn out.

4. The lighting assembly of claim 2 , wherein the second cover includes a terminal groove in which a terminal on a lower surface of the substrate is exposed,
wherein a side surface of the terminal groove is inclined toward one side of the lighting module.

5. The lighting assembly of claim 1 , wherein a distance between the side surface of the substrate and a side surface of the second resin layer is at least 0.1 times the thickness of the lighting module.

6. The lighting assembly of claim 1 , wherein the upper surface of the substrate and an upper surface of the second resin layer comprise a convex curved surface.

7. The lighting assembly of claim 1 , wherein the first cover includes a locking protrusion protruding toward the substrate.

8. The lighting assembly of claim 1 , wherein the opening portion of the first cover is provided in plural, and
wherein the lighting module is provided in plural and protruded from each of the opening portions.

9. The lighting assembly of claim 1 , wherein each of the plurality of light emitting devices is disposed on the substrate in a flip chip type,
wherein the second resin layer includes phosphor and ink particles in a resin material,
wherein a content of the phosphor in the second resin layer is 23 wt % or less, and a content of the ink particles is in a range of 3 wt % to 13 wt %.

10. A lighting assembly comprising:
a lighting module including a substrate, a plurality of light emitting devices on the substrate, a first resin layer covering the plurality of light emitting devices, and at least one second resin layer on the first resin layer; and
a cover including a first cover disposed on an outer periphery of the substrate of the lighting module and a second cover supporting a lower portion of the lighting module,
wherein the second resin layer is disposed on a surface of the first resin layer and includes at least one of wavelength conversion means and ink particles therein,
wherein the first cover includes an opening portion from which the first and second resin layers protrude, a substrate cover portion disposed on an outer portion of an upper surface of the substrate and around the opening portion, and a side cover portion extending from the substrate cover portion to a side surface of the substrate,
wherein an area of the upper surface of the substrate is greater than an area of a lower surface of the first resin layer,
wherein an edge the substrate extends further outward from a lower periphery of the second resin layer, and
wherein the cover includes first and second coupling members concave toward the substrate on both sides adjacent to one end of the lighting module.

11. The lighting assembly of claim 10 , wherein the second
wherein a terminal disposed on a lower surface of the substrate is exposed through the terminal grooves.

12. The lighting assembly of claim 11 , wherein the plurality of terminal grooves is disposed closer to one end of the lighting module than a virtual straight line connecting the first and second coupling members.

13. The lighting assembly of claim 11 , wherein a side surface of the second resin layer comprises a convex curved surface.

14. The lighting assembly of claim 11 ,
wherein a thickness of the lighting module is less than 5.5 mm,
wherein each of the plurality of light emitting devices is disposed on the substrate in a flip chip type,
wherein the second resin layer includes phosphor and ink particles in a resin material,
wherein a content of the phosphor in the second resin layer is 23 wt % or less, and a content of the ink particles is in a range of 3 wt % to 13 wt %.

15. A lighting assembly comprising:
a lighting module including a substrate, a plurality of light emitting devices on the substrate, a first resin layer covering the plurality of light emitting devices, and at least one second resin layer on the first resin layer; and
a first cover disposed on an outer portion of the substrate along an outer periphery of the substrate of the lighting module,
wherein the second resin layer is disposed on an upper surface and side surfaces of the first resin layer,
wherein the second resin layer includes at least one of wavelength conversion means and ink particles,
wherein the first cover includes an opening portion from which the second resin layer protrudes, a substrate cover portion disposed at a periphery of the opening portion and on an outer periphery of an upper surface of the substrate, and a side cover portion extending lower than a side surface of the substrate from the substrate cover portion,
wherein the upper surface of the substrate cover portion is disposed lower than the upper surface of the first resin layer,
wherein an area of the upper surface of the substrate is greater than an area of a lower surface of the first resin layer,
wherein an edge portion between an upper surface and a side surface of the second resin layer is formed in a curved surface,
wherein the outer portion of the upper surface of the substrate extends further outward from an edge of the second resin layer,
wherein a linear distance from a lower surface of the substrate to the upper surface of the second resin layer is 5.5 mm or less,
wherein a thickness of the lighting module is in a range of 180% to 220% of a thickness of the first resin layer, and
wherein a length of the outer portion of the upper surface of the substrate is a distance from the side surface of the second resin layer to an edge of the substrate, and is in a range of 0.3 mm

Assignees

• Lg Innotek Co Ltd

Inventors

• Lee Jung Ju
• Park Hoon
• Han Sa Rum

Classifications

• H10W90/00 Primary

  Package configurations · CPC title

• H10H20/8511

  characterised by their material, e.g. binder · CPC title

• H10H20/8515

  not being in contact with the bodies · CPC title

• F21K9/237

  Details of housings or cases, i.e. the parts between the light-generating element and the bases; Arrangement of components within housings or cases (F21K9/238 takes precedence) · CPC title

• H10H20/854

  characterised by their material, e.g. epoxy or silicone resins · CPC title