Packaging method and packaging structure of FBAR

Patent metadata

Field	Value
Publication number	US-12028043-B2
Application number	US-202117249347-A
Country	US
Kind code	B2
Filing date	Feb 26, 2021
Priority date	Jul 19, 2019
Publication date	Jul 2, 2024
Grant date	Jul 2, 2024

Abstract

The present disclosure provides a packaging method and packaging structure of an FBAR. A second cavity in a resonator cover provided includes a groove in a second substrate and a space surrounded by an elastic bonding material layer. The elastic bonding material layer bonds the resonator cover to a resonant cavity main structure, and elasticity of the elastic bonding material layer is removed after the bonding. Through holes and a conductive interconnection layer on inner surfaces of the through holes are formed on the resonator cover. Since the second cavity includes the groove in the second substrate and the space surrounded by the elastic bonding material layer, which can avoid problems that performance of the elastic bonding material layer is unstable with temperature and humidity changes when the second cavity is entirely surrounded by the elastic bonding material layer, that is, the stability of the resonator is improved.

First claim

What is claimed is:

1. A packaging method of a film bulk acoustic resonator, comprising:
providing a resonant cavity main structure, wherein the resonant cavity main structure includes
a first substrate,
a bulk acoustic resonant structure, and
a cavity wall structure between the first substrate and the bulk acoustic resonant structure and enclosing a first cavity between the bulk acoustic resonant structure and the first substrate,
wherein an opening is formed in the bulk acoustic resonant structure and outside the first cavity;

providing a resonator cover, wherein the resonator cover includes a second substrate and an elastic bonding material layer on the second substrate, and a second cavity is formed in the second substrate and through the elastic bonding material layer;
bonding the resonant cavity main structure and the resonator cover together by force pressing the elastic bonding material layer, such that
a first portion of the elastic bonding material layer of the resonator cover is adaptively pressed into the opening in the bulk acoustic resonant structure of the resonant cavity main structure,
a second portion of the elastic bonding material layer of the resonator cover is adaptively pressed on a top surface of the bulk acoustic resonant structure of the resonant cavity main structure; and

forming a first through hole penetrating the first portion of the elastic bonding material layer and the second substrate, and
forming a second through hole penetrating the second portion of the elastic bonding material layer and the second substrate, the first and second through holes exposing a first electrical connection portion and a second electrical connection portion of the bulk acoustic resonant structure.

2. The packaging method according to claim 1 , wherein:
providing the resonator cover includes: providing the second substrate and removing a portion of the second substrate to form a groove therein; forming an elastic bonding material on surfaces of the second substrate and in the groove; and patterning the elastic bonding material to remove the elastic bonding material on sidewalls and a bottom wall of the groove, wherein the patterned elastic bonding material forms the elastic bonding material layer with the second cavity passing through the elastic bonding material layer; or
providing the resonator cover includes: providing the second substrate and forming the elastic bonding material layer on the second substrate; and sequentially patterning the elastic bonding material layer and the second substrate, thereby forming the second cavity in the second substrate and through the elastic bonding material layer.

3. The packaging method according to claim 1 , further comprising:
removing elasticity of the elastic bonding material layer, after bonding the resonant cavity main structure and the resonator cover together through the elastic bonding material layer by force pressing, by performing
a light illumination, or a heating and cooling process.

4. The packaging method according to claim 1 , wherein:
the first portion of the elastic bonding material layer has a first thickness, and
the second portion of the elastic bonding material layer has a second thickness, the second thickness being less than the first thickness.

5. The packaging method according to claim 1 , wherein:
the bulk acoustic resonant structure includes a first electrode adjacent to the first substrate, a piezoelectric layer on the first electrode, and a second electrode on the piezoelectric layer.

6. The packaging method according to claim 5 , wherein:
the first electrical connection portion includes a portion of the first electrode extending out of the first cavity; and
the second electrical connection portion includes a portion of the second electrode extending out of the first cavity.

7. The packaging method according to claim 1 , wherein:
the opening formed in the bulk acoustic resonant structure and outside the first cavity exposes at least a portion of the first electrical connection portion; and
top surfaces of: the first portion of the first elastic bonding material layer formed in the opening and the second portion of the elastic bonding material layer formed on the top surface of the bulk acoustic resonant structure, are leveled with each other along a lateral direction of the first or second substrate.

8. The packaging method according to claim 1 , further comprising:
after bonding the resonant cavity main structure and the resonator cover together and before forming the first and second through holes, thinning the second substrate, and
forming a first conductive interconnection layer and a second conductive interconnection layer on sidewall and bottom of each of the first and second through holes and further on a portion of a surface of the resonator cover at a periphery of each through hole.

9. The packaging method according to claim 8 , wherein after forming the first and second conductive interconnection layers, the method further includes:
forming a first passivation layer on the first conductive interconnection layer, filling in the first through hole, and exposing a portion of the first conductive interconnection layer over a surface of the resonator cover at a periphery of the first through hole, and the exposed portion of the first conductive interconnection layer over the resonator cover forms first conductive contact pads,
forming a second passivation layer on the second conductive interconnection layer, filling in the second through hole, and exposing a portion of the second conductive interconnection layer over a surface of the resonator cover at a periphery of the second through hole, and the exposed portion of the second conductive interconnection layer over the resonator cover forms second conductive contact pads, and
the first passivation layer has a thickness greater than the second passivation layer.

10. The packaging method according to claim 9 , wherein:
the passivation layer is made of at least one of silicon oxide, silicon nitride, silicon oxynitride, metal nitride, and polymer.

11. The packaging method according to claim 1 , wherein providing the resonant cavity main structure includes:
providing a carrier substrate, and sequentially forming film layers for forming the bulk acoustic resonant structure and a support layer on the film layers;
etching the support layer to form a trench in the support layer;
providing the first substrate, and bonding the first substrate to the support layer; and
removing the carrier substrate to form the resonant cavity main structure.

12. The packaging method according to claim 11 , further including:
before the support layer is formed on the film layers for forming the bulk acoustic resonant structure, or after the carrier substrate is removed, patterning the film layers to form the bulk acoustic resonant structure.

13. The packaging method according to claim 1 , wherein providing the resonant cavity main structure includes:
providing the first substrate, and forming a sacrificial layer on a portion of the first substrate;
forming the bulk acoustic resonant structure on the sacrificial layer and the first substrate; and
removing the sacrificial layer to form the first cavity.

14. The packaging method according to claim 13 , wherein:
forming the sacrificial layer on the portion of the first substrate includes: etching the first substrate to form a groove in the first substrate; and forming the sacrificial layer to fill the groove; or
forming the sacrificial layer on the portion of the first substrate includes: forming the sacrificial layer on the

Assignees

• Ningbo Semiconductor Int Corp

Inventors

• Luo Hailong

Classifications

• H03H2003/021

  the resonators or networks being of the air-gap type · CPC title

• H03H9/173

  Air-gaps · CPC title

• H03H9/0523

  for flip-chip mounting · CPC title

• H03H3/02 Primary

  for the manufacture of piezoelectric or electrostrictive resonators or networks (H03H3/08 takes precedence) · CPC title

• H03H9/15

  Constructional features of resonators consisting of piezoelectric or electrostrictive material (H03H9/25 takes precedence) · CPC title