Supporting substrates for cutting elements, and related methods

Patent metadata

Field	Value
Publication number	US-12018533-B2
Application number	US-202218051184-A
Country	US
Kind code	B2
Filing date	Oct 31, 2022
Priority date	May 30, 2018
Publication date	Jun 25, 2024
Grant date	Jun 25, 2024

Abstract

A cutting element comprises a supporting substrate, and a cutting table attached to an end of the supporting substrate. The cutting table comprises inter-bonded diamond particles, and a thermally stable material within interstitial spaces between the inter-bonded diamond particles. The thermally stable material comprises a carbide precipitate having the general chemical formula, A3XZn-1, where A comprises one or more of Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Y, Zr, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Cd, Hf, Ta, W, Re, Os, Ir, Pt, Au, Hg, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Ac, Th, Pa, and U; X comprises one or more of Al, Ga, Sn, Be, Bi, Te, Sb, Se, As, Ge, Si, B, and P; Z comprises C; and n is greater than or equal to 0 and less than or equal to 0.75. A method of forming a cutting element, an earth-boring tool, a supporting substrate, and a method of forming a supporting substrate are also described.

First claim

What is claimed is:

1. A supporting substrate for a cutting element, comprising:
a homogenized binder comprising a substantially homogeneous peritectic alloy comprising C, W, at least one element selected from Sc, Ti, V, Cr, Mn, Fe, Ni, Cu, Zn, Y, Zr, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Cd, Hf, Ta, Re, Os, Ir, Pt, Au, Hg, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Ac, Th, Pa, and U, and at least one additional element selected from Al, Ga, Sn, Be, Bi, Te, Sb, Se, As, Ge, Si, B, and P; and
WC particles dispersed in the homogenized binder.

2. The supporting substrate of claim 1 , wherein the homogenized binder comprises the substantially homogeneous peritectic alloy having a melting temperature within a range of from about 750° C. to about 1500° C.

3. A method of forming a supporting substrate for a cutting element, comprising:
forming a precursor composition comprising:
discrete WC particles;
a binding agent; and
discrete particles comprising:
at least one element selected from Sc, Ti, V, Cr, Mn, Fe, Ni, Cu, Zn, Y, Zr, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Cd, Hf, Ta, Re, Os, Ir, Pt, Au, Hg, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Ac, Th, Pa, and U;
at least one additional element selected from Al, Ga, Sn, Be, Bi, Te, Sb, Se, As, Ge, Si, B, and P; and
at least one further element selected from C and W; and
subjecting the precursor composition to a consolidation process to form a homogenized binder between the discrete WC particles, the WC particles dispersed in the homogenized binder, the homogenized binder comprising a substantially homogeneous peritectic alloy comprising C, W, the at least one element, and the at least one additional element.

4. The method of claim 3 , wherein forming a precursor composition comprises forming the precursor composition to comprise the discrete WC particles, the binding agent, and discrete alloy particles individually comprising the at least one element, the at least one additional element, and the at least one further element.

5. The method of claim 3 , wherein forming the precursor composition comprises forming the precursor composition to comprise from about 5 wt % to about 15 wt % of the discrete particles, and from about 85 wt % to about 95 wt % of the discrete WC particles.

6. The method of claim 3 , wherein forming a precursor composition comprises forming the precursor composition to comprise the discrete WC particles, the binding agent, discrete elemental particles of the at least one element, discrete elemental particles of the at least one additional element, and discrete elemental particles of the at least one further element.

7. The method of claim 3 , wherein subjecting the precursor composition to a consolidation process comprises:
forming the precursor composition into a green structure through at least one shaping and pressing process;
removing the binding agent from and partially sintering the green structure to form a brown structure; and
subjecting the brown structure to a densification process.

8. The method of claim 7 , wherein subjecting the brown structure to a densification process comprises subjecting the brown structure to one or more of a sintering process, a HIP process, a sintered-HIP process, and a hot pressing process.

9. The method of claim 3 , further comprising performing at least one supplemental homogenization process to substantially completely homogenize the homogenized binder.

10. The method of claim 3 , further comprising selecting the discrete particles of the precursor composition to comprise:
from about 60 wt % to about to 98.75 wt % of the at least one element;
from about 2 wt % to about 40 wt % of the at least one additional element; and
from about 0.25 wt % to about 2.0 wt % of the at least one further element.

11. The method of claim 3 , further comprising selecting the binding agent to comprise paraffin wax.

12. The method of claim 3 , wherein subjecting the precursor composition to a consolidation process comprises heating the precursor composition to a temperature between a solidus temperature and a liquidus temperature of the discrete particles.

13. The method of claim 3 , wherein subjecting the precursor composition to a consolidation process comprises heating the precursor composition to a temperature greater than or equal to a liquidus temperature of the discrete particles.

14. A supporting substrate for a cutting element, comprising:
a homogenized binder comprising C, W, at least one element selected from Sc, Ti, V, Cr, Mn, Fe, Ni, Cu, Zn, Y, Zr, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Cd, Hf, Ta, Re, Os, Ir, Pt, Au, Hg, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Ac, Th, Pa, and U, and at least one additional element selected from Al, Ga, Sn, Be, Bi, Te, Sb, Se, As, Ge, Si, B, and P; and
WC particles dispersed in the homogenized binder, wherein the homogenized binder is substantially free of Co, Fe, and Ni.

15. The supporting substrate of claim 1 , wherein the at least one element comprises two or more of Sc, Ti, V, Cr, Mn, Fe, Ni, Cu, Zn, Y, Zr, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Cd, Hf, Ta, Re, Os, Ir, Pt, Au, Hg, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Ac, Th, Pa, and U.

16. The supporting substrate of claim 1 , wherein the at least one additional element comprises two or more of Al, Ga, Sn, Be, Bi, Te, Sb, Se, As, Ge, Si, B, and P.

17. A method of forming a supporting substrate for a cutting element, comprising:
forming a precursor composition comprising:
discrete WC particles;
a binding agent; and
discrete alloy particles individually having a liquidus temperature greater than or equal to about 525° C., the discrete alloy particles individually comprising:
at least one first element selected from Sc, Ti, V, Cr, Mn, Fe, Ni, Cu, Zn, Y, Zr, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Cd, Hf, Ta, Re, Os, Ir, Pt, Au, Hg, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Ac, Th, Pa, and U; and
at least one second element selected from Al, Ga, Sn, Be, Bi, Te, Sb, Se, As, Ge, Si, B, and P; and
subjecting the precursor composition to a consolidation process to form a homogenized binder comprising a substantially homogenized peritectic alloy binding the discrete WC particles, the WC particles dispersed in the homogenized binder, the homogenized peritectic alloy comprising C, W, the at least one first element, and the at least one second element.

18. The method of claim 17 , wherein forming a precursor composition comprises forming the precursor composition to be substantially free of each of Co, Ni, and Fe.

19. The method of claim 17 , wherein forming a precursor composition comprises forming the precursor composition to comprise about 88 wt % of the discrete WC particles and about 12 wt % of the discrete alloy particles.

Assignees

• Baker Hughes Holdings Llc

Inventors

• Cao Wanjun
• Bird Marc W

Classifications

• E21B10/5673

  having a non planar or non circular cutting face · CPC title

• E21B10/54

  the bit being of the rotary drag type, e.g. fork-type bits · CPC title

• B24D18/0009 Primary

  using moulds or presses · CPC title

• C22C26/00

  Alloys containing diamond {or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes} · CPC title

• C04B35/563

  based on boron carbide · CPC title