Optical component packaging structure
US-11495697-B2 · Nov 8, 2022 · US
Far-infrared sensor packaging structure
US12040416B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12040416-B2 |
| Application number | US-202217955854-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 29, 2022 |
| Priority date | Nov 2, 2016 |
| Publication date | Jul 16, 2024 |
| Grant date | Jul 16, 2024 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
An optical component packaging structure is provided. The optical component packaging structure includes a substrate, a far-infrared sensor chip, a metal covering cap and a light filter. The far-infrared sensor chip is disposed on the substrate and electrically connected to the substrate. The metal covering cap is disposed on the substrate and accommodating the far-infrared sensor chip. The metal covering cap has an opening exposing the far-infrared sensor chip. The light filter is disposed out of the opening and on the inner surface for covering the opening to filter the far-infrared light passing through. The far-infrared sensor chip is surrounded by the metal covering cap, the substrate and the light filter, and the metal covering cap is directly connected with the substrate.
First claim
Opening claim text (preview).
What is claimed is: 1. A far-infrared sensor packaging structure, comprising: a substrate; a far-infrared sensor chip disposed on the substrate and electrically connected to the substrate; a metal covering cap disposed on the substrate and accommodating the far-infrared sensor chip, the metal covering cap having an opening exposing the far-infrared sensor chip; and a light filter disposed out of the opening and on an inner surface of the metal covering cap for covering the opening to filter the far-infrared light passing through, wherein the far-infrared sensor chip is only surrounded by the metal covering cap, the substrate and the light filter, and the metal covering cap is directly connected with the substrate; wherein the inner surface of the metal covering cap and the substrate include an angle, and the angle is less than 90 degrees. 2. The far-infrared sensor packaging structure as claimed in claim 1 , wherein the far-infrared sensor chip is selected from a group consisting of thermopile, pyroelectric element and thermosensitive element. 3. The far-infrared sensor packaging structure as claimed in claim 1 , wherein the metal covering cap further includes a light transmission member disposed at the opening.
Assignees
Inventors
Classifications
Radiation pyrometry, e.g. infrared or optical thermometry · CPC title
for shielding light, e.g. light blocking layers or cold shields for infrared detectors · CPC title
Arrangements for cooling, heating, ventilating or compensating for temperature fluctuations · CPC title
Constructional details of image sensors · CPC title
comprising amorphous semiconductors · CPC title
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Frequently asked questions
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- What does patent US12040416B2 cover?
- An optical component packaging structure is provided. The optical component packaging structure includes a substrate, a far-infrared sensor chip, a metal covering cap and a light filter. The far-infrared sensor chip is disposed on the substrate and electrically connected to the substrate. The metal covering cap is disposed on the substrate and accommodating the far-infrared sensor chip. The met…
- Who is the assignee on this patent?
- Pixart Imaging Inc
- What technology area does this patent fall under?
- Primary CPC classification H10F77/50. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jul 16 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).