Systems and methods for producing non-standard shaped cards

US12020102B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12020102-B2
Application numberUS-202318133129-A
CountryUS
Kind codeB2
Filing dateApr 11, 2023
Priority dateJan 3, 2020
Publication dateJun 25, 2024
Grant dateJun 25, 2024

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  1. Title

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  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Example embodiments of systems and methods for card production are provided. A card may include processing circuitry including a chip and memory. The card may include one or more antennas in communication with the chip. The card may include a first layer of material aligned within a perimeter of the card via laminate encapsulation. The first layer of material may comprise a non-rectangular shape. The first layer of material may be offset with a shape of the card. The first layer of material may be in communication with the chip. The first layer of material may comprise at least one selected from the group of steel, tungsten, titanium, or any combination thereof. The card may be compliant with one or more form factors.

First claim

Opening claim text (preview).

What is claimed is: 1. A method for producing a card, comprising: applying a first body punch to the card so as to begin a predetermined shape; and applying a second body punch to the card so as to align an antenna with the predetermined shape, wherein one or more dimensions of the card exceed one or more dimensions of a form factor, and wherein a size of the card is smaller than a size associated with the form factor. 2. The method of claim 1 , wherein the form factor comprises at least one selected from the group of CR80 and CR100. 3. The method of claim 1 , further comprising: prior to applying the first body punch, performing one or more processes to the card, wherein the one or more processes comprise at least one selected from the group of plate making, sheet printing, sheet collation, and lamination. 4. The method of claim 1 , wherein: the card includes a magnetic strip, and the method further comprises, prior to applying the second body punch, coding a magnetic strip. 5. The method of claim 1 , further comprising, prior to applying the second body punch, marking the card by laser engraving. 6. The method of claim 1 , wherein the second body punch applies a punch module comprising the predetermined shape. 7. The method of claim 1 , wherein the predetermined shape comprises one or more apertures. 8. The method of claim 7 , wherein the one or more apertures are configured to house a contact pad. 9. The method of claim 1 , wherein the one or more apertures are configured to house a chip. 10. The method of claim 1 , wherein the predetermined shape comprises a non-rectangular shape. 11. The method of claim 10 , wherein the non-rectangular shape comprises a circular shape, an oval shape, an elliptical shape, a trapezoidal shape, a horseshoe shape, a bullet shape, or a door knob shape. 12. A card, comprising: a first shape, wherein: the first shape comprises a first layer of material, and the first shape comprises a non-rectangular shape; and a second shape comprising a perimeter of the card, wherein one or more dimensions of the card exceed one or more dimensions of a form factor, and wherein a size of the card is smaller than a size associated with the form factor. 13. The card of claim 12 , wherein the first shape is offset from the second shape. 14. The card of claim 12 , wherein the form factor comprises at least one selected from the group of CR80 and CR100. 15. The card of claim 12 , wherein: the first shape includes an aperture, and the card further comprises a chip housed within the aperture. 16. The card of claim 15 , wherein: the antenna is in communication with the chip, and the antenna is configured for the first shape. 17. The card of claim 12 , wherein the card is at least one selected from the group of a credit card, a debit card, a gift card, an identification card, a government card, a loyalty program card, and a transportation card. 18. A method for producing a card, comprising: providing a slug; applying a first body punch to the slug so as to begin a predetermined shape; and applying a second body punch to the slug so as to align an antenna with the predetermined shape, wherein one or more dimensions of the card exceed one or more dimensions of a form factor, and wherein a size of the card is smaller than a size associated with the form factor. 19. The method of claim 18 , wherein the predetermined shape comprises a non-rectangular shape. 20. The method of claim 18 , further comprising: prior to applying the first body punch, performing one or more processes to the slug, wherein the one or more processes comprise at least one selected from the group of sheet striping, hot stamping, chip module milling, and chip module implanting.

Assignees

Inventors

Classifications

  • the record carrier being multilayered, e.g. laminated sheets (flat articles in general, see B32B37/00) · CPC title

  • characterised by the shape · CPC title

  • Physical layout of the record carrier · CPC title

Patent family

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Frequently asked questions

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What does patent US12020102B2 cover?
Example embodiments of systems and methods for card production are provided. A card may include processing circuitry including a chip and memory. The card may include one or more antennas in communication with the chip. The card may include a first layer of material aligned within a perimeter of the card via laminate encapsulation. The first layer of material may comprise a non-rectangular shap…
Who is the assignee on this patent?
Capital One Services Llc
What technology area does this patent fall under?
Primary CPC classification G06K19/0772. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Jun 25 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 9 related publications on this page (citations in our corpus or others sharing the same primary CPC).