Signal processing for segmented thin-film acoustic imaging systems for portable electronic devices

Patent metadata

Field	Value
Publication number	US-12039800-B2
Application number	US-202217709235-A
Country	US
Kind code	B2
Filing date	Mar 30, 2022
Priority date	Mar 31, 2021
Publication date	Jul 16, 2024
Grant date	Jul 16, 2024

Abstract

An acoustic imaging system coupled to an acoustic medium to define an imaging surface. The acoustic imaging system includes an array of piezoelectric acoustic transducers formed at least in part from a thin-film piezoelectric material, such as PVDF. The array is coupled to the acoustic medium opposite the imaging surface and formed using a thin-film manufacturing process over an application-specific integrated circuit that, in turn, is configured to leverage the array of piezoelectric actuators to generate an image of an object at least partially wetting to the imaging surface.

First claim

What is claimed is:

1. An acoustic imaging system comprising:
a first electrode layer defining an array of electrodes conductively decoupled from one another;
a thin-film piezoelectric layer below the first electrode layer;
a second electrode layer below the thin-film piezoelectric layer; and
an integrated circuit formed below the second electrode layer, the integrated circuit conductively coupled to the first electrode layer and the second electrode layer and configured to receive an electrical signal corresponding to a potential difference between at least one of the electrodes of the first electrode layer and the second electrode layer, the integrated circuit and comprising:
a first amplifier stage configured to receive the electrical signal;
a band pass filter stage to receive a first amplified output of the first amplifier stage;
a rectifier stage to receive a filtered output of the band pass filter stage;
an integrator stage to receive:
a rectified output of the rectifier stage; and
a carrier offset signal;

a second amplifier stage configured to receive an integrated offset output of the integrator stage, the integrated offset output based at least in part on the rectified output and the carrier offset signal; and
an analog to digital converter configured to receive a second amplified output of the second amplifier stage, the analog to digital converter stage configured to output a digital value corresponding to the electrical signal.

2. The acoustic imaging system of claim 1 , wherein the electrical signal is an alternating current signal modulated over a carrier frequency.

3. The acoustic imaging system of claim 2 , wherein the carrier offset signal is configured to reduce carrier interference in the electrical signal.

4. The acoustic imaging system of claim 1 , wherein the thin-film piezoelectric layer is formed from PVDF.

5. The acoustic imaging system of claim 1 , wherein the thin-film piezoelectric layer is formed, at least in part, from TrFE.

6. The acoustic imaging system of claim 1 , wherein the thin-film piezoelectric layer is a monolithic layer.

7. The acoustic imaging system of claim 1 , wherein the integrated circuit comprises a low pass filter configured to filter the rectified output prior to the rectified output being received by the integrator stage.

8. The acoustic imaging system of claim 1 , wherein the first amplifier stage, the band pass filter stage, the rectifier stage, and the integrator stage conductively coupled to a subset of the array of electrodes of the first electrode layer.

9. The acoustic imaging system of claim 1 , wherein the second electrode layer defines a second array of electrodes, each aligned with a respective one electrode of the array of electrodes defined by the first layer.

10. An acoustic imaging system comprising:
an array of acoustic transducers, each defined by:
a portion of a shared thin-film piezoelectric layer;
a first electrode interfacing a first surface of the portion; and
a second electrode interfacing a second surface of the portion; wherein the array of acoustic transducers is segmented, each segment comprising:
a respective array of acoustic transducers arranged in a contiguous pattern;
an analog front end conductively coupled to each acoustic transducer of the respective array of acoustic transducers and comprising:
a first amplifier stage configured to receive an electrical signal generated by a respective one acoustic transducer of the respective array of acoustic transducers;
a band pass filter stage to receive a first amplified output of the first amplifier stage;
a rectifier stage to receive a filtered output of the band pass filter stage;
an integrator stage to receive:
a rectified output of the rectifier stage; and
a carrier offset signal; and

an integrated circuit coupled to each output of each respective analog front end, the integrated circuit comprising:
a second amplifier stage configured to receive each respective integrated offset output of each respective integrator stage; and
an analog to digital converter configured to receive an output of the second amplifier stage, the analog to digital converter stage configured to output a digital value corresponding to at least one respective electrical signal of at least one respective acoustic transducer of segment of the array of acoustic transducers.

11. The acoustic imaging system of claim 10 , wherein each segment of the array of acoustic transducers is positioned adjacent to at least one other segment of the array of acoustic transducers.

12. The acoustic imaging system of claim 10 , wherein each segment of the array of acoustic transducers has a rectangular shape.

13. The acoustic imaging system of claim 10 , wherein the array of acoustic transducers has a rectangular shape.

14. The acoustic imaging system of claim 13 , wherein an aspect ratio of the rectangular shape is greater than 2.

15. The acoustic imaging system of claim 10 , wherein the shared thin-film piezoelectric layer is formed, at least in part, from PVDF.

16. A method of signal processing in an acoustic imaging system, the method comprising:
receiving a voltage signal from an acoustic transducer of the acoustic imaging system;
amplifying the voltage signal with a first amplifier to output an amplified voltage signal;
filtering high-frequency content from the amplified voltage signal to output a filtered signal;
rectifying the filtered signal to output a rippled voltage signal;
integrating the rippled voltage signal to output an integrated signal;
offsetting the integrated signal by an offset to output an offset integrated signal;
amplifying the offset integrated signal to output an analog signal; and
converting the analog signal into a digital signal with an analog to digital converter.

17. The method of claim 16 , comprising filtering low-frequency content from the filtered signal prior to rectifying.

18. The method of claim 16 , comprising filtering high-frequency content from the rippled voltage signal prior to integrating the rippled voltage signal.

19. The method of claim 16 , further comprising, prior to receiving the voltage signal, applying a drive signal to the acoustic transducer.

20. The method of claim 16 , wherein the acoustic transducer is a thin-film acoustic transducer formed at least in part from PVDF.

Assignees

• Apple Inc

Inventors

• Franza Gordon S
• YEKE YAZDANDOOST Mohammad
• Setlak Dale
• Yip Marcus C
• Khajeh Ehsan
• Tucker Aaron S
• Joyce Andrew W
• King Brian M
• Gozzini Giovanni
• Griesbach Jason S
• Yang Henry H

Classifications

• G06F3/0436

  in which generating transducers and detecting transducers are attached to a single acoustic waves transmission substrate · CPC title

• G06F3/0433

  in which the acoustic waves are either generated by a movable member and propagated within a surface layer or propagated within a surface layer and captured by a movable member · CPC title

• B06B1/0215

  for generating pulses, e.g. bursts of oscillations, envelopes · CPC title

• B06B1/0692

  with a continuous electrode on one side and a plurality of electrodes on the other side · CPC title

• B06B2201/70

  Specific application · CPC title