Vapor chamber and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-12025381-B2
Application number	US-201916687449-A
Country	US
Kind code	B2
Filing date	Nov 18, 2019
Priority date	Dec 25, 2018
Publication date	Jul 2, 2024
Grant date	Jul 2, 2024

Abstract

This disclosure relates to a manufacturing method of a vapor chamber that includes the following steps. Form a containing space and a flow channel on a first cover. Place a second cover on the first cover, such that the first cover and the second cover together form a chamber at the containing space of the first cover and form a passage at the flow channel of the first cover. Enlarge part of the passage so as to create a circular passage portion and a flat passage portion in the passage. Insert a degassing tube into the circular passage portion of the passage. Draw gas from the chamber and fill working fluid into the chamber via the degassing tube. Seal a joint between the chamber and the flat passage portion by a resistance-welding process. Cut off parts of the first cover and the second cover that surround the passage.

First claim

What is claimed is:

1. A vapor chamber, comprising:
an upper cover; and
a lower cover, wherein the upper cover and the lower cover are assembled together and form a chamber therebetween;
wherein there is a sealing structure located at an edge of the upper cover, the sealing structure is recessed from an outermost surface of the upper cover that faces away from the lower cover, the upper cover has a lateral surface flush with a lateral surface of the lower cover at the edge where the sealing structure is located and other lateral surfaces each located closer to the chamber than a corresponding lateral surface of the lower cover where the sealing structure is located away, and the upper cover is directly stacked on the lower cover at the sealing structure, wherein the sealing structure comprises a semi-circle.

2. The vapor chamber according to claim 1 , wherein the vapor chamber has a thickness smaller than 0.6 centimeters.

3. A vapor chamber, comprising:
an upper cover;
a lower cover, wherein the upper cover and the lower cover are assembled together, and the upper cover or the lower cover has a recess to become a chamber between the upper cover and the lower cover;
a capillary structure, located in the chamber; and
a sealing structure, located at an edge of the upper cover for preventing working fluid from leaking from the chamber, wherein the sealing structure is recessed from an outermost surface of the upper cover that faces away from the lower cover, and the upper cover has a lateral surface flush with a lateral surface of the lower cover at the edge where the sealing structure is located and other lateral surfaces each located closer to the chamber than a corresponding lateral surface of the lower cover where the sealing structure is located away, wherein the sealing structure comprises a semi-circle.

4. The vapor chamber according to claim 3 , wherein the upper cover or the lower cover that has the recess has a flat outer surface opposite to the recess.

5. The vapor chamber according to claim 4 , wherein the recess of the upper cover or the lower cover is formed by an etching, sand blasting, or stamping process.

6. The vapor chamber according to claim 5 , wherein the upper cover has a first contacting surface and a first back surface, and the recess is formed on the first contacting surface.

7. The vapor chamber according to claim 6 , wherein the upper cover and the lower cover are stacked on and assembled to each other by a soldering process.

8. The vapor chamber according to claim 6 , wherein the first back surface is flat.

9. The vapor chamber according to claim 6 , wherein the upper cover further has a groove formed on the first contacting surface, the groove extends along a contour of an edge of the upper cover, and the groove is configured for a solder to be injected thereinto.

10. The vapor chamber according to claim 9 , wherein the lower cover is a flat plate stacked on the upper cover and the solder on the upper cover.

11. A vapor chamber, comprising:
an upper cover, having a first contacting surface and a groove, wherein the groove is formed on the first contacting surface, the groove extends along a contour of an edge of the upper cover, the groove on the upper cover forms a non-closed-loop in the edge, and the groove is configured for a solder to be injected thereinto; and
a lower cover, wherein the upper cover and the lower cover are assembled together and form a chamber therebetween with the first contacting surface facing towards the chamber;
wherein there is a sealing structure located at the position where the groove separates the edge into two branches, wherein the sealing structure is positioned between the two branches of the groove on the edge of the upper cover, and the upper cover is directly stacked on the lower cover at the sealing structure;
wherein all of the groove is located between the lower cover and a part of the first contacting surface that faces the chamber.

12. A vapor chamber, comprising:
an upper cover, having a first contacting surface, a first back surface, and a groove, wherein the groove is formed on the first contacting surface, the groove extends along a contour of an edge of the upper cover, the groove on the upper cover forms a non-closed-loop in the edge, and the groove is configured for a solder to be injected thereinto;
a lower cover, wherein the upper cover and the lower cover are assembled together, and the upper cover or the lower cover has a recess to become a chamber between the upper cover and the lower cover with the first contacting surface facing towards the chamber;
a capillary structure, located in the chamber; and
a sealing structure, located at the position where the groove separates the edge into two branches, and the groove forms a non-closed loop in the edge to prevent working fluid from leaking from the chamber, wherein the sealing structure is positioned between the two branches of the groove on the edge of the upper cover;
wherein all of the groove is located between the lower cover and a part of the first contacting surface that faces the chamber.

Assignees

• Cooler Master Co Ltd

Inventors

• Zhou Dingguo
• Wang Xuemei
• Cheng Jen-Chih

Classifications

• B23P15/26

  heat exchangers {or the like (making heat exchangers by methods covered by other subclasses B21D53/02)} · CPC title

• F28D15/0283

  Means for filling or sealing heat pipes · CPC title

• B23P2700/09

  Heat pipes · CPC title

• F28F2255/08

  pressed; stamped; deep-drawn · CPC title

• F28F3/12

  Elements constructed in the shape of a hollow panel, e.g. with channels {(F28D1/02, F28D1/03 take precedence)} · CPC title