Moving part, compressor, and manufacturing method thereof

US12038005B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12038005-B2
Application numberUS-202218081303-A
CountryUS
Kind codeB2
Filing dateDec 14, 2022
Priority dateFeb 10, 2022
Publication dateJul 16, 2024
Grant dateJul 16, 2024

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A moving part of a compressor, a compressor including the moving part, and a method of manufacturing the moving part, the moving part including a base material having a polished surface and including a steel material; an adhesive layer arranged on the polished surface; and a coating layer including diamond-like carbon. The adhesive layer may be arranged between the base material and the coating layer and bond the coating layer to the base material, and the base material may include an etching-processed area having a plurality of microgrooves (MG) extending in a downward direction into the base material from the polished surface.

First claim

Opening claim text (preview).

What is claimed is: 1. A moving part of a compressor, the moving part comprising: a base material having a polished surface and including a steel material; an adhesive layer arranged on the polished surface; and a coating layer including diamond-like carbon; wherein, the adhesive layer is arranged between the base material and the coating layer and bonds the coating layer to the base material, the base material includes an etching-processed area having a plurality of microgrooves (MG) extending in a downward direction into the base material from the polished surface, and the plurality of microgrooves extend under the adhesive layer, and penetrating into the etching-processed area. 2. The moving part of claim 1 , wherein a depth of the microgrooves ranges from 10 nm to 200 nm. 3. The moving part of claim 1 , wherein a wettability of the polished surface having the etching-process area has different characteristics than a wettability of a polished surface of the base material that does not include the etching-processed area. 4. The moving part of claim 1 , wherein, the base material includes stainless steel (SUS), a centerline average roughness (Ra) of the polished surface ranges from 0.03 μm to 0.1 μm, and a ten point average roughness (Rz) of the polished surface ranges from 0.3 μm to 2.0 μm. 5. The moving part of claim 1 , wherein the coating layer further includes silicon. 6. The moving part of claim 5 , wherein a concentration of the silicon in the coating layer is less than or equal to 5% such that an average friction coefficient of the coating layer is less than or equal to 0.06 in a section where a reciprocating friction number of the coating layer is less than or equal to 140,000. 7. The moving part of claim 6 , wherein the concentration of the silicon in the coating layer is less than or equal to 3% such that a fluctuation range of a friction coefficient of the coating layer is less than or equal to 0.03. 8. The moving part of claim 1 , wherein the coating layer includes at least one of chrome (Cr) or iron (Fe). 9. The moving part of claim 1 , wherein a thickness of the adhesive layer is less than a thickness of the coating layer. 10. The moving part of claim 1 , wherein, a thickness of the coating layer is 1.0 μm to 3.0 μm, and a thickness of the adhesive layer is 0.3 μm to 0.9 μm. 11. The moving part of claim 1 , wherein a hardness of the adhesive layer is less than each of a hardness of the base material and a hardness of the coating layer. 12. A compressor comprising: a compressing portion configured to compress a fluid and including a moving part which causes repetitive friction with at least one other component; a driving motor configured to drive the compressing portion; and a housing accommodating the compressing portion and the driving motor, wherein the moving part comprises: a base material having a polished surface and including a steel material; an adhesive layer arranged on the polished surface; and a coating layer including diamond-like carbon; wherein, the adhesive layer is arranged between the base material and the coating layer and bonds the coating layer to the base material, the base material includes an etching-processed area having a plurality of microgrooves (MG) extending in a downward direction into the base material from the polished surface, and the plurality of microgrooves extend under the adhesive layer, and penetrating into the etching-processed area. 13. A method of manufacturing a moving part, the method comprising: forming a polished surface by polishing a surface of a base material including a steel material; forming an etching-processed area including a plurality of microgrooves extending in a downward direction into the base material from the polished surface by performing an etching process on the polished surface; forming an adhesive layer on the etching-processed area so that the plurality of microgrooves extend under the adhesive layer, penetrating down into the etching-processed area; and forming a coating layer including diamond-like carbon on the adhesive layer. 14. The method of claim 13 , wherein, the base material includes stainless steel (SUS), a centerline average roughness (Ra) of the polished surface ranges from 0.03 μm to 0.1 μm, and a ten point average roughness (Rz) of the polished surface ranges from 0.3 μm to 2.0 μm. 15. The method of claim 13 , wherein the forming of the etching-processed area comprises: generating plasma by injecting argon gas into a chamber containing the base material and applying a certain voltage into the chamber; and forming a plurality of microgrooves having a depth of 10 nm to 200 nm from the polished surface of the base material by performing the etching process on the polished surface by the plasma. 16. The method of claim 13 , wherein the forming of the adhesive layer comprises depositing at least one metal material including at least one of chrome or iron on the etching-processed area. 17. The method of claim 13 , wherein the forming of the coating layer comprises ionizing a hydrocarbon gas by plasma discharge to form the coating layer on the surface of the adhesive layer. 18. The method of claim 13 , wherein the forming of the coating layer comprises forming the coating layer including diamond-like carbon and silicon on a surface of the adhesive layer by adding silicon. 19. The method of claim 13 , wherein, in the forming of the coating layer, a process temperature is greater than or equal to 100° C. and less than or equal to 300° C. 20. The method of claim 18 , wherein a concentration of the silicon in the coating layer is less than or equal to 3%.

Assignees

Inventors

Classifications

  • Carbon · CPC title

  • by means of bombardment with energetic particles or radiation · CPC title

  • Physical treatment to alter the texture of the substrate surface, e.g. grinding, polishing · CPC title

  • Deposition of sublayers, e.g. to promote adhesion of the coating (C23C14/027 takes precedence) · CPC title

  • with vanes hinged to the outer member and reciprocating with respect to the inner member · CPC title

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What does patent US12038005B2 cover?
A moving part of a compressor, a compressor including the moving part, and a method of manufacturing the moving part, the moving part including a base material having a polished surface and including a steel material; an adhesive layer arranged on the polished surface; and a coating layer including diamond-like carbon. The adhesive layer may be arranged between the base material and the coating…
Who is the assignee on this patent?
Samsung Electronics Co Ltd
What technology area does this patent fall under?
Primary CPC classification F04C18/322. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Jul 16 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).