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US-2023260473-A1 · Aug 17, 2023 · US
Electronic apparatus and manufacturing method thereof
US12034002B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12034002-B2 |
| Application number | US-202217678040-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 23, 2022 |
| Priority date | Jul 29, 2019 |
| Publication date | Jul 9, 2024 |
| Grant date | Jul 9, 2024 |
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- Title
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- Abstract
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- Assignees and inventors
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- Key dates
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- First independent claim
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- CPC / IPC classifications
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- Citations and related patents
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Abstract
Official abstract text for this publication.
The disclosure provides an electronic apparatus and a manufacturing method thereof. The electronic apparatus includes a first insulating layer, a first metal layer, a second metal layer, and an electronic assembly. The first insulating layer includes a first surface and a second surface opposite to the first surface. The first metal layer has an opening and is formed on the first surface. The second metal layer is formed on the second surface and a projection of the opening on the second surface is overlapped with a projection of the second metal layer on the second surface. The electronic assembly is electrically connected with the first metal layer and the second metal layer.
First claim
Opening claim text (preview).
What is claimed is: 1. An electrical apparatus, comprising: a first insulating layer, comprising a first surface and a second surface opposite to the first surface; a first metal layer, having an opening and formed on the first surface; a second metal layer, formed on the second surface, wherein a projection of the opening on the second surface is overlapped with a projection of the second metal layer on the second surface; and an electronic assembly, electrically connected with the first metal layer and the second metal layer, wherein the electronic assembly comprises a PN junction assembly, and the PN junction assembly comprises a variable capacitor. 2. The electronic apparatus as claimed in claim 1 , further comprising: a transistor circuit, electrically connected with the electronic assembly. 3. The electronic apparatus as claimed in claim 2 , further comprising: a routing layer, formed on the second surface and electrically connected with the transistor circuit; and a control circuit, electrically connected with the routing layer to be electrically connected with the transistor circuit via the routing layer. 4. The electronic apparatus as claimed in claim 1 , wherein the electronic assembly further comprises a solar cell or an integrated circuit. 5. The electronic apparatus as claimed in claim 1 , wherein the first insulating layer comprises a flexible substrate material.
Assignees
Inventors
Classifications
the multiple chips being integrally enclosed · CPC title
Configurations of laterally-adjacent chips · CPC title
characterised by multiple insulating or insulated package substrates, interposers or RDLs · CPC title
- H10W70/611Primary
for connecting multiple chips together · CPC title
Capacitor integral with wiring layers · CPC title
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US12034002B2 cover?
- The disclosure provides an electronic apparatus and a manufacturing method thereof. The electronic apparatus includes a first insulating layer, a first metal layer, a second metal layer, and an electronic assembly. The first insulating layer includes a first surface and a second surface opposite to the first surface. The first metal layer has an opening and is formed on the first surface. The s…
- Who is the assignee on this patent?
- Innolux Corp
- What technology area does this patent fall under?
- Primary CPC classification H10W70/611. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jul 09 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 7 related publications on this page (citations in our corpus or others sharing the same primary CPC).