Electronic device

Patent metadata

Field	Value
Publication number	US-12020602-B2
Application number	US-202318372709-A
Country	US
Kind code	B2
Filing date	Sep 26, 2023
Priority date	Apr 19, 2018
Publication date	Jun 25, 2024
Grant date	Jun 25, 2024

Abstract

The present disclosure provides an electronic device including a substrate, a first circuit layer, and a plurality of diodes. The substrate has a plurality of first through holes. The first circuit layer is disposed on the substrate and has a plurality of light through holes. The diodes disposed on the first circuit layer. One of the light through holes is located between two adjacent ones of the diodes, and the light through holes overlap a portion of the plurality of first through holes and do not overlap another portion of the plurality of first through holes in a normal direction of the substrate.

First claim

What is claimed is:

1. An electronic device, comprising:
a substrate having a plurality of first through holes;
a first circuit layer disposed on the substrate and having a plurality of light through holes; and
a plurality of diodes disposed on the first circuit layer;
wherein one of the plurality of light through holes is located between two adjacent ones of the plurality of diodes, and the plurality of light through holes overlap a portion of the plurality of first through holes and do not overlap another portion of the plurality of first through holes in a normal direction of the substrate.

2. The electronic device as claimed in claim 1 , wherein a first spacing is defined as a distance between center points of two adjacent ones of the plurality of first through holes, a second spacing is defined as a distance between center points of two adjacent ones of the plurality of light through holes, and the first spacing is different from the second spacing.

3. The electronic device as claimed in claim 2 , wherein the first spacing and the second spacing are measured when the electronic device is not bent.

4. The electronic device as claimed in claim 1 , wherein a first spacing is defined as a distance between center points of two adjacent ones of the plurality of first through holes, another first spacing is defined as a distance between center points of two other adjacent ones of the plurality of first through holes, and a difference between the first spacing and the another first spacing is less than 0.5 times radius of curvature of the electronic device when the electronic device is bent.

5. The electronic device as claimed in claim 1 , wherein the first circuit layer comprises a first portion disposed on a first surface of the substrate and a second portion disposed on a second surface of the substrate, the second surface is opposite to the first surface, and the plurality of diodes are disposed on the first portion of the first circuit layer.

6. The electronic device as claimed in claim 1 , further comprising an insulating layer disposed on the first circuit layer.

7. The electronic device as claimed in claim 6 , wherein the insulating layer overlaps the first circuit layer but does not overlap the plurality of diodes in the normal direction of the substrate.

8. The electronic device as claimed in claim 6 , wherein the insulating layer comprises a shielding material.

9. The electronic device as claimed in claim 6 , wherein the insulating layer overlaps the plurality of light through holes in the normal direction of the substrate.

10. The electronic device as claimed in claim 1 , further comprising a second circuit layer overlapping the substrate, wherein the second circuit layer has a plurality of second through holes, and at least a portion of the plurality of second through holes overlap a portion of the plurality of diodes in the normal direction of the substrate.

Assignees

• Innolux Corp

Inventors

• Ting Chin-Lung
• Wei Chung-Kuang
• Mao Li-Wei
• Chang Chi-Liang
• Lin Chia-Hui

Classifications

• H10W90/00

  Package configurations · CPC title

• H10H29/30

  Active-matrix LED displays · CPC title

• H10H29/8508

  Package substrates, e.g. submounts · CPC title

• H10H29/857

  Interconnections (of active-matrix LED displays H10H29/49) · CPC title

• H05K1/028 Primary

  Bending or folding regions of flexible printed circuits (H05K1/0283 takes precedence) · CPC title