Component carrier with low-solvent fiber-free dielectric layer

Patent metadata

Field	Value
Publication number	US-12041730-B2
Application number	US-202117446741-A
Country	US
Kind code	B2
Filing date	Sep 2, 2021
Priority date	Sep 4, 2020
Publication date	Jul 16, 2024
Grant date	Jul 16, 2024

Abstract

A method of manufacturing a component carrier is described. The method includes forming a stack with at least one electrically conductive layer structure and at least one electrically insulating layer structure, and reducing an amount of solvent in a fiber-free dielectric layer, which is directly connected to a metal layer, so that the dielectric layer with reduced amount of solvent remains at least partially uncured.

First claim

The invention claimed is:

1. A method of manufacturing a plate-shaped component carrier, wherein the plate-shaped component carrier is configured as one of a group consisting of a printed circuit board, an IC substrate, and an interposer, the method comprising:
forming a stack comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure, wherein the layer structures are provided in a plate form;
reducing an amount of solvent in a fiber-free dielectric layer by pre-heating the fiber-free dielectric layer, which is directly connected to a metal layer, in such a way that the dielectric layer with a reduced amount of solvent remains at least partially uncured, and
thereafter, in a separate manufacturing stage, laminating the fiber-free dielectric layer together with the metal layer to the stack by at least partially curing the dielectric layer.

2. The method according to claim 1 , wherein the pre-heating comprises pre-heating the fiber-free dielectric layer up to a temperature in a range from 60° C. to 160° C.

3. The method according to claim 1 , wherein the pre-heating comprises pre-heating the fiber-free dielectric layer for a preheating time in a range from 5 minutes to 20 minutes.

4. The method according to claim 1 , wherein the pre-heating comprises pre-heating the fiber-free dielectric layer to an elevated temperature above ambient temperature but below the glass transition temperature of resin of the fiber-free dielectric layer.

5. The method according to claim 1 , wherein the method comprises reducing the amount of solvent in the fiber-free dielectric layer by applying a negative pressure.

6. The method according to claim 1 , wherein the method comprises only partially curing the fiber-free dielectric layer during the reducing of the amount of solvent.

7. The method according to claim 1 , wherein the method comprises fully curing the fiber-free dielectric layer by the laminating.

8. The method according to claim 1 , wherein the method comprises laminating the fiber-free dielectric layer to the stack at a temperature of at least 180° C.

9. The method according to claim 1 , wherein the method comprises
after laminating the fiber-free dielectric layer to the stack,
post-heating the fiber-free dielectric layer, the metal layer, and the stack up to a temperature in a range from 120° C. to 260° C.

10. The method according to claim 1 , wherein the method comprises
reducing the amount of solvent of the fiber-free dielectric layer before the laminating up to less than 1.5 weight percent in relation to the overall weight of the fiber-free dielectric layer.

11. The method according to claim 1 , wherein the method comprises further reducing the amount of solvent of the fiber-free dielectric layer by the laminating up to less than 0.15 weight percent in relation to the overall weight of the fiber-free dielectric layer.

12. The method according to claim 1 , further comprising at least one of the following features:
wherein the fiber-free dielectric layer and the metal layer form a double layer;
wherein the reduced amount of solvent is homogeneously distributed over the dielectric layer.

13. The method according to claim 1 , wherein the metal layer directly connected to the fiber-free dielectric layer is a continuous metal layer when reducing the amount of solvent.

14. The method according to claim 13 , wherein the method comprises patterning or removing the continuous metal layer after the laminating.

Assignees

• At & S Austria Tech & Systemtechnik Ag
• At&Saustria Tech & Systemtechnik Ag

Inventors

• Tay Seok Kim
• Tuominen Mikael
• Liu Kim

Classifications

• H10W70/685

  comprising multiple insulating layers · CPC title

• H10W70/05 Primary

  of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04) · CPC title

• H10W70/6875 Primary

  being on a metallic substrate, e.g. insulated metal substrates [IMS] · CPC title

• H05K2203/111

  Preheating, e.g. before soldering · CPC title

• H05K1/185

  associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards · CPC title