Electronic headset device capable of receiving radio signal, and electronic device connected therewith

Patent metadata

Field	Value
Publication number	US-12041409-B2
Application number	US-202217683661-A
Country	US
Kind code	B2
Filing date	Mar 1, 2022
Priority date	Sep 18, 2019
Publication date	Jul 16, 2024
Grant date	Jul 16, 2024

Abstract

An electronic headset device, comprising a headset housing; a speaker disposed inside the headset housing; a connector for connecting with an external electronic device; an audio IC module electrically connected with the connector and configured to convert a digital audio signal into an analogue audio signal; a connection line for electrically connecting the speaker with the audio IC module; a radio IC module disposed on the path of the connection line and electrically connected to the connection line; and a radio antenna connected to the radio IC module, wherein the radio IC module may be configured to use the radio antenna to receive a radio signal.

First claim

What is claimed is:

1. A headset electronic device comprising:
a headset housing;
a speaker disposed inside the headset housing;
a connector configured to detachably form an electrical connection with an external electronic device;
an audio IC module electrically connected to the connector and configured to convert a digital audio signal received from the external electronic device through the connector into an analog audio signal;
a connection line electrically connecting the audio IC module and the speaker;
a radio IC module arranged along the connection line and electrically connected to the connection line; and
a radio antenna connected to the radio IC module and configured to receive a radio signal.

2. The headset electronic device of claim 1 , wherein the radio IC module is spaced apart from the audio IC module.

3. The headset electronic device of claim 1 , wherein the connection line includes a
first line connecting the radio IC module and the speaker, and a second line connecting the radio IC module and the audio IC module.

4. The headset electronic device of claim 3 , wherein the radio antenna is embedded
in at least one of the first line and the second line of the connection line.

5. The headset electronic device of claim 3 ,
wherein the audio IC module further includes a noise blocking circuit configured to block radio-frequency (RF) noise; and
wherein the radio antenna embedded in the second line of the connection line is connected to the noise blocking circuit.

6. The headset electronic device of claim 1 , wherein the radio IC module is configured to receive a radio control signal through the connector and the connection line, and process the radio signal based on the radio control signal.

7. The headset electronic device of claim 6 , wherein the radio control signal received by
the radio IC module includes at least one of a volume control signal and a radio channel selection signal.

8. The headset electronic device of claim 1 , wherein the connector includes a universal serial bus (USB) Type-C connector.

9. The headset electronic device of claim 1 , wherein the connector and the audio IC module is included in one printed circuit board (PCB).

10. The headset electronic device of claim 1 , wherein, the radio IC module further includes a speaker bypass through which the analog audio signal passes for direct transmission from the audio IC module to the speaker.

11. The headset electronic device of claim 1 , wherein the radio IC module is configured to process the radio signal received through the radio antenna into a digital radio signal and transmit the digital radio signal to the external electronic device through the connection line and the connector.

12. The headset electronic device of claim 1 , wherein:
the audio IC module and the radio IC module are included in a single printed circuit board (PCB); and
a noise blocking circuit is arranged between and electrically connected to the audio IC module and the radio IC module configured to minimize noise interference between the audio IC module and the radio IC module.

13. An electronic device comprising:
a processor; and
a connector electrically connected to the processor, the connector configured to be detachably fastened to a connector of a headset electronic device so as to interconnect the headset electronic device and the electronic device and provide a digital audio signal to the connector of the headset electronic device, and
wherein the processor is configured to transmit a control signal to a radio IC module of the headset electronic device through the connector of the electronic device.

14. The electronic device of claim 13 , wherein the control signal transmitted by the processor to the radio IC module of the headset electronic device includes at least one of a volume control signal, a radio channel selection signal, and a radio operation signal.

15. The electronic device of claim 13 , further comprising:
an embedded speaker to output a sound; and
an audio IC module electrically connected to the embedded speaker;
wherein the processor is further configured to receive, through the connector of the electronic device, a digital audio signal processed by the radio IC module of the headset electronic device, and transmit the digital audio signal to the audio IC module of the headset electronic device, and
wherein the audio IC module is configured to convert the digital audio signal into an analog audio signal and transmit the analog audio signal to the embedded speaker.

16. The headset electronic device of claim 1 , wherein the radio IC module is configured to process a radio signal from the radio antenna into an analog audio signal, and wherein the audio IC module is configured to convert the analog audio signal to a digital audio signal, and wherein the connector is configured to provide the digital audio signal to the external electronic device.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Nam Janghyun
• Yang Dongil
• Na Hyoseok
• Wang Gyesung
• Lee Wonho

Classifications

• H04R2420/09

  Applications of special connectors, e.g. USB, XLR, in loudspeakers, microphones or headphones · CPC title

• H04R2420/07

  Applications of wireless loudspeakers or wireless microphones · CPC title

• H04R1/1091 Primary

  Details not provided for in groups H04R1/1008 - H04R1/1083 · CPC title

• H04R1/1075

  Mountings of transducers in earphones or headphones · CPC title

• H04B1/10 Primary

  Means associated with receiver for limiting or suppressing noise or interference · CPC title