Austenitic stainless steel having excellent electrical conductivity, and method for manufacturing same

US12049688B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12049688-B2
Application numberUS-201917259288-A
CountryUS
Kind codeB2
Filing dateJun 14, 2019
Priority dateJun 14, 2019
Publication dateJul 30, 2024
Grant dateJul 30, 2024

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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Abstract

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The present disclosure relates to austenitic stainless steel with excellent electrical conductivity in which metal copper is formed in a non-conductive passivation film formed on the surface of stainless steel, and a method of manufacturing the same. The austenitic stainless steel with excellent electrical conductivity according to an embodiment of present disclosure includes: a stainless steel base material comprising, in percent (%) by weight of the entire composition, C: 0.1% or less, Si: 0.1 to 1.0% or less, Mn: 0.1 to 2.0% or less, Cr: 15 to 24% or less, Ni: 6 to 12% or less, Cu: 0.5 to 3% or less, the remainder of iron (Fe) and other inevitable impurities; and a passivation film formed on the stainless steel base material, and the passivation film has a thickness of more than 0 and less than or equal to 5 nm, the Cu weight % content in the thickness region between 2 to 3 nm from the surface of the passivation film is 1.5 or more compared to the Cu weight % content of the stainless steel base material.

First claim

Opening claim text (preview).

The invention claimed is: 1. An austenitic stainless steel comprising: a stainless steel base material comprising, in percent (%) by weight of the entire composition, C: 0.1% or less, Si: 0.1 to 1.0%, Mn: 0.1 to 2.0%, Cr: 15 to 24%, Ni: 6 to 12%, Cu: 0.5 to 3%, the remainder of iron (Fe) and inevitable impurities; and a passivation film formed on the stainless steel base material, and wherein the passivation film has a thickness of more than 0 and less than or equal to 5 nm, a ratio of a Cu weight % content in a thickness region between 2 to 3 nm from a surface of the passivation film compared to a Cu weight % content of the stainless steel base material is 1.5 or more. 2. The austenitic stainless steel of claim 1 , wherein the passivation film is formed of an oxide containing Fe, Cr, or Ni. 3. The austenitic stainless steel of claim 2 , wherein a contact resistance of the stainless steel is 15 mψcm 2 or less. 4. The austenitic stainless steel of claim 2 , wherein a surface roughness of the stainless steel is 1.13 μm or less.

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What does patent US12049688B2 cover?
The present disclosure relates to austenitic stainless steel with excellent electrical conductivity in which metal copper is formed in a non-conductive passivation film formed on the surface of stainless steel, and a method of manufacturing the same. The austenitic stainless steel with excellent electrical conductivity according to an embodiment of present disclosure includes: a stainless…
Who is the assignee on this patent?
Posco, Posco Co Ltd
What technology area does this patent fall under?
Primary CPC classification C22C38/42. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Jul 30 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).