System and method for monitoring liquid adhesive flow

Patent metadata

Field	Value
Publication number	US-12038313-B2
Application number	US-202117335169-A
Country	US
Kind code	B2
Filing date	Jun 1, 2021
Priority date	Apr 4, 2016
Publication date	Jul 16, 2024
Grant date	Jul 16, 2024

Abstract

A hot melt adhesive system includes an adhesive supply for receiving solid or semi-solid hot melt adhesive, and a heater associated with the adhesive supply for melting the solid or semi-solid hot melt adhesive into liquid hot melt adhesive. An adhesive tracking system monitors an output of the liquid hot melt adhesive, and includes a flow meter having a flow inlet and a flow outlet. The flow meter measures an amount of the adhesive flowing out of the flow outlet. A product detector may be used to sense a presence of a product to which the adhesive is applied. A controller then determines the total amount of the liquid adhesive dispensed and the average amount of liquid adhesive dispensed per product.

First claim

What is claimed is:

1. A hot melt adhesive system, comprising:
an adhesive supply holding solid or semi-solid hot melt adhesive;
a heater associated with the adhesive supply for melting the solid or semi-solid hot melt adhesive into a liquid hot melt adhesive;
a first manifold in fluid communication with the adhesive supply;
a pump for pumping the liquid hot melt adhesive into the first manifold; and
an adhesive tracking system for monitoring an output of the liquid hot melt adhesive, wherein the adhesive tracking system includes a single flow meter that is configured to measure an amount of the liquid hot melt adhesive that flows from the first manifold,
wherein the flow meter is configured to receive hot melt adhesive from the first manifold and configured to discharge the hot melt adhesive back into the first manifold, and
wherein the flow meter is secured to the first manifold, downstream of the pump.

2. The hot melt adhesive system of claim 1 , wherein the flow meter is configured to measure an entirety of the hot melt adhesive that flows into or out of the first manifold.

3. The hot melt adhesive system of claim 2 , wherein the flow meter is mounted directly to the first manifold, downstream of the pump.

4. The hot melt adhesive system of claim 2 , wherein the flow meter is removable from the first manifold.

5. The hot melt adhesive system of claim 2 , wherein 1) a flow inlet of the flow meter is configured to directly receive the liquid hot melt adhesive from the first manifold, and/or 2) a flow outlet of the flow meter is configured to directly discharge the liquid hot melt adhesive into the first manifold.

6. The hot melt adhesive system of claim 2 , further comprising a plurality of adhesive applicators that are configured to receive the hot melt adhesive from the first manifold and configured to apply the liquid hot melt adhesive to a substrate, and wherein the flow meter measures all of the hot melt adhesive that is received by the plurality of adhesive applicators.

7. The hot melt adhesive system of claim 2 , wherein the flow meter comprises:
a pair of rotatable gears that are configured to rotate in an opposite direction relative to one another to create a positive displacement of hot melt adhesive through the flow meter; and
at least one sensor configured to measure a rotation of the pair of rotatable gears.

8. The hot melt adhesive system of claim 1 , wherein the adhesive tracking system further comprises:
a product detector configured to sense a presence of a product to which the adhesive is applied, to determine a parameter of the product, and to determine a product count,
wherein the adhesive tracking system is configured to associate, based on data that includes the determined parameter of the product and the product count, the measured amount of the adhesive flowing out of the flow meter with the sensed product, and the adhesive tracking system is configured to compare the associated amount of adhesive with a predetermined range to determine if the associated amount is outside the predetermined range.

9. The hot melt adhesive system of claim 1 , further comprising:
an air pressure regulator for regulating a flow of air into the pump from an air supply.

10. The hot melt adhesive system of claim 9 , wherein the air pressure regulator comprises a diaphragm style regulator.

11. The hot melt adhesive system of claim 1 , wherein the pump is the only pump that is configured to provide the liquid hot melt adhesive into the first manifold, wherein the single flow meter is downstream of the pump and comprises a flow inlet and a flow outlet, and wherein the flow inlet is configured to receive the liquid hot melt adhesive such that a flow rate of the liquid hot melt adhesive that is pumped out of the pump is equal to a flow rate of the liquid hot melt adhesive received by the flow inlet.

12. The hot melt adhesive system of claim 1 , further including a dispensing unit that includes the adhesive supply,
wherein the adhesive tracking system further comprises:
an auxiliary manifold in fluid communication with the dispensing unit;
the flow meter being in fluid communication with and mounted to the auxiliary manifold;
a product detector configured to sense a presence of a product to which the adhesive is applied; and
a controller in communication with the flow meter and the product detector, the controller having a processor configured to determine a total amount of the adhesive dispensed and an average amount of liquid adhesive dispensed per product.

13. The hot melt adhesive system of claim 1 , wherein the flow meter is mounted directly to the first manifold, downstream of the pump.

14. A hot melt adhesive system, comprising:
an adhesive supply holding solid or semi-solid hot melt adhesive;
a heater associated with the adhesive supply for melting the solid or semi-solid hot melt adhesive into a liquid hot melt adhesive;
a first manifold in fluid communication with the adhesive supply;
a pump for pumping the liquid hot melt adhesive into the first manifold;
an adhesive tracking system for monitoring an output of the liquid hot melt adhesive, wherein the adhesive tracking system includes a single flow meter that is configured to measure an amount of the liquid hot melt adhesive that flows from the first manifold; and
a dispensing unit that includes the adhesive supply,
wherein the adhesive tracking system further comprises:
an auxiliary manifold in fluid communication with the dispensing unit;
the flow meter being in fluid communication with and mounted to the auxiliary manifold;
a product detector configured to sense a presence of a product to which the adhesive is applied; and
a controller in communication with the flow meter and the product detector, the controller having a processor configured to determine a total amount of the adhesive dispensed and an average amount of liquid adhesive dispensed per product.

15. The hot melt adhesive system of claim 14 ,
wherein the auxiliary manifold is directly mounted to the dispensing unit; and
wherein the flow meter comprises a housing body having a hollow central recess.

16. The hot melt adhesive system of claim 14 , wherein the auxiliary manifold is remotely mounted to the dispensing unit.

17. The hot melt adhesive system of claim 14 , further comprising at least one hose, in fluid communication with the auxiliary manifold and at least one adhesive applicator, for transporting the liquid hot melt adhesive from the auxiliary manifold to the at least one adhesive applicator.

18. The hot melt adhesive system of claim 17 , wherein the flow meter is fitted to an end of the at least one hose at a location proximal the at least one adhesive applicator.

Assignees

• Nordson Corp

Inventors

• Fort Wesley C
• Ramspeck Ronald
• Ramosevac Enes

Classifications

• G05D16/06

  the sensing element being a flexible membrane, yielding to pressure, e.g. diaphragm, bellows, capsule · CPC title

• G01F15/185

  Connecting means, e.g. bypass conduits · CPC title

• C09J5/00

  Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers · CPC title

• B05C11/1044

  Apparatus or installations for supplying liquid or other fluent material to several applying apparatus or several dispensing outlets, e.g. to several extrusion nozzles · CPC title

• B05C11/1042

  provided with means for heating or cooling the liquid or other fluent material in the supplying means upstream of the applying apparatus · CPC title