Thermal head and thermal printer

US12049090B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12049090-B2
Application numberUS-202117907672-A
CountryUS
Kind codeB2
Filing dateMar 26, 2021
Priority dateMar 31, 2020
Publication dateJul 30, 2024
Grant dateJul 30, 2024

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A thermal head includes a substrate, an electrode, a bonding material, an electrically conductive member, and a sealing material. The electrode is located on the substrate. The bonding material is located on the substrate or the electrode. The electrically conductive member is located on the bonding material and is electrically connected to the electrode via the bonding material. The sealing material is located on the substrate and covers the bonding material and the electrically conductive member. The bonding material includes a protruding portion located at an outer circumferential edge of the electrically conductive member away from the substrate and the electrically conductive member.

First claim

Opening claim text (preview).

The invention claimed is: 1. A thermal head, comprising: a substrate; an electrode located on the substrate; a bonding material located on the substrate or the electrode; an electrically conductive member located on the bonding material and electrically connected to the electrode via the bonding material; and a sealing material located on the substrate, the sealing material covering the bonding material and the electrically conductive member, wherein the bonding material comprises a protruding portion located at an outer circumferential edge of the electrically conductive member, the protruding portion being away from the substrate and the electrically conductive member, the electrically conductive member comprises: a first end surface facing the bonding material, and a second end surface located closer to the substrate than the first end surface, and surrounding the first end surface in a plan view, and an end portion of the protruding portion is located farther from the substrate than the first end surface. 2. The thermal head according to claim 1 , wherein the sealing material comprises a portion located between the protruding portion and the electrically conductive member. 3. The thermal head according to claim 1 , wherein the electrically conductive member has a cross-sectional area along at least one of the first end surface or the second end surface of the electrically conductive member facing the substrate, the cross-sectional area becoming smaller as the electrically conductive member gets closer to the substrate. 4. The thermal head according to claim 1 , wherein the electrically conductive member comprises an exposed region in which no bonding material is located on an outer circumferential surface of the electrically conductive member in a direction intersecting at least one of the first end surface or the second end surface facing the substrate. 5. The thermal head according to claim 1 , wherein the electrically conductive member includes a plurality of electrically conductive members adjacent to each other, the bonding material includes bonding materials corresponding to the plurality of electrically conductive members, the protruding portion includes protruding portions located in a same direction in a plan view, and the bonding materials include the protruding portions. 6. The thermal head according to claim 1 , wherein the protruding portion includes a plurality of protruding portions located in different directions in a plan view, and the bonding material includes the plurality of protruding portions. 7. A thermal printer, comprising: a thermal head, comprising: a substrate; an electrode located on the substrate; a bonding material located on the substrate or the electrode; an electrically conductive member located on the bonding material and electrically connected to the electrode via the bonding material; and a sealing material located on the substrate, the sealing material covering the bonding material and the electrically conductive member, wherein the bonding material comprises a protruding portion located at an outer circumferential edge of the electrically conductive member, the protruding portion being away from the substrate and the electrically conductive member, the electrically conductive member comprises: a first end surface facing the bonding material, and a second end surface located closer to the substrate than the first end surface, and surrounding the first end surface in a plan view, and an end portion of the protruding portion is located farther from the substrate than the first end surface; a transport mechanism transporting a recording medium onto a heat generating part located on the substrate; and a platen roller pressing the recording medium onto the heat generating part.

Assignees

Inventors

Classifications

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US12049090B2 cover?
A thermal head includes a substrate, an electrode, a bonding material, an electrically conductive member, and a sealing material. The electrode is located on the substrate. The bonding material is located on the substrate or the electrode. The electrically conductive member is located on the bonding material and is electrically connected to the electrode via the bonding material. The sealing ma…
Who is the assignee on this patent?
Kyocera Corp
What technology area does this patent fall under?
Primary CPC classification B41J2/3357. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jul 30 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).