Liquid ejection head and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-12023931-B2
Application number	US-202117385067-A
Country	US
Kind code	B2
Filing date	Jul 26, 2021
Priority date	Jul 31, 2020
Publication date	Jul 2, 2024
Grant date	Jul 2, 2024

Abstract

A manufacturing method of a liquid ejection head includes steps of providing an ejection orifice forming member on one surface of a wafer, with an energy-generating element being provided on the one surface of the wafer; forming a recess on the other surface of the wafer; and dicing the wafer along a plurality of dicing lines. The plurality of dicing lines include a dicing line extending in one direction and a dicing line extending in a direction crossing the one direction, and the recess is formed on each of positions overlapping the dicing lines except for an intersection part where the dicing line extending in the one direction intersects the dicing line extending in the direction crossing the one direction.

First claim

What is claimed is:

1. A manufacturing method of a liquid ejection head, the manufacturing method comprising steps of:
providing an ejection orifice forming member on one surface of a wafer, an energy-generating element being provided on the one surface of the wafer;
forming a recess on the other surface of the wafer; and
dicing the wafer along a plurality of dicing lines,
wherein the plurality of dicing lines include a dicing line extending in one direction and a dicing line extending in a direction crossing the one direction, and
wherein the recess is formed on the dicing line extending in the one direction and the dicing line extending in the direction crossing the one direction, and the recess is not formed on an intersection part where the dicing line extending in the one direction intersects the dicing line extending in the direction crossing the one direction.

2. The manufacturing method of the liquid ejection head according to claim 1 , wherein the recess is formed at each of positions overlapping the dicing lines further except for a circumference edge part of the wafer.

3. The manufacturing method of the liquid ejection head according to claim 1 , wherein the recess is formed by wet etching of the wafer.

4. The manufacturing method of the liquid ejection head according to claim 1 ,
wherein a plurality of element substrates are formed by dicing, along the dicing lines, the wafer on which the ejection orifice forming member is provided, and
wherein the dicing lines are provided at positions each corresponding to a contour of each of the element substrates.

5. The manufacturing method of the liquid ejection head according to claim 1 , wherein each of the dicing lines is a groove-shaped cut-out part provided in a resin material forming the ejection orifice forming member.

6. The manufacturing method of the liquid ejection head according to claim 1 ,
wherein dicing of the wafer is performed by using a dicing blade, and
wherein a≥b/3, c<b/2, and d<b/2, where “a” denotes a thickness of the dicing blade, “b” denotes a dimension in the width direction orthogonal to the longitudinal direction of the recess, and “c” and “d” denote distances between an end in the width direction of the recess and an end in the width direction of the dicing blade on both sides of the dicing blade, respectively.

7. The manufacturing method of the liquid ejection head according to claim 1 ,
wherein dicing of the wafer is performed by using a dicing blade, and
wherein a dimension “b” in the width direction orthogonal to the longitudinal direction of the recess is greater than or equal to 100 μm and less than or equal to 200 μm, and a thickness “a” of the dicing blade is greater than or equal to 55 μm.

8. The manufacturing method of the liquid ejection head according to claim 6 ,
wherein the recess has a triangular cross section tapered from the other surface to the one surface of the wafer, and
wherein the dicing blade passes through an apex of the recess having the triangular cross section and dices the wafer.

9. The manufacturing method of the liquid ejection head according to claim 1 , wherein a substrate obtained by division of the wafer has a supply path used for supplying a liquid to the ejection orifice forming member, and the supply path and the recess are formed at the same time.

10. The manufacturing method of the liquid ejection head according to claim 9 , wherein a plurality of pressure chambers and a common liquid chamber communicating with the plurality of pressure chambers are formed between the ejection orifice forming member and the substrate, and the supply path of the substrate communicates with the common liquid chamber.

11. The manufacturing method of the liquid ejection head according to claim 1 , wherein the substrate has a rectangular planar shape, and protruding portions are provided at four corners of the substrate.

12. The manufacturing method of the liquid ejection head according to claim 11 , wherein the protruding portions are portions that are located at both ends in the longitudinal direction of the substrate and protrude relative to a middle part of sides extending in the longitudinal direction and that are located at both ends in the shorter direction of the substrate and protrude relative to a middle part of sides extending in the shorter direction.

Assignees

• Canon Kk

Inventors

• Hashimoto Yusuke
• Iri Junichiro
• Watanabe Makoto
• Ojima Masatomo

Classifications

• B41J2/14016

  Structure of bubble jet print heads · CPC title

• B41J2/1607

  Production of print heads with piezoelectric elements (B41J2/1606, B41J2/162 take precedence) · CPC title

• B41J2/1601

  Production of bubble jet print heads (B41J2/1606, B41J2/162 take precedence) · CPC title

• B41J2/14201

  Structure of print heads with piezoelectric elements · CPC title

• B41J2/1623

  bonding and adhesion · CPC title