Cooling apparatus

Patent metadata

Field	Value
Publication number	US-12033918-B2
Application number	US-201817258993-A
Country	US
Kind code	B2
Filing date	Jul 9, 2018
Priority date	Jul 9, 2018
Publication date	Jul 9, 2024
Grant date	Jul 9, 2024

Abstract

A cooling apparatus includes: a main body configured to provide a cooling water flow path in an inner space, a plurality of cooling jackets each including a plurality of cooling fins, the plurality of cooling fins being disposed inside the main body along the cooling water flow path and spaced apart from each other by a set distance, and a plurality of double-sided chip modules disposed between at least two of the plurality of cooling jackets and having an upper surface and a lower surface contacting the at least two cooling jackets. Each module of the plurality of double-sided chip modules is (i) located at a position corresponding to a position of one of the plurality of cooling fins, (ii) facing the one of the plurality of cooling fins, and (iii) spaced apart from at least one other module to simultaneously cool the upper surface and the lower surface.

First claim

The invention claimed is:

1. A cooling apparatus, comprising:
a main body including an upper plate and a lower plate that are joined to each other, the main body being configured to provide a cooling water flow path in an inner space between the upper plate and the lower plate;
a plurality of cooling jackets each including a plurality of cooling fins, the plurality of cooling fins being (i) disposed inside the main body along the cooling water flow path, (ii) spaced apart from each other by a set distance, and (iii) joined between the upper plate and the lower plate;
a plurality of double-sided chip modules disposed between at least two of the plurality of cooling jackets and having an upper surface and a lower surface contacting the at least two cooling jackets;
a first main body including a seating surface configured to receive at least two vertically stacked cooling jackets; and
a second main body that is located opposite to the first main body, that surrounds the at least two vertically stacked cooling jackets, and that is coupled to the first main body,
wherein each module of the plurality of double-sided chip modules is (i) located at a position corresponding to a position of one of the plurality of cooling fins, (ii) facing the one of the plurality of cooling fins, and (iii) spaced apart from at least one other module among the plurality of double-sided chip modules to simultaneously cool the upper surface and the lower surface,
wherein the second main body includes a plurality of reinforcing bars that do not overlap with each of the plurality of double-sided chip modules and that is disposed in a width direction of the second main body, and
wherein each of the plurality of cooling jackets is compressed in a vertical direction between the reinforcing bars and the first main body.

2. The cooling apparatus of claim 1 ,
wherein the upper plate comprises a first flat portion defined along an edge thereof and a first convex portion that is convex upward around the first flat portion,
wherein the lower plate comprises a second flat portion that is defined along an edge of the lower plate and that faces and contacts the first flat portion, and a second convex portion that is symmetrical with the first convex portion and that is convex downward,
wherein the first flat portion and the second flat portion are braze-joined and the cooling water flow path is provided between the first convex portion and the second convex portion.

3. The cooling apparatus of claim 1 , wherein the cooling water flow path includes a main flow path having a constant height and a rectangular cross-sectional shape, and
wherein the cooling fin is inserted into the main flow path.

4. The cooling apparatus of claim 3 , wherein the main flow path does not have a constant height at both ends of a flow cross section.

5. The cooling apparatus of claim 3 , further comprising a flow inhibitor that is disposed on at least one end of a flow cross-section of the cooling water flow path to block a cooling water flow,
wherein the flow inhibitor is disposed within each of separation distances of the plurality of cooling fins.

6. The cooling apparatus of claim 1 , wherein the at least two cooling jackets vertically facing the plurality of double-sided chip modules have longitudinal ends communicating with each other to flow a cooling water.

7. The cooling apparatus of claim 6 , wherein the at least two cooling jackets vertically facing the plurality of double-sided chip modules are vertically assembled in a slidable manner at the longitudinal ends to block communicating portions thereof.

8. The cooling apparatus of claim 6 , wherein the at least two cooling jackets include cooling ports that are connected to the longitudinal ends to introduce and discharge the cooling water.

9. The cooling apparatus of claim 1 , wherein a number of the plurality of cooling fins corresponds to a number of the plurality of double-sided chip modules, and each of the plurality of cooling fins faces one of the plurality of double-sided chip modules.

10. The cooling apparatus of claim 9 , wherein each of the plurality of cooling fins has a shape corresponding to a planar shape of one of the double-sided chip modules and has an area with a size corresponding to a plane size of the one of the double-sided chip modules.

11. The cooling apparatus of claim 1 , wherein the cooling fin has a wave shape.

12. The cooling apparatus of claim 11 , wherein the wave shape of the cooling fin includes a first corrugated shape in a cross-sectional direction of the cooling water flow path and a second corrugated shape in a longitudinal direction of the cooling water flow path.

13. The cooling apparatus of claim 11 , wherein the wave shape of the cooling fin is compression-deformed within a predetermined range based on an external force being applied to the upper plate and the lower plate in a height direction.

14. The cooling apparatus of claim 1 , wherein the plurality of cooling jackets comprise:
a first cooling jacket including a first main body and a plurality of first cooling fins, the first main body of the first cooling jacket including a first upper plate and a first lower plate joined to each other and configured to provide a first cooling water flow path between the first upper plate and the first lower plate, and the plurality of first cooling fins disposed along the first cooling water flow path, spaced apart from each other, and joined between the first upper plate and the first lower plate;
a second cooling jacket stacked on the first cooling jacket and including a second main body and a plurality of second cooling fins, the second main body including a second upper plate and a second lower plate joined to each other and configured to provide a second cooling water flow path between the second upper plate and the second lower plate, and the plurality of second cooling fins disposed along the second cooling water flow path, spaced apart from each other, and joined between the second upper plate and the second lower plate; and
a third cooling jacket stacked on the second cooling jacket and including a third main body and a plurality of third cooling fins, the third main body including a third upper plate and a third lower plate joined to each other and configured to provide a third cooling water flow path between the third upper plate and the third lower plate, and the plurality of third cooling fins disposed along the third cooling water flow path, spaced apart from each other, and joined between the third upper plate and the third lower plate.

15. The cooling apparatus of claim 14 , wherein the plurality of double-sided chip modules include:
a plurality of first double-sided chip modules disposed between the first cooling jacket and the second cooling jacket and having an upper surface and a lower surface contacting the first cooling jacket and the second cooling jacket, each module of the plurality of first double-sided chip modules provided at a position corresponding to a position of each of the plurality of first cooling fins and the plurality of second cooling fins and facing the corresponding first cooling fin and the corresponding second cooling fin; and
a plurality of second double-sided chip modules disposed between the second cooling jacket and the third cooling jacket and having an upper surface and a lower surface contacting the second cooling jacket and the third cooling jacket, each module of the plurality of second double-sided chip modules provided at a position corresponding to a position of each of the plurality of second cooling fins and the plurality of thi

Assignees

• Lg Magna E Powertrain Co Ltd
• Lg Electronics Inc

Inventors

• Kang Myeon Gyu
• Kim Yong Sik
• Cho Namjoon

Classifications

• H10W90/00

  Package configurations · CPC title

• H10W40/22

  characterised by their shape, e.g. having conical or cylindrical projections · CPC title

• H05K7/20927 Primary

  Liquid coolant without phase change · CPC title

• H10W40/47 Primary

  by flowing liquids, e.g. forced water cooling · CPC title

• H10W40/613

  for stacked arrangements of a plurality of semiconductor devices · CPC title