Circuit protection device with PTC device and backup fuse

Patent metadata

Field	Value
Publication number	US-12040109-B2
Application number	US-202017779007-A
Country	US
Kind code	B2
Filing date	Nov 13, 2020
Priority date	Nov 21, 2019
Publication date	Jul 16, 2024
Grant date	Jul 16, 2024

Abstract

A circuit protection device including a positive temperature coefficient (PTC) device and a backup fuse electrically connected in series with one another, the backup fuse comprising a quantity of solder disposed on a dielectric chip and having a melting temperature that is higher than a trip temperature of the PTC device, wherein the a surface of the dielectric chip exhibits a de-wetting characteristic relative to the solder such that, when the solder is melted, the solder draws away from the surface to create a galvanic opening in the backup fuse.

First claim

The invention claimed is:

1. A circuit protection device comprising a positive temperature coefficient (PTC) device and a backup fuse electrically connected in series with one another, the backup fuse comprising a quantity of solder disposed on a dielectric chip and having a melting temperature that is higher than a trip temperature of the PTC device, wherein the a surface of the dielectric chip exhibits a de-wetting characteristic relative to the solder such that, when the solder is melted, the solder draws away from the surface to create a galvanic opening in the backup fuse, wherein the dielectric chip is fastened to an electrode of the PTC device by a thermally conductive medium.

2. The circuit protection device of claim 1 , wherein the thermally conductive medium is a thermally conductive paste.

3. The circuit protection device of claim 1 , wherein the solder is SAC305 solder and the dielectric surface is formed of perfluoroalkoxy.

4. The circuit protection device of claim 1 , wherein the solder is eutectic solder and the dielectric surface is formed of ethylene tetrafluoroethylene.

5. The circuit protection device of claim 1 , wherein the solder is high melt solder and the dielectric surface is formed of polyvinylidene fluoride.

6. The circuit protection device of claim 1 , wherein the backup fuse is connected to a first electrode of the PTC device by a lead, the circuit protection device further comprising a first lead wire electrically connected to the backup fuse and a second lead wire electrically connected to a second electrode of the PTC device, wherein the first lead wire and the second lead wire facilitate electrical connection of the circuit protection device within a circuit.

7. The circuit protection device of claim 6 , further comprising first and second mesh contacts at the juncture of the first lead wire and the backup fuse and the juncture of the second lead wire and the backup fuse, respectively.

8. The circuit protection device of claim 1 , wherein the backup fuse has a melting temperature that is in a range of 1 degree Celsius to 200 degrees Celsius higher than a normal trip temperature range of the PTC device.

9. The circuit protection device of claim 1 , wherein the backup fuse has a melting temperature that is above a normal trip temperature range of the PTC device.

10. The circuit protection device of claim 1 , further comprising a dielectric passivation layer covering the backup fuse.

11. The circuit protection device of claim 10 , wherein the dielectric passivation layer exhibits a de-wetting characteristic relative to the solder such that, when the solder is melted, the solder draws away from the dielectric passivation layer to create a galvanic opening in the backup fuse.

12. A circuit protection device comprising a positive temperature coefficient (PTC) device and a backup fuse electrically connected in series with one another, the backup fuse comprising a cartridge fuse having a fusible element with a melting temperature that is higher than a trip temperature of the PTC device, wherein a fuse body of the cartridge fuse exhibits a de-wetting characteristic relative to the fusible element such that, when the fusible element is melted, the fusible element draws away from a surface of the fuse body to create a galvanic opening in the fusible element.

13. The circuit protection device of claim 12 , wherein the cartridge fuse is fastened to the PTC device.

14. The circuit protection device of claim 13 , wherein the cartridge fuse is fastened to an electrode of the PTC device by a thermally conductive medium.

15. The circuit protection device of claim 14 , wherein the thermally conductive medium is a thermally conductive paste.

16. The circuit protection device of claim 12 , wherein the backup fuse is connected to a first electrode of the PTC device by a lead, the circuit protection device further comprising a first lead wire electrically connected to the cartridge fuse and a second lead wire electrically connected to a second electrode of the PTC device, wherein the first lead wire and the second lead wire facilitate electrical connection of the circuit protection device within a circuit.

17. The circuit protection device of claim 12 , wherein the fusible element has a melting temperature that is in a range of 1 degree Celsius to 200 degrees Celsius higher than a normal trip temperature range of the PTC device.

18. The circuit protection device of claim 12 , wherein the fusible element has a melting temperature that is above a normal trip temperature range of the PTC device.

Assignees

• Littelfuse Inc

Inventors

• Matus Yuriy Borisovich
• Pineda Martin G
• Fuentes Sergio

Classifications

• H01H2085/0483

  with temperature dependent resistor, e.g. thermistor · CPC title

• H01H85/048

  Fuse resistors · CPC title

• H01H85/0241 Primary

  Structural association of a fuse and another component or apparatus (switches with built-in fuses H01H9/10, spark-gap arresters H01H85/44, transformers and inductances H01F27/402, capacitors H01G2/14, lamps H01K1/66, semiconductors H10W20/493 or H10W42/80) · CPC title

• H01C1/1406

  Terminals or electrodes formed on resistive elements having positive temperature coefficient · CPC title

• H01C1/08

  Cooling, heating or ventilating arrangements · CPC title