Component carrier with embedded component connected by galvanic connection stack

Patent metadata

Field	Value
Publication number	US-12048098-B2
Application number	US-202217660741-A
Country	US
Kind code	B2
Filing date	Apr 26, 2022
Priority date	Apr 29, 2021
Publication date	Jul 23, 2024
Grant date	Jul 23, 2024

Abstract

A component carrier includes a layer body with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, a component embedded in the layer body, and at least one galvanic connection stack at least partially on at least part of at least one main surface of the layer body. At least one of a bottom main surface and a top main surface of the embedded component is electrically connected to the at least one galvanic connection stack.

First claim

The invention claimed is:

1. A component carrier, comprising:
a layer body comprising at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, wherein the layer body is a laminated layer stack;
a component embedded in the layer body; and
at least one galvanic connection stack at least partially on at least part of at least one main surface of the layer body;
wherein at least one of a bottom main surface and a top main surface of the embedded component is electrically connected to the at least one galvanic connection stack,
wherein the at least one galvanic connection stack comprises a seed layer,
wherein the bottom main surface of the component and the bottom main surface of the layer body are substantially coplanar and/or the top main surface of the component and the top main surface of the layer body are coplanar,
wherein at least one of the at least one galvanic connection stack is arranged on at least one pad at a main surface of the component and forms a planar redistribution structure.

2. The component carrier according to claim 1 , wherein the at least one galvanic connection stack comprises a galvanically deposited main layer.

3. The component carrier according to claim 1 , wherein the at least one galvanic connection stack comprises a galvanically deposited main layer, and wherein the galvanically deposited main layer is arranged on the seed layer.

4. The component carrier according to claim 1 , wherein the seed layer comprises at least one of a group consisting of a chemically deposited seed layer, or a physically deposited seed layer.

5. The component carrier according to claim 1 , wherein the at least one galvanic connection stack comprises an adhesion promoting layer.

6. The component carrier according to claim 5 , wherein the seed layer is arranged on the adhesion promoting layer.

7. The component carrier according to claim 1 , wherein the at least one galvanic connection stack comprises a barrier layer arranged directly on the component between the component and the adhesion promoting layer.

8. The component carrier according to claim 1 , wherein the at least one galvanic connection stack has a rectangular cross-section.

9. The component carrier according to claim 1 , wherein the at least one galvanic connection stack comprises a mirror symmetric layer sequence on both opposing main surfaces of the layer body.

10. The component carrier according to claim 1 , wherein at least one of the at least one galvanic connection stack comprises at least one laterally confined section arranged on at least one pad at a main surface of the component, wherein the main surface of the component at which the at least one pad is arranged is a bottom main surface.

11. The component carrier according to claim 1 , comprising at least one of the following features:
wherein at least one of the at least one galvanic connection stack covers an entire main surface of the component at which no pad of the component is arranged, wherein the at least one galvanic connection stack protrudes laterally beyond the main surface of the component at which no pad of the component is arranged;
wherein the at least one electrically conductive layer structure comprises at least one vertical through connection extending vertically through the layer body, wherein the at least one vertical through connection is electrically connected to at least one of the at least one galvanic connection stack at both opposing main surfaces of the layer body;
wherein at least one of the at least one galvanic connection stack provides a heat spreading structure;
wherein the layer body comprises a core comprising fully cured dielectric material;
wherein at least part of the component is directly surrounded by at least one of the at least one electrically insulating layer structure being functionalized as buffer structure for buffering stress, wherein the buffer structure comprises or consists of a material which has a value of the Young modulus below 8 GPa;
wherein the at least one galvanic connection stack has a stiffness gradient with a stiffness which decreases from the layer body towards an exterior side of the component carrier;
wherein at least one of the bottom main surface and the top main surface of the embedded component is in direct physical contact with the at least one galvanic connection stack;
wherein the layer body is a laminate;
wherein the component comprises at least one pad constituted by at least part of at least one of the at least one galvanic connection stack;
wherein at least one of the at least one galvanic connection stack extends on and laterally beyond the component and has a portion comprising a wavy structure, wherein a vertical wave amplitude of the wavy structure is in a range from 1 μm to 20 μm.

12. The component carrier according to claim 1 , further comprising:
a dielectric bracket engaging a vertical sidewall and connected horizontal portions of the bottom main surface and of the top main surface of the embedded component.

13. The component carrier according to claim 12 , comprising at least one of the following features:
wherein the dielectric bracket engages the sidewall and the connected portions along an entire perimeter of the component;
wherein at least part of the dielectric bracket is formed by a buffer structure for buffering stress, wherein the buffer structure comprises a material which has a value of the Young modulus below 8 GPa.

14. The component carrier according to claim 1 , comprising at least one of the following features:
wherein a portion of the bottom main surface of the embedded component being covered by one of the at least one galvanic connection stack is at least 60%;
wherein a portion of the top main surface of the embedded component being covered by one of the at least one galvanic connection stack is more than 90%.

15. The component carrier according to claim 1 , comprising at least one of the following features:
wherein a roughness Ra of the top main surface of the embedded component is in a range from 20 nm to 130 nm and/or a roughness Rz of the top main surface of the embedded component is in a range from 200 nm to 1500 nm;
wherein a roughness Ra of at least one pad at a main surface of the component is in a range from 20 nm to 130 nm and/or a roughness Rz of at least one pad at a main surface of the component is in a range from 500 nm to 1500 nm;
wherein a roughness Ra of an electrically insulating protection layer of the component at a main surface of the component is in a range from 10 nm to 40 nm and/or a roughness Rz of an electrically insulating protection layer of the component at a main surface of the component is in a range from 50 nm to 250 nm.

16. The component carrier according to claim 1 , comprising at least one of the following features:
wherein the component comprises at least one circumferentially closed electrically insulating protection layer having a vertically stepped configuration, surrounding at least one pad at a main surface of the component;
wherein the component comprises at least one electrically insulating protection layer at a main surface of the component and forming at least one protruding anchoring foot;
wherein the component comprises at least one pad connected to at least one of the at least one galvanic connection stack and having a shape of a group consisting of a circular shape and a non-circular shape;
wherein the component comprises a plurality of pads connected to at least one of the at least one galvanic connection stack, wherein at least two of t

Assignees

• At & S Austria Tech & Systemtechnik Ag
• At&Saustria Tech & Systemtechnik Ag

Inventors

• Schrittwieser Wolfgang

Classifications

• H05K1/09

  Use of materials for the {conductive, e.g. } metallic pattern · CPC title

• H05K2201/0338

  Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer · CPC title

• H05K3/427

  initial plating of through-holes in metal-clad substrates · CPC title

• H05K3/00

  Apparatus or processes for manufacturing printed circuits · CPC title

• H05K1/02

  Details · CPC title