High dynamic temperature control system

Patent metadata

Field	Value
Publication number	US-12030224-B2
Application number	US-202217682622-A
Country	US
Kind code	B2
Filing date	Feb 28, 2022
Priority date	Sep 29, 2011
Publication date	Jul 9, 2024
Grant date	Jul 9, 2024

Abstract

A molding system is provided, which includes at least one mold part and a heating and cooling module. The at least one mold part defines a mold cavity having an opening. The heating and cooling module is inserted into the opening to close the mold cavity. The heating and cooling module includes a die insert defining a mold surface, a layered heater for heating the mold surface, and a cooling unit for cooling the mold surface. The layered heater is disposed between the die insert and the cooling unit and includes functional layers formed directly on a surface of the cooling unit or a surface of the die insert opposite to the mold surface by using layered or layering processes selected from a group consisting of thick film, thin film, thermal spray and sol-gel processes.

First claim

What is claimed is:

1. A molding system comprising:
at least one mold part defining a mold cavity having an opening;
a heating and cooling module inserted into the opening to close the opening of the mold cavity, the heating and cooling module comprising
a die insert defining a mold surface to be in contact with a molten material received in the mold cavity,
a layered heater for heating the mold surface, and
a cooling unit for cooling the mold surface,

wherein an entire area of the mold surface is disposed inside the mold cavity defined by the at least one mold part, such that the mold surface is being in contact with the at least one mold part and an entire portion of the die insert is surrounded by the at least one mold part when the opening of the mold cavity is closed by the heating and cooling module, the entire portion of the die insert being higher than any other part of the heating and cooling module, spaced apart from a top surface of the cooling unit and not in contact with the cooling unit,
wherein the layered heater is disposed between the die insert and the cooling unit and includes functional layers formed directly on a surface of the cooling unit or a surface of the die insert opposite to the mold surface by using layered or layering processes selected from a group consisting of thick film, thin film, thermal spray and sol-gel processes.

2. The molding system of claim 1 , wherein the layered heater is formed on one of the die insert and the cooling unit by thermal spraying.

3. The molding system of claim 1 , wherein the layered heater is formed on the die insert by thermal spraying.

4. The molding system of claim 3 , wherein the thermal spraying comprises a plurality of layers including a top coat comprising a material having relatively high thermal conductivity.

5. The molding system of claim 4 , wherein the top coat is machined to a predetermined thickness.

6. The molding system of claim 1 , wherein the die insert is clamped to the layered heater.

7. The molding system of claim 1 , wherein the cooling unit is clamped to the layered heater.

8. The molding system of claim 1 , wherein the cooling unit includes a plurality of cutout portions on a peripheral surface of the cooling unit.

9. The molding system of claim 1 , wherein the cooling unit includes a thermal insulation layer on a peripheral surface of the cooling unit.

10. The molding system of claim 1 , wherein the cooling unit includes a substrate and a plurality of passageways in the substrate.

11. The molding system of claim 1 further comprising a thermal insulation layer formed around the cooling unit.

12. The molding system of claim 4 , wherein the top coat includes a first metallic top coat layer and a second metallic top coat layer.

13. The molding system of claim 12 , wherein at least one of the first metallic top coat layer and the second metallic top coat layer is a galvanic nickel layer.

14. The molding system of claim 1 , wherein the layered heater is integrally formed with the cooling unit to form an integrated unit.

15. The molding system of claim 14 , wherein the cooling unit includes a substrate and a plurality of passageways in the substrate.

16. The molding system of claim 15 , wherein the layered heater is formed on and in contact with the substrate of the cooling unit by layered processes.

17. The molding system of claim 16 , wherein the layered heater includes a first dielectric layer disposed on the substrate of the cooling unit, a resistive heating layer disposed on the first dielectric layer, and a second dielectric layer disposed on the resistive heating layer.

18. The molding system of claim 17 , further comprising a top coat layer formed on the second dielectric layer, wherein the top coat layer includes a metal.

19. The molding system of claim 18 , wherein the top coat layer defines the mold surface.

20. The molding system of claim 1 , wherein the top surface of the cooling unit is in contact with the at least one mold part and disposed outside the at least one mold part.

21. The molding system according to claim 1 , wherein the layered heater comprises an adhesion layer deposited directly on a top surface of the cooling unit, a dielectric layer on the adhesive layer, a heating layer on the dielectric layer and a top layer on the heating layer.

Assignees

• Watlow Electric Mfg

Inventors

• Wallinger Martin
• Schefbänker Gerhard
• Pöschl Wolfgang
• Antosch Gernot
• Lehnert Reinhardt
• Kübler Michael
• Burr August

Classifications

• B29C2045/2746

  Multilayered electrical heaters · CPC title

• B29C45/7312

  Construction of heating or cooling fluid flow channels · CPC title

• B29C45/2642

  Heating or cooling means therefor · CPC title

• H05B2203/003

  using serpentine layout · CPC title

• H05B3/28

  heating conductor embedded in insulating material · CPC title