Antenna structure and electronic device including the same

Patent metadata

Field	Value
Publication number	US-12047524-B2
Application number	US-202117554100-A
Country	US
Kind code	B2
Filing date	Dec 17, 2021
Priority date	Dec 24, 2020
Publication date	Jul 23, 2024
Grant date	Jul 23, 2024

Abstract

According to various embodiments of the disclosure, an electronic device may comprise a housing including a conductive portion, a wireless communication circuit electrically connected with the conductive portion, a first camera module disposed in a first area of the housing proximate to the conductive portion and including a first camera assembly and a flexible circuit board extending from the first camera assembly, a second camera module disposed in a second area of the housing, spaced apart from the first camera module, and including a second camera assembly and a camera bracket covering the second camera assembly and forming at least a partial surface of the housing, and a conductive pattern having at least a portion disposed between the first area and the second area and including a first portion coupled with the first camera module and a second portion coupled with the camera bracket. Other various embodiments are possible.

First claim

The invention claimed is:

1. An electronic device, comprising,
a housing including a conductive portion, a supporting bracket, and an antenna structure formed on the supporting bracket having a first conductive portion and a second conductive portion;
a wireless communication circuit electrically connected with the conductive portion;
a first camera module disposed in a first area of the housing proximate to the conductive portion, wherein the first camera module includes a first camera assembly and a flexible circuit board extending from the first camera assembly;
a second camera module disposed in a second area of the housing, spaced apart from the first camera module, wherein the second camera module includes a second camera assembly and a camera bracket covering the second camera module, and wherein the camera bracket forms at least a portion of a surface of the housing; and
a conductive pattern having at least a portion disposed between the first area and the second area and including a first portion coupled with the first camera module and a second portion coupled with the camera bracket,
wherein the camera bracket of the second camera module is disposed adjacent to the second conductive portion,
wherein an area of a first surface of the camera bracket which forms at least the portion of the surface of the housing is greater than an area of a second surface of the first camera module which is formed toward the surface of the housing.

2. The electronic device of claim 1 ,
wherein the conductive pattern includes a laser direct structuring (LDS) pattern, and
wherein the conductive pattern is formed on a supporting member positioned in the housing.

3. The electronic device of claim 2 , wherein the conductive pattern further includes a third portion disposed between the first portion and the second portion and extending from the first portion to the second portion.

4. The electronic device of claim 3 , wherein when viewed from above one surface of the supporting member, the first portion of the conductive pattern is disposed to overlap a first edge area of the first camera module, and the second portion of the conductive pattern is disposed to overlap a second edge area of the camera bracket.

5. The electronic device of claim 3 , wherein the first portion of the conductive pattern is spaced apart from a first edge area of the first camera module, and the second portion of the conductive pattern is spaced apart from a second edge area of the camera bracket.

6. The electronic device of claim 3 , wherein a first surface, facing in a first direction, of the first portion of the conductive pattern and a first edge area of the first camera module face each other, and a second surface, facing in a second direction opposite to the first direction, of the second portion of the conductive pattern and a second edge area of the camera bracket facing each other.

7. The electronic device of claim 3 , wherein as the first camera module and the camera bracket are coupled by the conductive pattern, a signal path for an antenna forms one dispersible expanded ground.

8. The electronic device of claim 3 , further comprising a ground member formed in one area of the camera bracket and electrically connected with a circuit board of the electronic device.

9. The electronic device of claim 3 , wherein a conductive hole is formed through the second portion of the conductive pattern and a partial area of the supporting member contacting the second portion, and
wherein the conductive hole is electrically connected with a circuit board of the electronic device.

10. The electronic device of claim 3 , wherein the housing includes a rear plate including a recess structure formed in an edge area and the camera bracket disposed in the recess structure to be exposed to an outside and electrically connected with the rear plate.

11. The electronic device of claim 10 , wherein the supporting bracket includes a first sidewall connected with the rear plate and a second sidewall extending from the first sidewall and connected with the camera bracket.

12. The electronic device of claim 11 , wherein the antenna structure formed on the supporting bracket includes,
the first conductive portion forming at least a portion of the first sidewall,
the second conductive portion forming at least a portion of the second sidewall, and
wherein the first conductive portion and the second conductive portion are separated by a sidewall gap.

13. The electronic device of claim 12 , wherein the first camera assembly of the first camera module is disposed adjacent to the first conductive portion, and
wherein the flexible circuit board of the first camera module is disposed to extend in a direction opposite to the first conductive portion.

14. The electronic device of claim 12 , wherein the sidewall gap is filled with an elastomeric material, ceramic, mica, glass, plastic, metal oxide, or air.

15. The electronic device of claim 3 , wherein the first camera module is a front camera facing forward of the electronic device, and the second camera module is a rear camera facing rearward of the electronic device.

16. The electronic device of claim 2 , wherein the conductive pattern includes a laser direct structuring (LDS) pattern, and wherein the conductive pattern is formed on a supporting member positioned in the housing.

17. The electronic device of claim 2 , wherein the housing comprises a sidewall, and wherein the sidewall includes the conductive portion and a first sidewall gap between the conductive portion and a remainder of the sidewall and a second sidewall gap between the conductive portion and the remainder of the sidewall.

18. The electronic device of claim 2 , wherein the conductive portion includes a first conductive portion and a second conductive portion and wherein the housing comprises a sidewall, and wherein the sidewall includes the first conductive portion and a first sidewall gap between the conductive portion and a remainder of the sidewall and a second sidewall gap between the second conductive portion.

19. The electronic device of claim 18 , wherein the first conductive portion radiates radio signals in a first frequency band, and the second conductive portion radiates radio signals in a second frequency band.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Park Suyang
• Kang Myeongkoo
• Kim Minjae
• Shin Jaehyeok
• Lee Sungmin

Classifications

• H04M1/0264 Primary

  for a camera module assembly · CPC title

• H04M1/0266

  for a display module assembly · CPC title

• H04M1/0249

  Details of the mechanical connection between the housing parts or relating to the method of assembly · CPC title

• H04M1/026

  Details of the structure or mounting of specific components · CPC title

• H04M1/0277 Primary

  for a printed circuit board assembly · CPC title