Resist underlayer film-forming composition

Patent metadata

Field	Value
Publication number	US-12044969-B2
Application number	US-202017438786-A
Country	US
Kind code	B2
Filing date	Mar 5, 2020
Priority date	Mar 12, 2019
Publication date	Jul 23, 2024
Grant date	Jul 23, 2024

Abstract

A resist underlayer film-forming composition revealing high reflow properties while applying and heating the composition on a substrate, allowing a flat application on a multi-level substrate thus forming a flat film. The composition includes a copolymer having a repeating structural unit of the following Formula (1) and/or a repeating structural unit of the following Formula (2) and an organic solvent:

(in Formulae (1) and (2), R 1 is a functional group of Formula (3); in Formula (3), Q 1 and Q 2 are each independently a hydrogen atom or a C 1-5 alkyl group, and * is a dangling bond to an oxygen atom; and in Formula (2), X 1 is a C 1-50 organic group, and i and j are each independently 0 or 1).

First claim

The invention claimed is:

1. A resist underlayer film-forming composition comprising a copolymer having a repeating structural unit of the following Formula (1) and/or a repeating structural unit of the following Formula (2) and an organic solvent:

(in Formulae (1) and (2), R 1 is a functional group of Formula (3); in Formula (3), Q 1 and Q 2 are each independently a hydrogen atom or a C 1-5 alkyl group, and * is a dangling bond to an oxygen atom; and in Formula (2), X 1 is a C 1-50 organic group, and i and j are each independently 0 or 1).

2. The resist underlayer film-forming composition according to claim 1 , wherein the functional group of Formula (3) is a group of the following Formula (4):

(wherein * is a dangling bond to an oxygen atom).

3. The resist underlayer film-forming composition according to claim 1 , wherein, in the repeating structural unit of Formula (2), X 1 is a linear, branched, or cyclic divalent hydrocarbon group having a carbon atom number of 2 to 20, a linear, branched, or cyclic divalent organic group having a carbon atom number of 2 to 20 and at least one sulfur atom or oxygen atom, or a divalent organic group containing at least one C 6-20 aromatic ring or C 3-12 heterocyclic ring, and the heterocyclic ring has at least one sulfur atom or oxygen atom.

4. The resist underlayer film-forming composition according to claim 1 , wherein the copolymer contains a repeating structural unit formed from an R 1 -containing monomer in an amount of 25% or more.

5. The resist underlayer film-forming composition according to claim 1 , wherein the composition further comprises a photo-crosslinking agent.

6. The resist underlayer film-forming composition according to claim 1 , wherein the composition further comprises a compound of the following Formula (5) and/or a compound of the following Formula (6):

(wherein X 2 is a carbonyl group or a methylene group; l and m are each independently an integer of 0 to 5 and satisfy a relation of 3≤1+m≤10; R 3 is a C 1-4 alkylene group or alkenylene group or a single bond; k is 0 or 1; and n is an integer of 2 to 4).

7. The resist underlayer film-forming composition according to claim 1 , wherein the composition further comprises a surfactant.

8. A method for producing a resist underlayer film, the method comprising a step of applying the resist underlayer film-forming composition according to claim 1 to a multi-level substrate; and a heating step of thermally curing the composition.

9. The method for producing a resist underlayer film according to claim 8 , wherein the heating temperature in the heating step is 200° ° C. to 300° ° C.

10. The method for producing a resist underlayer film according to claim 9 , wherein the method further comprises a light exposure step.

11. A method for producing a resist underlayer film without a light exposure step, the method comprising a step of applying the resist underlayer film-forming composition according to claim 1 to a multi-level substrate; and a heating step of thermally curing the composition at 250° C. or higher.

Assignees

• Nissan Chemical Corp

Inventors

• Ogata Hiroto
• Tokunaga Hikaru
• Nishimaki Hirokazu
• Nakajima Makoto

Classifications

• H10P95/08

  Planarisation of organic insulating materials · CPC title

• C08G59/245

  aromatic · CPC title

• C08G59/24

  carbocyclic · CPC title

• G03F7/26

  Processing photosensitive materials; Apparatus therefor (G03F7/12 - G03F7/24 take precedence) · CPC title

• G03F7/20

  Exposure; Apparatus therefor (photographic printing apparatus for making copies G03B27/00) · CPC title