Flooring panel sample module and method of manufacture

US12027077B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12027077-B2
Application numberUS-202318259692-A
CountryUS
Kind codeB2
Filing dateFeb 1, 2023
Priority dateFeb 2, 2022
Publication dateJul 2, 2024
Grant dateJul 2, 2024

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A flooring panel sample module and method of manufacturing the same. The module provides superior construction integrity without relying on the unpredictable performance of glue.

First claim

Opening claim text (preview).

What is claimed is: 1. A flooring panel sample module, comprising: a flooring panel sample; peripheral trim disposed on a peripheral edge of the floor panel sample; adhesive disposed on a bottom surface of the peripheral trim; a backer board adhered to the adhesive; and plural rivets disposed through the flooring panel sample and the backer board. 2. The flooring panel sample module of claim 1 , wherein the flooring panel sample is comprised of plural flooring planks. 3. The flooring panel sample module of claim 2 , wherein at least one of the plural rivets is disposed through each of the plural flooring planks and the backer board. 4. The flooring panel sample module of claim 1 , wherein the flooring panel sample is rectangular and the peripheral trim is comprised of four trim portions, each disposed on a respective peripheral edge of the flooring panel sample. 5. The flooring panel sample module of claim 4 , wherein the flooring panel sample is square. 6. The flooring panel sample module of claim 1 , wherein the flooring panel sample is selected from the group consisting of comprised of rigid, resilient or composite flooring. 7. The flooring panel sample module of claim 1 , wherein the peripheral trim is J-channel trim. 8. The flooring panel sample module of claim 7 , wherein the J-channel trim is vinyl J-channel trim. 9. The flooring panel sample module of claim 8 , wherein the vinyl J-channel trim is clear vinyl J-channel trim. 10. The flooring panel sample module of claim 7 , wherein the J-channel trim is comprised of four discrete portions of J-channel trim. 11. The flooring panel sample module of claim 1 , wherein the adhesive is double-sided tape disposed on the bottom surface of the peripheral trim. 12. The flooring panel sample module of claim 1 , wherein the rivets are clear vinyl rivets. 13. The flooring panel sample module of claim 1 , wherein the rivets are double cap rivets. 14. The flooring panel sample module of claim 1 , wherein the flooring panel sample module further comprises a handle formed through the flooring panel sample and the backer board. 15. A method of manufacturing a flooring panel sample module, comprising: providing a flooring panel sample; disposing peripheral trim on a peripheral edge of the flooring panel sample; disposing an adhesive on a bottom edge of the peripheral trim; disposing a backer board in contact with the adhesive; and disposing plural rivets between the flooring panel sample and the backer board. 16. The method of claim 15 , wherein providing a flooring panel sample comprises joining plural flooring planks to form the flooring panel sample. 17. The method of claim 16 , wherein disposing plural rivets between the flooring panel sample and the backer board comprises disposing at least one rivet between each flooring panel and the backer board. 18. The method of claim 15 , wherein disposing the peripheral trim on the peripheral edge of the flooring panel sample comprises disposing each of four portions of peripheral trim on a respective peripheral edge of the flooring panel sample. 19. The method of claim 15 , wherein the peripheral trim is J-channel trim. 20. The method of claim 15 , wherein disposing the adhesive on the bottom edge of the peripheral trim comprises disposing double-sided tape on the bottom edge of the peripheral trim.

Assignees

Inventors

Classifications

  • for wood · CPC title

  • only of wood {or with a top layer of wood}, e.g. with wooden {or metal} connecting members (rollable parquet E04F15/16) · CPC title

  • G09F5/04Primary

    Cards of samples; Books of samples (packages comprising articles attached to cards, sheets, or webs for removal therefrom B65D73/00) · CPC title

  • G09F5/00Primary

    Means for displaying samples (packaging per se B65) · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US12027077B2 cover?
A flooring panel sample module and method of manufacturing the same. The module provides superior construction integrity without relying on the unpredictable performance of glue.
Who is the assignee on this patent?
Shaw Ind Group Inc
What technology area does this patent fall under?
Primary CPC classification G09F5/04. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Jul 02 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).