Thermal print head, manufacturing method of the same, and thermal printer

Patent metadata

Field	Value
Publication number	US-12023940-B2
Application number	US-202217961009-A
Country	US
Kind code	B2
Filing date	Oct 6, 2022
Priority date	Apr 10, 2020
Publication date	Jul 2, 2024
Grant date	Jul 2, 2024

Abstract

A thermal print head includes a head substrate (11) having a main surface (11a) on which a convex part (12) is formed, a resistor layer (21) that is formed on the main surface (11a) and the convex part (12), a wiring layer (22) that covers the resistor layer (21) such that the resistor layer (21) is exposed at a heat generating part (20) formed at a part of the convex part (12), and a protective layer (25) that is formed on the main surface (11a) of the head substrate (11) and covers the resistor layer (21) and the wiring layer (22). The resistor layer (21) has a main resistor layer that contains tantalum, and at least one of a first sub-resistor layer that contains tantalum nitride and is stacked below the tantalum layer and a second sub-resistor layer that contains tantalum nitride and is stacked on the tantalum layer. The nitrogen content of tantalum nitride contained in the first sub-resistor layer and the second sub-resistor layer exceeds a predetermined value such that the tantalum nitride is deposited in a stable structure.

First claim

What is claimed is:

1. A thermal print head comprising:
a substrate having a main surface on which a convex part is formed;
a resistor layer that is formed on the main surface and the convex part;
a wiring layer that covers the resistor layer such that the resistor layer is exposed at a heat generating part formed at a part of the convex part; and
a protective layer that is formed on the main surface of the substrate and covers the resistor layer and the wiring layer, wherein
the resistor layer includes:
a main resistor layer that contains tantalum; and
at least one of a first sub-resistor layer that contains tantalum nitride and is stacked below the main resistor layer and a second sub-resistor layer that contains tantalum nitride and is stacked on the main resistor layer, and
the tantalum nitride contained in the first sub-resistor layer and the second sub-resistor layer has an eutectic crystal having a (111)- and (200)-oriented face-centered cubic lattice structure.

2. The thermal print head according to claim 1 , wherein
the resistor layer includes both the first sub-resistor layer and the second sub-resistor layer.

3. The thermal print head according to claim 1 , wherein
the protective layer includes at least one of silicon nitride and silicon oxide.

4. The thermal print head according to claim 1 , wherein
the wiring layer contains copper.

5. The thermal print head according to claim 1 , further comprising:
an auxiliary resistor layer that is stacked between the resistor layer and the wiring layer, wherein
the wiring layer covers the auxiliary resistor layer such that the auxiliary resistor layer is exposed at the heat generating part, and the exposed auxiliary resistor layer covers the resistor layer such that the resistor layer is exposed at a part of the auxiliary resistor layer.

6. The thermal print head according to claim 5 , wherein
the auxiliary resistor layer contains titanium.

7. The thermal print head according to claim 1 , wherein
the substrate is a ceramic substrate and the convex part is formed by using a glass glaze layer.

8. The thermal print head according to claim 7 , wherein
the heat generating part is formed in an area including a top of the convex part.

9. The thermal print head according to claim 1 , wherein
the main resistor layer further contains 22 atm % or less of nitrogen, and the tantalum and the nitrogen contained in the main resistor layer form a body-centered cubic lattice structure.

10. A thermal printer comprising:
the thermal print head according to claim 1 ; and
a platen that is arranged to face a heat generating part of the thermal print head.

11. A manufacturing method of a thermal print head comprising steps of:
providing a substrate having a main surface on which a convex part is formed;
forming a resistor layer that is formed on the main surface and the convex part;
forming a wiring layer that covers the resistor layer such that the resistor layer is exposed at a heat generating part formed at a part of the convex part; and
forming a protective layer that is formed on the main surface of the substrate and covers the resistor layer and the wiring layer, wherein
the resistor layer includes:
a main resistor layer that contains tantalum; and
at least one of a first sub-resistor layer that contains tantalum nitride and is stacked below the main resistor layer and a second sub-resistor layer that is stacked on the main resistor layer, and
the tantalum nitride contained in the first sub-resistor layer and the second sub-resistor layer has an eutectic crystal having a (111)- and (200)-oriented face-centered cubic lattice structure.

12. The manufacturing method of a thermal print head according to claim 11 , wherein
in the step of forming the resistor layer, the main resistor layer and at least one of the first sub-resistor layer and the second sub-resistor layer are deposited by controlling a flow rate of a nitrogen gas in a chamber.

13. The manufacturing method of a thermal print head according to claim 11 comprising:
a step of forming an auxiliary resistor layer so as to be stacked between the resistor layer and the wiring layer before the step of forming the wiring layer and after the step of forming the resistor layer, wherein
in the step of forming the wiring layer, the wiring layer covers the auxiliary resistor layer such that the auxiliary resistor layer is exposed at the heat generating part, and in the step of forming the auxiliary resistor layer, the auxiliary resistor layer covers the resistor layer such that the resistor layer is exposed at a part of the exposed auxiliary resistor layer.

14. The manufacturing method of a thermal print head according to claim 11 , wherein
the step of providing the substrate further includes a step of providing a ceramic substrate and a step of forming a convex part on a main surface of the ceramic substrate by using a glass glaze layer.

15. The manufacturing method of a thermal print head according to claim 11 , wherein the step of providing the substrate further includes a step of providing a semiconductor substrate, a step of forming a convex part on a main surface of the semiconductor substrate by means of anisotropic etching, and a step of forming an insulating layer so as to cover the main surface of the substrate on which the convex part is formed and the convex part,
in the step of forming the resistor layer, the resistor layer is formed on the insulating layer, and
in the step of forming the protective layer, the protective layer is formed so as to cover the insulating layer, the resistor layer, and the wiring layer.

16. The manufacturing method of a thermal print head according to claim 15 , wherein
the step of forming the convex part further includes a step of forming first inclined surfaces that sandwich a top surface of the convex part from both sides by means of first anisotropic etching, and a step of forming second inclined surfaces between the top surface and the first inclined surfaces by means of second anisotropic etching, and
the resistor layer is formed on at least one of the top surface of the convex part, the first inclined surfaces, and the second inclined surfaces.

Assignees

• Rohm Co Ltd

Inventors

• Kageyama Satoshi

Classifications

• B41J2/3351 Primary

  Electrode layers · CPC title

• B41J2/345

  characterised by the arrangement of resistors or conductors · CPC title

• B41J2/3357

  Surface type resistors · CPC title

• B41J2/3354

  characterised by geometry · CPC title

• B41J2/3353

  Protective layers · CPC title