Epoxy resin composition and cured product thereof

Patent metadata

Field	Value
Publication number	US-12043697-B2
Application number	US-201917296767-A
Country	US
Kind code	B2
Filing date	Oct 16, 2019
Priority date	Nov 27, 2018
Publication date	Jul 23, 2024
Grant date	Jul 23, 2024

Abstract

An epoxy resin composition and a cured product thereof are provided, the epoxy resin composition comprising an epoxy resin (A), a curing agent (B) comprising a compound represented by the following formula (B-1) (wherein R1 represents a hydrogen atom, a halogen atom, a methoxy group or a hydrocarbon group having 1 to 12 carbon atoms), and an imidazole adduct-type curing accelerator (C), wherein the molar ratio of the content of a phenolic hydroxide group to the content of an epoxy group in the epoxy resin composition is 0.25 to 0.67.

First claim

The invention claimed is:

1. An epoxy resin composition, comprising:
an epoxy resin (A);
a curing agent (B) comprising a compound represented by the following formula (B-1):

wherein R 1 represents a hydrogen atom, a halogen atom, a methoxy group or a hydrocarbon group having 1 to 12 carbon atoms; and
an imidazole adduct curing accelerator (C), wherein the imidazole adduct curing accelerator (C) is a polymeric compound obtained by reacting an imidazole compound with an adding substance selected from the group consisting of isocyanate compounds, (meth)acrylic compounds and urea compounds;
wherein a molar ratio of a content of a phenolic hydroxide group to a content of an epoxy group in the epoxy resin composition is 0.25 to 0.67.

2. The epoxy resin composition according to claim 1 , wherein the epoxy resin (A) comprises an epoxy resin having two epoxy groups in one molecule.

3. The epoxy resin composition according to claim 1 , wherein the compound represented by formula (B-1) has a melting point of 150° C. or less.

4. The epoxy resin composition according to claim 1 , wherein the molar ratio is 0.35 to 0.5.

5. The epoxy resin composition according to claim 1 , wherein the curing agent (B) further comprises a compound represented by the following formula (B-2):

wherein R 2 represents a hydrogen atom, a halogen atom, a methyl group or a methoxy group.

6. A cured product of an epoxy resin composition according to claim 1 .

7. A prepreg, comprising an epoxy resin composition according to claim 1 , and a fiber.

8. A composition, comprising a cured product of an epoxy resin composition according to claim 1 , and a fiber.

9. The epoxy resin composition of claim 1 consisting of the epoxy resin (A); the curing agent (B) and the imidazole adduct curing accelerator (C).

10. The epoxy resin composition of claim 1 consisting of the epoxy resin (A); the curing agent (B), the imidazole adduct accelerator (C) and rubber particles.

Assignees

• Sumitomo Chemical Co

Inventors

• Kato Hirofumi
• Takeuchi Kenichi

Classifications

• C08J5/249

  characterised by the additives used in the prepolymer mixture · CPC title

• C08J2363/02

  Polyglycidyl ethers of bis-phenols · CPC title

• C08G59/686

  containing nitrogen · CPC title

• C08G59/621 Primary

  Phenols · CPC title

• C08G59/4007

  Curing agents not provided for by the groups C08G59/42 - C08G59/66 · CPC title