Thermally conductive compositions for targeted heat dissipation of electronic components

Patent metadata

Field	Value
Publication number	US-12048121-B2
Application number	US-202117404766-A
Country	US
Kind code	B2
Filing date	Aug 17, 2021
Priority date	Aug 17, 2021
Publication date	Jul 23, 2024
Grant date	Jul 23, 2024

Abstract

Thermal spreaders for targeted heat dissipation of an electronic component are disclosed. One thermal spreader includes a thermally conductive composition configured to function in conjunction with an electrically insulator material to dissipate heat away from a heat-generating electronic component of a computing device while electrically insulating the electronic component. The thermally conductive composition is malleable to target placement of the thermally conductive material on the electrically insulator material such that the thermally conductive composition is in thermal communication with a targeted area of the electronic component over which the electrically insulator material is positioned for targeted heat dissipation of the electronic component. Apparatus and systems including one or more of the thermal spreaders for targeted heat dissipation of one or more electronic components included therein are also disclosed.

First claim

What is claimed is:

1. An apparatus, comprising:
a heat-generating electronic component;
an electrically insulator material covering at least a portion of the electronic component; and
a thermally conductive composition positioned on the electrically insulator material,
wherein:
the thermally conductive composition is malleable to target placement of the thermally conductive material on the electrically insulator material such that the thermally conductive composition is in thermal communication with a targeted area of the electronic component over which the electrically insulator material is positioned for targeted heat dissipation of the electronic component while electrically insulating the electronic component; and
the thermally conductive composition comprises a Polysiloxane, a Talc, a thermal conductive material, a Methyltris Silane, a 3-aminopropyl Triethoxysilane, and a wax.

2. The apparatus of claim 1 , wherein the thermally conductive composition forms one of a permanent mask or a removable mask.

3. The apparatus of claim 1 , wherein the thermally conductive composition comprises one of a liquid, a gel, a powder, a tape, or a paste.

4. The apparatus of claim 1 , wherein:
the thermally conductive composition comprises 5%-95% Polysiloxane, 5%-95% Talc, 1%-55% thermal conductive material, 0.5%-10% Methyltris Silane, 0.5%-10% 3-aminopropyl Triethoxysilane, and up to 5% wax.

5. The apparatus of claim 4 , wherein the thermally conductive composition comprises 25%-65% Polysiloxane.

6. The apparatus of claim 4 , wherein the thermally conductive composition comprises 20%-35% talc.

7. The apparatus of claim 4 , wherein the thermally conductive composition comprises 5%-35% thermal conductive material.

8. A system, comprising:
a heat-generating first electronic component;
a heat-generating second electronic component;
an electrically insulator material covering at least a first portion of the first electronic component and at least a second portion of the second electronic component;
a first thermally conductive composition positioned on the first portion of the electrically insulator material; and
a second thermally conductive composition positioned on the second portion of the electrically insulator material,
wherein:
the first thermally conductive composition is malleable to target placement of the first thermally conductive material on the first portion of the electrically insulator material such that the first thermally conductive composition is in thermal communication with a first targeted area of the first electronic component over which the electrically insulator material is positioned for first targeted heat dissipation of the first electronic component while electrically insulating the first electronic component,
the second thermally conductive composition is malleable to target placement of the second thermally conductive material on the second portion of the electrically insulator material such that the second thermally conductive composition is in thermal communication with a second targeted area of the second electronic component over which the electrically insulator material is positioned for second targeted heat dissipation of the second electronic component while electrically insulating the second electronic component, and
at least one of the first thermally conductive composition and the second thermally conductive composition comprises a Polysiloxane, a Talc, a thermal conductive material, a Methyltris Silane, a 3-aminopropyl Triethoxysilane, and a wax.

9. The system of claim 8 , wherein:
the first thermally conductive composition is positioned on the electrically insulator material to create a first thermally conductive path to dissipate heat away from the first electronic component while electrically insulating the first electronic component;
the second thermally conductive composition is positioned on the electrically insulator material to create a second thermally conductive path to dissipate heat away from the second electronic component while electrically insulating the electronic component; and
the first thermally conductive composition and the second thermally conductive composition include one of:
a same thermal conductivity such that the first thermally conductive path and the second thermally conductive path include the same thermal conductivity, and
different thermal conductivities such that the first thermally conductive path and the second thermally conductive path include different thermal conductivities.

10. The system of claim 8 , wherein:
the first thermally conductive composition and the second thermally conductive composition each comprises one of a liquid, a gel, a powder, a tape, or a paste;
the one of the liquid, the gel, the powder, the tape, or the paste for the first thermally conductive composition and the second thermally conductive composition are each one of a permanent mask or a removable mask; and
the first thermally conductive composition and the second thermally conductive composition comprise one or more of:
different ones of the liquid, the gel, the powder, the tape, or the paste, or
different ones of the permanent mask or the removable mask.

11. The system of claim 10 , wherein:
the one of the liquid, the gel, the powder, the tape, or the paste for the first thermally conductive composition and the second thermally conductive composition are each one of a permanent mask or a removable mask.

12. The system of claim 10 , wherein:
the first thermally conductive composition and the second thermally conductive composition comprise different ones of the liquid, the gel, the powder, the tape, or the paste.

13. The system of claim 8 , wherein the other one of the first thermally conductive composition and the second thermally conductive composition comprises the Polysiloxane, the Talc, the thermal conductive material, the Methyltris Silane, the 3-aminopropyl Triethoxysilane, and the wax.

14. The system of claim 13 , wherein:
the first thermally conductive composition and the second thermally conductive composition each comprise 5%-95% Polysiloxane, 5%-95% Talc, 1%-55% thermal conductive material, 0.5%-10% Methyltris Silane, 0.5%-10% 3-aminopropyl Triethoxysilane, and up to 5% wax.

15. The system of claim 14 , wherein:
the first thermally conductive composition and the second thermally conductive composition comprise one of same percentages of the Polysiloxane or different percentages of the Polysiloxane.

16. The system of claim 14 , wherein:
the first thermally conductive composition and the second thermally conductive composition comprise one of same percentages of the talc or different percentages of the talc.

17. The system of claim 14 , wherein:
the first thermally conductive composition and the second thermally conductive composition comprise one of same percentages of the thermal conductive material or different percentages of the thermal conductive material.

18. The system of claim 14 , wherein:
the first thermally conductive composition and the second thermally conductive composition comprise one of same percentages of the Methyltris Silane or different percentages of the Methyltris Silane.

19. The system of claim 14 , wherein:
the first thermally conductive composition and the second thermally conductive composition comprise one of same percentages of the 3-aminopropyl Triethoxysilane or different percentages of the 3-aminopropyl Triethoxysilane.

20. The system of claim 14 , wherein:
the first thermally c

Assignees

• Lenovo Singapore Pte Ltd

Inventors

• Yebka Bouziane
• Wong Tin-Lup
• Jakes Philip J

Classifications

• H10W40/251

  Organics · CPC title

• C09K5/12

  Molten materials, i.e. materials solid at room temperature, e.g. metals or salts · CPC title

• C09K5/14

  Solid materials, e.g. powdery or granular · CPC title

• C09K5/00

  Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion · CPC title

• H05K7/2039 Primary

  characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00) · CPC title