Flexible package with reclose region

US12030701B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12030701-B2
Application numberUS-202117193009-A
CountryUS
Kind codeB2
Filing dateMar 5, 2021
Priority dateDec 15, 2014
Publication dateJul 9, 2024
Grant dateJul 9, 2024

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A reclosable flexible package is described that includes an inner film layer, an outer film layer laminated to the inner film layer, and reclose region defined in a portion of package film layers. The reclose region includes pressure sensitive adhesive disposed between the inner and outer film layers. A number of cut lines are provided in the outer film layer in the reclose region, such that the user, by manipulating the package film layers at the reclose region, can reveal the underlying layer of pressure sensitive adhesive. Once the pressure sensitive adhesive of the reclose region is exposed, the action of the user can serve to adhere the pressure sensitive adhesive to itself and/or other portions of the film, such that the package is cinched in the area of the reclose region and maintains the remnants of the package contents within the reclosed package for later use.

First claim

Opening claim text (preview).

What is claimed is: 1. A packaging structure for forming a reclosable flexible package, the packaging structure comprising: an inner film layer; an outer film layer laminated to the inner film layer to form a laminate, wherein a plurality of cut lines are disposed in the outer film layer to form a reclose region, said plurality of cut lines defining a plurality of strips of the outer film layer, each of the plurality of strips being disposed between two adjacent cut lines of the plurality of cut lines; and pressure sensitive adhesive disposed between the inner and outer film layers within the reclose region; and wherein each of the plurality of strips has a longitudinal direction and wherein a first longitudinal end of each strip of the plurality strips and a second longitudinal end of each strip of the plurality of strips are each adapted to remain uncut and continuous with the outer film layer after reclosing of the reclose region. 2. The packaging structure of claim 1 , wherein the plurality of cut lines are parallel to one another. 3. The packaging structure of claim 1 , wherein the laminate comprises a plurality of reclose regions. 4. The packaging structure of claim 1 , wherein the plurality of cut lines are straight lines. 5. The packaging structure of claim 1 , wherein the plurality of cut lines are parallel with an edge of the laminate. 6. The packaging structure of claim 1 , wherein the plurality of cut lines are at a non-zero angle with respect to an edge of the laminate. 7. The packaging structure of claim 1 , wherein the plurality of cut lines are spaced approximately ⅛-inch to approximately ¼-inch apart in the reclose region. 8. The packaging structure of claim 1 , wherein the plurality of cut lines are wavy lines. 9. The packaging structure of claim 1 , wherein the plurality of cut lines are curved lines. 10. The packaging structure of claim 1 , wherein the reclose region comprises at least one section devoid of adhesive such that the inner film layer and the outer film layer are not adhered to one another in the at least one section. 11. The packaging structure of claim 1 , wherein the laminate is rectangular. 12. The packaging structure of claim 1 , wherein the inner film layer is selected from the group consisting of polyethylene, biaxially oriented polypropylene, and metalized biaxially oriented polypropylene. 13. The packaging structure of claim 1 , wherein the outer film layer is selected from the group consisting of biaxially oriented polypropylene and polyester. 14. The packaging structure of claim 1 , additionally comprising permanent adhesive disposed between the outer film layer and the inner film layer. 15. The packaging structure of claim 1 , additionally comprising at least one layer selected from the group consisting of additional film layer, barrier layer and ink layer. 16. The packaging structure of claim 1 , wherein the laminate comprises a first end and a second end, and the reclose region is located approximately equidistantly from the first end and the second end. 17. A method of manufacturing a packaging structure for forming a reclosable flexible package, the method comprising: laminating an outer film layer to an inner film layer to form a laminate; and defining a reclose region in a portion of the laminate, wherein the reclose region is formed by: applying a pressure sensitive adhesive between the inner film layer and the outer film layer in the reclose region, and cutting a plurality of lines into the outer film layer of the reclose region, said plurality of cut lines defining a plurality of strips of the outer film layer disposed between adjacent cut lines of the plurality of cut lines, wherein each strip of the plurality of strips has a longitudinal direction and wherein a first longitudinal end of each strip of the plurality of strips and a second longitudinal end of each strip of the plurality of strips are each adapted to remain uncut and continuous with the outer film layer after reclosing of the reclose region. 18. The method of claim 17 , wherein applying the pressure sensitive adhesive comprises flood coating the inner film layer with the pressure sensitive adhesive. 19. The method of claim 17 , wherein applying the pressure sensitive adhesive comprises pattern applying the pressure sensitive adhesive to the inner film layer. 20. The method of claim 17 , wherein cutting the lines in the outer film layer comprises laser scoring the plurality of cut lines.

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What does patent US12030701B2 cover?
A reclosable flexible package is described that includes an inner film layer, an outer film layer laminated to the inner film layer, and reclose region defined in a portion of package film layers. The reclose region includes pressure sensitive adhesive disposed between the inner and outer film layers. A number of cut lines are provided in the outer film layer in the reclose region, such that th…
Who is the assignee on this patent?
Sonoco Dev Inc
What technology area does this patent fall under?
Primary CPC classification B32B7/12. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jul 09 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).