Cooling apparatus

Patent metadata

Field	Value
Publication number	US-12041748-B2
Application number	US-201817259071-A
Country	US
Kind code	B2
Filing date	Jul 9, 2018
Priority date	Jul 9, 2018
Publication date	Jul 16, 2024
Grant date	Jul 16, 2024

Abstract

A cooling apparatus includes: a plurality of cooling units each including a plurality of tube main bodies and a plurality of headers, each tube main body defining a cooling flow path that passes through an inside of the tube main body, and each header being disposed at both sides of the tube main body and vertically assembled based on the plurality of tube main bodies being stacked to thereby connect the cooling flow paths, a double-sided chip module disposed between at least two cooling units, and a heat-radiating adhesion portion attaching the double-sided chip module to the cooling unit. A set distance between the cooling unit and the double-sided chip module is maintained based on the plurality of headers being vertically assembled in contact with each other and equal to or less than a thickness of the heat-radiating adhesion portion.

First claim

The invention claimed is:

1. A cooling apparatus, comprising:
a first cooling unit comprising (i) a first tube main body that defines a first cooling flow path configured to carry a cooling water and (ii) a pair of first headers coupled to both ends of the first tube main body, respectively;
a second cooling unit comprising (i) a second tube main body that is stacked on the first tube main body and defines a second cooling flow path configured to carry the cooling water and (ii) a pair of second headers stacked on the pair of first headers and coupled to both ends of the second tube main body, respectively, wherein the second cooling flow path is connected to the first cooling flow path via the pair of second headers and the pair of first headers;
a double-sided chip module disposed between the first tube main body and the second tube main body, the double-sided chip module having (i) a first surface facing the first tube main body and (ii) a second surface facing the second tube main body;
a first heat-radiating adhesion portion configured to attach the first surface of the double-sided chip module to the first tube main body;
a second heat-radiating adhesion portion configured to attach the second surface to the second tube main body;
a pair of end plates disposed on the pair of second headers, respectively;
a pair of first fastening members that pass through the pair of end plates and the pair of second headers and are fastened to the pair of first headers, respectively, the pair of first fastening members being configured to press the pair of end plates and the pair of first headers toward the pair of second headers, respectively;
a first main body that supports the first cooling unit;
a second main body disposed on the second tube main body; and
a second fastening member that passes through the second main body and is fastened to the first main body, the second fastening member being configured to press the first main body and the second main body toward the first and second cooling units,
wherein the second fastening member is disposed between the pair of first fastening members, and
wherein the first and second heat-radiating adhesion portions are compressed between the first tube main body and the second tube main body.

2. The cooling apparatus of claim 1 , wherein each of the first and second tube main bodies is extruded and comprises a plurality of uniform cross-section cooling flow paths that are spaced apart from each other by a same distance and having a horizontal arrangement.

3. The cooling apparatus of claim 2 , wherein a cross-section of each of the plurality of uniform cross-section cooling flow paths has an area that is smaller than a cross-sectional area of each of side flow paths defined at the both ends of the first tube main body.

4. The cooling apparatus of claim 2 , wherein a cross-section of each of the plurality of uniform cross-section cooling flow paths defines an elongated slit hole that extends in a height direction of the first tube main body.

5. The cooling apparatus of claim 1 ,
wherein the double-sided chip module is one of a plurality of double-sided chip modules, and
wherein the plurality of double-sided chip modules are spaced apart from each other by a predetermined distance along a longitudinal direction of the first tube main body.

6. The cooling apparatus of claim 5 , wherein at least one sealing material is inserted between the first and second headers.

7. The cooling apparatus of claim 6 , wherein the at least one sealing material comprises an O-ring inserted between the first and second headers, and
wherein the O-ring has a filling rate of 60 to 90% and a compression rate of 8 to 30%.

8. The cooling apparatus of claim 1 ,
wherein the pair of first fastening members comprise a fastening bolt configured to fix the pair of end plate to the first and second headers.

9. The cooling apparatus of claim 1 , further comprising:
a third cooling unit disposed between the first and second cooling units, the third cooling unit comprising (i) a third tube main body that defines a third cooling flow path configured to carry the cooling water and (ii) a pair of third headers coupled to both ends of the third tube main body,
wherein the third tube main body are disposed between the first and second tube main bodies,
wherein the pair of third headers are disposed between the pair of first headers and the pair of second headers, and
wherein the third cooling flow path is connected with the first and second cooling flow paths via the pair of third headers, the pair of second headers, and the pair of first headers.

10. The cooling apparatus of claim 9 , wherein the double-sided chip module comprises:
a plurality of first double-sided chip modules that are disposed between the first and second cooling units, that are attached to the first and second cooling units, and that are spaced apart from each other in a horizontal direction; and
a plurality of second double-sided chip modules that are disposed between the second and third cooling units, that are attached to the second and third cooling units and that are spaced apart from each other in the horizontal direction.

11. The cooling apparatus of claim 10 , wherein each of the first double-sided chip modules and the second double-sided chip modules comprise three double-sided chip modules that are spaced apart from each other by a predetermined distance in the horizontal direction.

12. The cooling apparatus of claim 9 ,
wherein one of the pair of first headers is configured to receive the cooling water, and the other one of the pair of first header is configured to discharge the cooling water.

13. The cooling apparatus of claim 12 ,
wherein at least one O-ring is disposed at assembly portions among the first header, the second header, and the third header.

14. The cooling apparatus of claim 1 ,
wherein the second fastening member is spaced apart from the double-sided chip module.

15. The cooling apparatus of claim 14 , wherein the second fastening member is one of second fastening members,
wherein the first main body defines protrusions into which the second fastening members are inserted to be coupled to the second main body, and
wherein the protrusions are spaced apart from the double-sided chip module and protrude by a predetermined length toward both ends of the first main body in a width direction.

16. The cooling apparatus of claim 1 , wherein the first header comprises an insertion groove into which a first end of the first tube main body is inserted to assemble the first tube main body and the first header.

17. The cooling apparatus of claim 16 , wherein a first contact portion between the insertion groove and the first tube main body is braze-joined.

18. The cooling apparatus of claim 17 ,
wherein a second contact portion between the second header and the end plate is braze-joined.

19. The cooling apparatus of claim 2 , wherein a distance between the plurality of uniform cross-section cooling flow paths and side flow paths defined at the both ends of the first tube main body is different from the distance between the plurality of uniform cross-section cooling flow paths.

20. The cooling apparatus of claim 13 , wherein the at least one O-ring is configured to provide sealing between the first header, the second header, and the third header.

Assignees

• Lg Magna E Powertrain Co Ltd
• Lg Electronics Inc

Inventors

• Kang Myeon Gyu
• Kim Yong Sik
• Cho Namjoon

Classifications

• F28F9/0224

  Header boxes formed by sealing end plates into covers (F28F9/0221 takes precedence) · CPC title

• F28F9/0131

  formed by plates (F28F9/0138 takes precedence) · CPC title

• F28F9/18

  by welding · CPC title

• F28F1/022

  with multiple channels · CPC title

• F28F2230/00

  Sealing means · CPC title