Chemically amplified positive resist composition and resist pattern forming process
US-12164231-B2 · Dec 10, 2024 · US
US12038688B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12038688-B2 |
| Application number | US-202217898423-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 29, 2022 |
| Priority date | Aug 31, 2021 |
| Publication date | Jul 16, 2024 |
| Grant date | Jul 16, 2024 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
A composition with which a cured film having excellent light shielding properties and low reflection properties can be produced is provided; a light shielding film; a solid-state imaging element; an image display device; and a method for manufacturing a cured film. The composition including carbon black, barium sulfate, one or more kinds selected from the group consisting of copper phthalocyanine and a copper phthalocyanine derivative, a resin, and a solvent, in which the solvent includes a solvent A having a boiling point of 180° C. or higher, a solvent B having a boiling point of 140° C. or higher and lower than 180° ° C., and a solvent C having a boiling point of 100° C. or higher and lower than 140° C.
Opening claim text (preview).
What is claimed is: 1. A composition comprising: carbon black; barium sulfate; one or more kinds selected from the group consisting of copper phthalocyanine and a copper phthalocyanine derivative; a resin; and a solvent, wherein the solvent includes a solvent A having a boiling point of 180° C. or higher, a solvent B having a boiling point of 140° ° C. or higher and lower than 180° C., and a solvent C having a boiling point of 100° C. or higher and lower than 140° C.; and wherein a content of the solvent A is 5.0% to 15.0% by mass with respect to a total content of the solvent A, the solvent B, and the solvent C, a content of the solvent B is 70.0% to 90.0% by mass with respect to the total content of the solvent A, the solvent B, and the solvent C, and a content of the solvent C is 5.0% to 15.0% by mass with respect to the total content of the solvent A, the solvent B, and the solvent C. 2. The composition according to claim 1 , further comprising: a compound including an unsaturated double bond; and a polymerization initiator. 3. The composition according to claim 2 , wherein the polymerization initiator includes a compound represented by Formula (1), in Formula (1), R represents a group represented by Formula (1a), in Formula (1a), n represents an integer of 1 to 5, m represents an integer of 1 to 6, and * represents a bonding position. 4. The composition according to claim 1 , wherein a solubility parameter of the solvent A is 11.0 to 14.0 (cal/cm 3 ) 1/2 . 5. The composition according to claim 1 , wherein a solubility parameter of the solvent A is 12.0 to 13.0 (cal/cm 3 ) 1/2 . 6. The composition according to claim 1 , wherein the solvent A is one or more kinds selected from the group consisting of γ-butyrolactone, dimethyl sulfoxide, and benzyl alcohol, the solvent B is one or more kinds selected from the group consisting of propylene glycol monomethyl ether acetate and cyclohexanone, and the solvent C is one or more kinds selected from the group consisting of butyl acetate and ethyl butyrate. 7. The composition according to claim 1 , wherein the copper phthalocyanine derivative is a salt composed of copper phthalocyanine having a sulfonic acid group and dimethyldioctadecylammonium. 8. The composition according to claim 1 , wherein a content of the carbon black is 15% to 40% by mass with respect to a total solid content of the composition. 9. The composition according to claim 1 , further comprising: one or more kinds of metal-containing particles selected from the group consisting of a metal nitride and a metal oxynitride. 10. The composition according to claim 9 , wherein the metal-containing particles are a nitride or an oxynitride of one or more kinds of metals selected from the group consisting of titanium, zirconium, vanadium, and niobium. 11. The composition according to claim 1 , further comprising: a silicone-based surfactant. 12. The composition according to claim 11 , wherein the silicone-based surfactant is a surfactant having a phenyl group. 13. The composition according to claim 1 , wherein a content of a solid content is 10% to 40% by mass. 14. The composition according to claim 1 , wherein a content of water is 1.0% by mass or less with respect to a total mass of the composition. 15. The composition according to claim 1 , wherein the composition is a composition for forming a light shielding film. 16. A light shielding film comprising: a cured film formed from the composition according to claim 1 . 17. A solid-state imaging element comprising: a cured film formed from the composition according to claim 1 . 18. An image display device comprising: a cured film formed from the composition according to claim 1 . 19. A method for manufacturing a cured film, comprising: a composition layer forming step of forming a composition layer consisting of the composition according to claim 2 on a support; an exposure step of exposing the composition layer by irradiating the composition layer with an actinic ray or a radiation; and a development step of performing a development treatment on the composition layer after the exposure. 20. A composition comprising: carbon black; barium sulfate, wherein the primary particle diameter of the barium sulfate is 0.01 to 0.08 μm; one or more kinds selected from the group consisting of copper phthalocyanine and a copper phthalocyanine derivative; a resin; and a solvent, wherein the solvent includes a solvent A having a boiling point of 180° C. or higher, a solvent B having a boiling point of 140° ° C. or higher and lower than 180° C., and a solvent C having a boiling point of 100° C. or higher and lower than 140° C.
Image sensors · CPC title
Sulfonic acids; Derivatives thereof · CPC title
Complexes with metal-heteroatom-bonds · CPC title
Nitrogen-containing compounds · CPC title
of metals · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.