Composite of thermally-modified polymer layer and inorganic substrate, composite of polymer member and inorganic substrate, and production methods thereof

Patent metadata

Field	Value
Publication number	US-12049066-B2
Application number	US-201916578674-A
Country	US
Kind code	B2
Filing date	Sep 23, 2019
Priority date	Sep 28, 2018
Publication date	Jul 30, 2024
Grant date	Jul 30, 2024

Abstract

To provide a composite of thermally-modified polymer layer and inorganic substrate, a composite of polymer member and inorganic substrate, and production methods thereof, the method of the present invention for producing a composite of thermally-modified polymer layer and inorganic substrate 110 or 120 includes forming a first polymer layer on an inorganic substrate 10, and heating and thermally modifying the first polymer layer in order to bond the first thermally-modified polymer layer 20 onto the inorganic substrate. In addition, the method of the present invention for producing a composite of polymer member and inorganic substrate 210 or 220 includes producing a composite of thermally-modified polymer layer and inorganic substrate by the method of the present invention and joining the polymer member to the first thermally-modified polymer layer so that the polymer member 30 is joined to an inorganic substrate via the first thermally-modified polymer layer.

First claim

The invention claimed is:

1. A composite of thermally-modified polymer layer and inorganic substrate, wherein thermally-modified polymer layers are bonded to an inorganic substrate,
wherein the thermally-modified polymer layers contain at least a first thermally-modified polymer layer directly bonded to the inorganic substrate and a second thermally-modified polymer layer bonded to the first thermally-modified polymer layer,
wherein a degree of thermal modification of the first thermally-modified polymer layer is such that the ratio of the number of oxygen atoms contained in the first thermally-modified polymer layer to the total of the number of oxygen atoms and carbon atoms contained in the first thermally-modified polymer layer as measured by X-ray photoelectron spectroscopy (XPS) is 0.5% or more and 30% or less,
wherein a degree of thermal modification of the second thermally-modified polymer layer is such that the ratio of the number of oxygen atoms contained in the second thermally-modified polymer layer to the total of the number of oxygen atoms and carbon atoms contained in the second thermally-modified polymer layer as measured by X-ray photoelectron spectroscopy (XPS) is 0.3% or more and 20% or less,
wherein the degree of thermal modification of the second thermally-modified polymer layer is smaller than the degree of thermal modification of the first thermally-modified polymer layer, and
wherein the inorganic substrate is selected from the group consisting of semimetals, oxides of metals and semimetals, nitrides of metals and semimetals, carbides of metals and semimetals, carbon materials, and combinations thereof, wherein the semimetals are silicon and germanium
and wherein both of the first and second thermally-modified polymer layers are formed of an olefin polymer and are a polymer layer oxidized by heating in an oxygen-containing atmosphere.

2. The composite according to claim 1 , wherein the thermally-modified polymer layers further contain a third thermally-modified polymer layer bonded to the second thermally-modified polymer layer.

3. The composite according to claim 1 , wherein the first thermally-modified polymer layer has a thickness of 1 nm or more and 30 μm or less.

4. The composite according to claim 1 , wherein the inorganic substrate is selected from the group consisting of silicon, germanium, and diamond, and combinations thereof.

5. A composite of polymer member and inorganic substrate, wherein a polymer member is bonded to the inorganic substrate via the thermally-modified polymer layers of the composite of thermally-modified polymer layer and inorganic substrate according to claim 1 .

6. The composite according to claim 5 , wherein the polymer member is in a film shape.

7. The composite according to claim 5 , wherein the polymer member is formed of an olefin polymer.

8. The composite according to claim 7 , wherein, with regard to the first and second thermally-modified polymer layers and the polymer member, the olefin polymer is a cycloolefin polymer.

9. A method for producing the composite of thermally-modified polymer layer and inorganic substrate according to claim 1 , comprising:
forming a first polymer layer on the inorganic substrate, and heating the first polymer layer so that the first thermally-modified polymer layer is formed and the first thermally-modified polymer is bonded onto the inorganic substrate, and
forming a second polymer layer on the first thermally-modified polymer layer after the formation of the first thermally-modified polymer layer, and heating the second polymer layer so that the second thermally-modified polymer layer is formed and the second thermally-modified polymer layer is bonded onto the first thermally-modified polymer layer.

10. The method according to claim 9 , further comprising:
forming a third polymer layer on the second thermally-modified polymer layer after the formation of the second thermally-modified polymer layer, and heating the third polymer layer so that a third thermally-modified polymer layer is formed and the third thermally-modified polymer layer is bonded onto the second thermally-modified polymer layer.

11. The method according to claim 10 , wherein
the degree of thermal modification of the third thermally-modified polymer layer is smaller than the degree of thermal modification of the second thermally-modified polymer layer.

12. The method according to claim 9 , wherein the first polymer layer is formed by coating and/or thermocompression bonding.

13. A method for producing a composite polymer member and inorganic substrate comprising:
producing the composite of thermally-modified polymer layer and inorganic substrate by the method according to claim 9 , and
joining a polymer member to the thermally-modified polymer layers so that the polymer member is joined to the inorganic substrate via the thermally-modified polymer layers.

14. The method according to claim 13 , wherein the polymer member is in a film shape.

15. The method according to claim 13 , wherein joining of the polymer member is performed by coating or thermocompression bonding.

16. The method according to claim 13 , wherein the polymer member is formed of an olefin polymer.

17. The method according to claim 16 , wherein with regard to the first and second thermally-modified polymer layers and the polymer member, the olefin polymer is a cycloolefin polymer.

Assignees

• Teijin Ltd

Inventors

• SOEDA Junshi
• Ikeda Yoshinori

Classifications

• B32B9/045

  of synthetic resin · CPC title

• B32B37/144 Primary

  using layers with different mechanical or chemical conditions or properties, e.g. layers with different thermal shrinkage, layers under tension during bonding (constructional features for tensioning B32B38/1825) · CPC title

• B32B38/0036

  Heat treatment (for heating or cooling of layers during lamination B32B37/06, B32B37/08) · CPC title

• B32B37/02

  characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations · CPC title

• B32B2037/0092

  in which absence of adhesives is explicitly presented as an advantage · CPC title