Resin composition for generating allylphenol-maleimide copolymer for electronic component protective film, and electronic component protective film comprising this copolymer

Patent metadata

Field	Value
Publication number	US-12037507-B2
Application number	US-201917287772-A
Country	US
Kind code	B2
Filing date	Nov 5, 2019
Priority date	Nov 5, 2018
Publication date	Jul 16, 2024
Grant date	Jul 16, 2024

Abstract

This invention provides a resin composition for preparing an allylphenol-maleimide copolymer used for a protective film for an electronic component including: (A) an allyl group-containing phenol compound having a rigid structure; (B) an N-aromatic maleimide group-containing compound having a rigid structure; and (C) an N-aliphatic maleimide group-containing compound having a flexible structure.

First claim

The invention claimed is:

1. A resin composition for preparing an allylphenol-maleimide copolymer used for a protective film for an electronic component comprising:
(A) an allyl group-containing phenol compound having a rigid structure;
(B) an N-aromatic maleimide group-containing compound having a rigid structure; and
(C) an N-aliphatic maleimide group-containing compound having a flexible structure;
wherein Compound (A) is represented by Formula 1 below, Compound (B) is represented by Formula 2 below, and Compound (C) is represented by Formula 3 below;
wherein an equivalence ratio of the allyl group-containing phenol compound having the rigid structure (A) to a total of the N-aromatic maleimide group-containing compound having the rigid structure (B) and the N-aliphatic maleimide group-containing compound having the flexible structure (C) is from 1:1 to 1:3; and
wherein an equivalence ratio of the N-aromatic maleimide group-containing compound having the rigid structure (B) to the N-aliphatic maleimide group-containing compound having the flexible structure (C) is from 1:0.6 to 1:1.6,

wherein n is 1 or 2;

wherein n is 0 to 2;

2. The resin composition according to claim 1 , wherein the resin composition further comprises spherical alumina particles as inorganic fillers.

3. The resin composition according to claim 2 , wherein a content of the inorganic fillers in the resin composition is from 50% to 75% by weight.

4. A method for producing an allylphenol-maleimide copolymer used for a protective film for an electronic component comprising curing the resin composition according to claim 1 via heating.

5. A protective film for an electronic component comprising an allylphenol-maleimide copolymer, which is a heat-cured product of the resin composition according to claim 1 .

6. An electronic component comprising:
an insulative substrate;
a pair of electrodes formed to face at least one surface of the insulative substrate;
a resistance element that electrically connects the pair of electrodes;
a first protective film that covers the resistance element; and
a second protective film that covers the first protective film and is formed of the allylphenol-maleimide copolymer according to claim 5 .

7. The method according to claim 4 , wherein the curing is carried out at from 200° C. to 250° C. for from 15 to 30 minutes.

8. The protective film according to claim 5 , wherein a thickness of the protective film is from 10 to 15 μm.

Assignees

• Osaka Res Inst Ind Science & Tech
• Koa Corp

Inventors

• Ohtsuka Keiko
• Yonekawa Morio
• Kimura Hajime
• Yoshioka Ken
• Kanamaru Nobuhiro
• Suwa Masaki
• Machida Kazumi

Classifications

• H01C7/005

  Polymer thick films · CPC title

• H01B3/303

  Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302 · CPC title

• C09D145/00

  Coating compositions based on homopolymers or copolymers of compounds having no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic or in a heterocyclic system; Coating compositions based on derivatives of such polymers (based on polymers of cyclic esters of polyfunctional acids C09D131/00; based on polymers of cyclic anhydrides or imides C09D135/00) · CPC title

• C08K2003/2227

  of aluminium · CPC title

• C08K3/22

  of metals · CPC title