Heat dissipation apparatus, circuit board, and electronic device

Patent metadata

Field	Value
Publication number	US-12041710-B2
Application number	US-202117451995-A
Country	US
Kind code	B2
Filing date	Oct 22, 2021
Priority date	Apr 25, 2019
Publication date	Jul 16, 2024
Grant date	Jul 16, 2024

Abstract

A heat dissipation apparatus is provided. The heat dissipation apparatus includes a thermally conductive housing. The heat dissipation apparatus is connectable to a chip so that the chip is arrangeable on a chip placement region of the thermally conductive housing. A capillary structure is disposed on the thermally conductive housing and a working medium is placed in the capillary structure. The capillary structure includes a first capillary structure and a second capillary structure that are connected, and a maximum thickness of the first capillary structure is less than a minimum thickness of the second capillary structure.

First claim

What is claimed is:

1. A heat dissipation apparatus comprising:
a thermally conductive housing comprising:
a vacuum cavity in the thermally conductive housing;
a chip placement region on a first surface of the thermally conductive housing;
a condensation-side capillary structure connected to a first inner wall of the thermally conductive housing;
an evaporation-side capillary structure comprising a first capillary structure connected to a second capillary structure,
wherein the first capillary structure and the second capillary structure are fixedly connected to a second inner wall of the thermally conductive housing,
wherein the first inner wall is opposite to the second inner wall,
wherein the condensation-side capillary structure and the evaporation-side capillary structure are spaced apart,
wherein the first capillary structure is located on a side close to the first surface,
wherein a vertical projection of the first capillary structure on the first surface covering at least a part of a vertical projection of the chip placement region on the first surface, and
wherein a maximum thickness of the first capillary structure is less than a minimum thickness of the second capillary structure; and
a working medium placed in the evaporation-side capillary structure.

2. The heat dissipation apparatus according to claim 1 , wherein the first capillary structure and the second capillary structure are porous structures, and wherein a pore of the first capillary structure is connected to a pore of the second capillary structure.

3. The heat dissipation apparatus according to claim 2 , wherein a diameter of the pore of the first capillary structure is less than or equal to a diameter of the pore of the second capillary structure.

4. The heat dissipation apparatus according to claim 3 , wherein the first capillary structure and the second capillary structure are connected through sintering.

5. The heat dissipation apparatus according to claim 4 , wherein the porous structures are formed by sintering metal powder or a metal mesh.

6. The heat dissipation apparatus according to claim 5 , wherein a diameter of metal powder used for the first capillary structure is less than or equal to a diameter of metal powder used for the second capillary structure.

7. The heat dissipation apparatus according to claim 5 , wherein the second capillary structure is the metal mesh and the first capillary structure is a porous structure formed by sintering the metal powder, or wherein the second capillary structure is a porous structure formed by sintering the metal powder and the first capillary structure is the metal mesh.

8. The heat dissipation apparatus according to claim 1 , further comprising a heat sink, wherein the thermally conductive housing has a second surface opposite to the first surface, and wherein the heat sink is fastened on the second surface and is connected to the thermally conductive housing in a thermally conductive manner.

9. The heat dissipation apparatus according to claim 1 , wherein an area of the vertical projection of the first capillary structure on the first surface is 70% to 130% of an area of the vertical projection of the chip placement region on the first surface.

10. The heat dissipation apparatus according to claim 1 , wherein a thickness of the first capillary structure is 10% to 90% of a thickness of the second capillary structure.

11. The heat dissipation apparatus according to any one of claim 1 , wherein there is at least one chip placement region and at least one first capillary structure, and wherein the first capillary structure is in a one-to-one correspondence with the chip placement region.

12. An electronic device comprising:
an electronic device housing;
a circuit board disposed in the electronic device housing, wherein the circuit board comprises a circuit board body and a chip disposed on the circuit board body; and
a heat dissipation apparatus, wherein the chip is connected to a chip placement region of the heat dissipation apparatus in a thermally conductive manner, the heat dissipation apparatus comprising:
a thermally conductive housing comprising:
a vacuum cavity in the thermally conductive housing;
the chip placement region on a first surface of the thermally conductive housing;
a condensation-side capillary structure connected to a first inner wall of the thermally conductive housing;
an evaporation-side capillary structure comprising a first capillary structure connected to a second capillary structure,
wherein the first capillary structure and the second capillary structure are fixedly connected to a second inner wall of the thermally conductive housing,
wherein the first inner wall is opposite to the second inner wall,
wherein the condensation-side capillary structure and the evaporation-side capillary structure are spaced apart,
wherein the first capillary structure is located on a side close to the first surface,
wherein a vertical projection of the first capillary structure on the first surface covers at least a part of a vertical projection of the chip placement region on the first surface, and wherein a maximum thickness of the first capillary structure is less than a minimum thickness of the second capillary structure; and
a working medium placed in the evaporation-side capillary structure.

13. The electronic device according to claim 12 , wherein the first capillary structure and the second capillary structure are porous structures, and wherein a pore of the first capillary structure is connected to a pore of the second capillary structure.

14. The electronic device according to claim 13 , wherein a diameter of the pore of the first capillary structure is less than or equal to a diameter of the pore of the second capillary structure.

15. The electronic device according to claim 14 , wherein the first capillary structure and the second capillary structure are connected through sintering.

16. The electronic device according to claim 15 , wherein the porous structures are formed by sintering metal powder or a metal mesh.

17. The electronic device according to claim 16 , wherein a diameter of metal powder used for the first capillary structure is less than or equal to a diameter of metal powder used for the second capillary structure.

18. The electronic device according to claim 16 , wherein the second capillary structure is the metal mesh and the first capillary structure is a porous structure formed by sintering the metal powder, or wherein the second capillary structure is a porous structure formed by sintering the metal powder and the first capillary structure is the metal mesh.

19. The electronic device according to claim 12 ,
wherein the thermally conductive housing has a second surface opposite to the first surface,
wherein the heat dissipation apparatus further comprises a heat sink, and
wherein the heat sink is fastened on the second surface and is connected to the thermally conductive housing in a thermally conductive manner.

20. The electronic device according to claim 12 , wherein an area of the vertical projection of the first capillary structure on the first surface is 70% to 130% of an area of the vertical projection of the chip placement region on the first surface.

Assignees

• Huawei Tech Co Ltd

Inventors

• Sun Zhen
• Lu Zhen
• Hong Yuping

Classifications

• H10W40/73 Primary

  for cooling by change of state · CPC title

• H05K7/20336

  Heat pipes, e.g. wicks or capillary pumps · CPC title

• Y02P70/50

  Manufacturing or production processes characterised by the final manufactured product · CPC title

• H05K1/181

  associated with surface mounted components · CPC title

• H05K1/0203 Primary

  Cooling of mounted components (H05K1/0272 takes precedence) · CPC title