Stretchable substrate having improved stretch uniformity and method of manufacturing the same
US-2023217588-A1 · Jul 6, 2023 · US
Zero energy mechanical sensors and methods of using same
US12025511B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12025511-B2 |
| Application number | US-202117456078-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 22, 2021 |
| Priority date | Nov 22, 2020 |
| Publication date | Jul 2, 2024 |
| Grant date | Jul 2, 2024 |
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Abstract
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A sensor, comprising a deformable substrate, comprising a structural metamaterial in a first configuration; a plurality of raised structures disposed throughout the substrate, wherein the plurality of raised structures are invertible; a responsive material layer, wherein the responsive material layer is disposed on the plurality of raised structures and is configured to invert the plurality of raised structures in the presence of an external stimuli; and a plurality of second configurations of the deformable substrate that correspond to a plurality of inverted raised structures.
First claim
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We claim: 1. A sensor, comprising; a deformable substrate, comprising a structural metamaterial in a first configuration; a plurality of raised structures disposed throughout the substrate, wherein the plurality of raised structures are invertible; a responsive material layer, wherein the responsive material layer is disposed on the plurality of raised structures and is configured to invert the plurality of raised structures in the presence of an external stimuli; and a plurality of second configurations of the deformable substrate that correspond to a plurality of inverted raised structures. 2. The sensor of claim 1 , wherein the plurality of raised structures are dome-shaped. 3. The sensor of claim 1 , wherein the sensor is a first sensor and is connected to a second sensor using a plurality of elastic substrates. 4. The sensor of claim 3 , wherein the plurality of elastic substrates have a configuration dependent upon the configuration of the first sensor and the configuration of the second sensor. 5. A method for using a sensor, comprising; subjecting a sensor to an external stimuli, the sensor comprising; a deformable substrate, comprising a structural metamaterial in a first configuration; a plurality of raised structures disposed throughout the substrate, wherein the plurality of raised structures are invertible; a responsive material layer, wherein the responsive material layer is disposed on the plurality of raised structures and is configured to invert the plurality of raised structures in the presence of the external stimuli; and a plurality of second configurations of the deformable substrate that correspond to a plurality of inverted raised structures; inverting one or more of the raised structures in response to the external stimuli; and recording a spatial and sequential memory corresponding to the second configuration of the sensor. 6. The method of claim 5 , wherein the plurality of raised structures are dome-shaped. 7. The method of claim 5 , wherein the sensor is a first sensor and is connected to a second sensor using a plurality of elastic substrates. 8. The method of claim 7 , wherein the plurality of elastic substrates have a configuration dependent upon the configuration of the first sensor and the configuration of the second sensor. 9. The method of claim 8 , wherein the configuration of the plurality of elastic substrates acts as a logic gate between the first sensor and the second sensor.
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- What does patent US12025511B2 cover?
- A sensor, comprising a deformable substrate, comprising a structural metamaterial in a first configuration; a plurality of raised structures disposed throughout the substrate, wherein the plurality of raised structures are invertible; a responsive material layer, wherein the responsive material layer is disposed on the plurality of raised structures and is configured to invert the plurality of …
- Who is the assignee on this patent?
- Purdue Research Foundation
- What technology area does this patent fall under?
- Primary CPC classification G01L1/048. Mapped technology areas include Physics.
- When was this patent published?
- Publication date Tue Jul 02 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 5 related publications on this page (citations in our corpus or others sharing the same primary CPC).