Ultrasonic horn and manufacturing apparatus of semiconductor device

Patent metadata

Field	Value
Publication number	US-12046574-B2
Application number	US-202117767914-A
Country	US
Kind code	B2
Filing date	Jun 14, 2021
Priority date	Jun 14, 2021
Publication date	Jul 23, 2024
Grant date	Jul 23, 2024

Abstract

An ultrasonic horn (50) includes: a vibration source part (53) to which an ultrasonic vibrator (58) is mounted; a tip end part (56) to which a capillary (18) is mounted; and an intermediate part (54) which is interposed between the tip end part (56) and the vibration source part (53) and propagates vibration generated by the ultrasonic vibrator (58) to the tip end part (56). The intermediate part (54) is formed with a single spiral hole (68) which is a hole penetrating in a radial direction of the ultrasonic horn (50) and advances in an axial direction as the spiral hole advances in a circumferential direction.

First claim

What is claimed is:

1. An ultrasonic horn, comprising:
a vibration source part to which an ultrasonic vibrator is mounted;
a tip end part to which a machining tool is mounted; and
an intermediate part which is interposed between the tip end part and the vibration source part and propagates vibration generated by the ultrasonic vibrator to the tip end part,
wherein the intermediate part has a single spiral hole which is a hole penetrating in a radial direction of the ultrasonic horn and advances in an axial direction as the spiral hole advances in a circumferential direction,
wherein the tip end part has a mounting hole which penetrates in a first direction orthogonal to the axial direction and to which the machining tool is mounted, and
a tip end side end portion of the spiral hole penetrates in a direction substantially parallel to the first direction.

2. An ultrasonic horn, comprising:
a vibration source part to which an ultrasonic vibrator is mounted;
a tip end part to which a machining tool is mounted; and
an intermediate part which is interposed between the tip end part and the vibration source part and propagates vibration generated by the ultrasonic vibrator to the tip end part,
wherein the intermediate part has a single spiral hole which is a hole penetrating in a radial direction of the ultrasonic horn and advances in an axial direction as the spiral hole advances in a circumferential direction,
wherein the spiral hole has a shape that advances by ¼ turn in the circumferential direction between a base end side end portion and the tip end side end portion.

3. The ultrasonic horn according to claim 1 , wherein the intermediate part has a tapered shape with a cross-sectional area that decreases from a base end side toward a tip end side.

4. A manufacturing apparatus of a semiconductor device, comprising:
the ultrasonic horn according to claim 1 ; and
a cylindrical capillary which is mounted to the tip end part of the ultrasonic horn and through which a wire is inserted.

5. The ultrasonic horn according to claim 2 , wherein the intermediate part has a tapered shape with a cross-sectional area that decreases from a base end side toward a tip end side.

Assignees

• Shinkawa Kk

Inventors

• Ito Yuhei
• Aoyagi Nobuyuki
• Sakakura Mitsuaki
• Asami Takuya
• Miura Hikaru

Classifications

• H10W72/07141

  Means for applying energy, e.g. ovens or lasers · CPC title

• H10W72/0115

  Apparatus for manufacturing bond wires · CPC title

• B23K20/002 Primary

  specially adapted for particular articles or work (B23K20/129 takes precedence) · CPC title

• B23K20/005

  Capillary welding · CPC title

• B23K20/10

  making use of vibrations, e.g. ultrasonic welding · CPC title