Silver-containing solution and method of forming silver catalyst layer in chemical plating

Patent metadata

Field	Value
Publication number	US-12023653-B2
Application number	US-202217846433-A
Country	US
Kind code	B2
Filing date	Jun 22, 2022
Priority date	Feb 22, 2022
Publication date	Jul 2, 2024
Grant date	Jul 2, 2024

Abstract

A method of forming a silver catalyst layer in chemical plating includes providing a substrate; applying a silver-containing solution onto the substrate; and applying energy of activation to the silver-containing solution to form a silver catalyst layer over the substrate. The silver-containing solution includes silver ions, a diamine compound, a carboxylic acid compound, and a solvent. In addition, the substrate having the silver catalyst layer thereon can be immersed into a chemical plating solution to form a metal layer over the silver catalyst layer.

First claim

What is claimed is:

1. A silver-containing solution, consisting of:
silver ions;
a diamine compound;
a carboxylic acid compound; and
a solvent.

2. The silver-containing solution as claimed in claim 1 , wherein the silver-containing solution has a silver ion concentration of 0.01 M to 10 M.

3. The silver-containing solution as claimed in claim 1 , wherein the diamine compound comprises ethylene diamine, propylene diamine, or a combination thereof, and the diamine to the silver ions have a molar concentration ratio of 2.5:1 to 200:1.

4. The silver-containing solution as claimed in claim 1 , wherein the carboxylic acid compound comprises formic acid, acetic acid, citric acid, oxalic acid, malic acid, or a combination thereof, and the carboxylic acid compound to the silver ions have a molar concentration ratio of 0.1:1 to 1.2:1.

5. The silver-containing solution as claimed in claim 1 , wherein the solvent comprises water, alcohol, or a combination thereof.

6. A silver-containing solution consisting of:
silver ions;
a diamine compound;
a carboxylic acid compound;
a solvent; and
a dispersant.

7. A method of forming a silver catalyst layer in chemical plating, comprising:
providing a substrate;
applying a silver-containing solution onto the substrate;
applying energy of activation to the silver-containing solution to form a silver catalyst layer over the substrate;
wherein the silver-containing solution is consisting of:
silver ions;
a diamine compound;
a carboxylic acid compound; and
a solvent.

8. The method as claimed in claim 7 , wherein the silver-containing solution has a silver ion concentration of 0.01 M to 10 M.

9. The method as claimed in claim 7 , wherein the diamine compound comprises ethylene diamine, propylene diamine, or a combination thereof, and the diamine to the silver ions have a molar concentration ratio of 2.5:1 to 200:1.

10. The method as claimed in claim 7 , wherein the carboxylic acid compound comprises formic acid, acetic acid, citric acid, oxalic acid, malic acid, or a combination thereof, and the carboxylic acid compound to the silver ions have a molar concentration ratio of 0.1:1 to 1.2:1.

11. The method as claimed in claim 7 , wherein the solvent comprises water, alcohol, or a combination thereof.

12. The method as claimed in claim 7 , further comprising immersing the substrate having the silver catalyst layer thereon into a chemical plating solution to form a metal layer over the silver catalyst layer.

13. A method of forming a silver catalyst layer in chemical plating, comprising:
providing a substrate;
applying a silver-containing solution onto the substrate;
applying energy of activation to the silver-containing solution to form a silver catalyst layer over the substrate,
wherein the silver-containing solution is consisting of:
silver ions;
a diamine compound;
a carboxylic acid compound;
a solvent; and
a dispersant.

14. The method as claimed in claim 7 , wherein the energy of activation comprises plasma, pulsed light, ultraviolet radiation, or laser.

15. The method as claimed in claim 12 , wherein the chemical plating solution includes copper ions or nickel ions, and the metal layer includes a copper layer or a nickel layer.

Assignees

• Ind Tech Res Inst

Inventors

• Hsieh Hung-Yuan

Classifications

• B01J35/39

  Photocatalytic properties · CPC title

• C23C28/023 Primary

  only coatings of metal elements only · CPC title

• B01J33/00

  Protection of catalysts, e.g. by coating · CPC title

• C23C18/42

  Coating with noble metals · CPC title

• B01J37/349

  making use of flames, plasmas or lasers · CPC title