Thermoplastic resin composition and hot-melt adhesive

US12018182B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12018182-B2
Application numberUS-201917271989-A
CountryUS
Kind codeB2
Filing dateSep 2, 2019
Priority dateSep 4, 2018
Publication dateJun 25, 2024
Grant dateJun 25, 2024

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  1. Title

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  2. Abstract

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  5. First independent claim

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Abstract

Official abstract text for this publication.

The present invention relates to a thermoplastic resin composition containing a base polymer containing a propylene-based polymer (A) in which a melting endotherm (ΔH-D) is 0 J/g or more and 60 J/g or less, and a melting point (Tm-D) is not observed or is 0° C. or higher and 120° C. or lower; and a propylene-based polymer (C) in which a melting endotherm (ΔH-D) is 20 J/g or more and 120 J/g or less, and a melting point (Tm-D) is higher than 120° C., the content of the propylene-based polymer (C) being 0.5 parts by mass or more and 100 parts by mass or less relative to 100 parts by mass of the content of the propylene-based polymer (A).

First claim

Opening claim text (preview).

The invention claimed is: 1. A thermoplastic resin composition, comprising: a base polymer comprising (A) a propylene-based polymer (A) having a melting endotherm (ΔH-D) in a range of from 0 to 60 J/g, and a melting point (Tm-D) is in a range of from 0 to 120° C., and (B) an ethylene-based polymer having a melting endotherm (ΔH-D) in a range of from 0 to 120 J/g; and a propylene-based polymer (C) in which a melting endotherm (ΔH-D) is in a range of from 20 to 120 J/g, and a melting point (Tm-D) is higher than 120° C., wherein a content of the propylene-based polymer (C) is in a range of from 0.5 to 50 parts by mass, relative to 100 parts by mass of the propylene-based polymer (A), wherein the ethylene-based polymer (B) is present in 10,000 parts by mass or less, relative to 100 parts by mass of the propylene-based polymer (A), and wherein the propylene-based polymer (A) is a propylene homopolymer. 2. The composition of claim 1 , wherein the melting point (Tm-D) of the propylene-based polymer (C) is 150° C. or lower. 3. The composition of claim 1 , wherein a total content of the propylene-based polymer (A) and the ethylene-based polymer (B) occupying in the thermoplastic resin composition is more than 70% by mass. 4. The composition of claim 1 , wherein a total content of the propylene-based polymer (A) and the ethylene-based polymer (B) occupying in the thermoplastic resin composition is 70% by mass or less. 5. The composition of claim 1 , wherein the content of the propylene-based polymer (A) is 50% by mass or more, relative to a total mass of the propylene-based polymer (A) and the ethylene-based polymer (B). 6. The composition of claim 1 , further comprising: a linear hydrocarbon-based wax (D) in which a melting endotherm (ΔH-D) is more than 120 J/g and 300 J/g or less, wherein a content of the linear hydrocarbon-based wax (D) is 10,000 parts by mass or less, relative to 100 parts by mass of the base polymer. 7. The composition of claim 1 , wherein the propylene-based polymer (A) comprises a structural unit selected from the group consisting of ethylene and an α-olefin having 4 to 30 carbon atoms in an amount of more than 0 mol % and 40 mol % or less. 8. The composition of claim 1 , further comprising: an oil (E). 9. The composition of claim 1 , further comprising: a tackifier (F). 10. The composition of claim 1 , further comprising: a nucleating agent (G). 11. The composition of claim 10 , wherein the nucleating agent (G) is at least one selected from the group consisting of a sorbitol-based nucleating agent and a nonitol-based nucleating agent. 12. A method of producing the thermoplastic resin composition of claim 1 , the method comprising: mixing at least the base polymer and the propylene-based polymer (C) at lower than 160° C. 13. A hot-melt adhesive, comprising: the thermoplastic resin composition of claim 1 . 14. A thermoplastic resin composition, comprising: a base polymer comprising (A) a propylene-based polymer (A) having a melting endotherm (ΔH-D) in a range of from 0 to 60 J/g, and a melting point (Tm-D) is not observed, and (B) an ethylene-based polymer having a melting endotherm (ΔH-D) in a range of from 0 to 120 J/g; and a propylene-based polymer (C) in which a melting endotherm (ΔH-D) is in a range of from 20 to 120 J/g, and a melting point (Tm-D) is higher than 120° C., wherein a content of the propylene-based polymer (C) is in a range of from 0.5 to 50 parts by mass, relative to 100 parts by mass of the propylene-based polymer (A), wherein the ethylene-based polymer (B) is present in 10,000 parts by mass or less, relative to 100 parts by mass of the propylene-based polymer (A), and wherein the propylene-based polymer (A) is a propylene homopolymer. 15. The composition of claim 14 , wherein the melting point (Tm-D) of the propylene-based polymer (C) is 150° C. or lower. 16. The composition of claim 14 , wherein a total content of the propylene-based polymer (A) and the ethylene-based polymer (B) occupying in the thermoplastic resin composition is more than 70% by mass. 17. The composition of claim 14 , wherein a total content of the propylene-based polymer (A) and the ethylene-based polymer (B) occupying in the thermoplastic resin composition is 70% by mass or less. 18. The composition of claim 14 , wherein the content of the propylene-based polymer (A) is 50% by mass or more, relative to a total mass of the propylene-based polymer (A) and the ethylene-based polymer (B). 19. The composition of claim 14 , further comprising: a linear hydrocarbon-based wax (D) in which a melting endotherm (ΔH-D) is more than 120 J/g and 300 J/g or less, wherein a content of the linear hydrocarbon-based wax (D) is 10,000 parts by mass or less, relative to 100 parts by mass of the base polymer. 20. The composition of claim 14 , wherein the propylene-based polymer (A) comprises a structural unit selected from the group consisting of ethylene and an α-olefin having 4 to 30 carbon atoms in an amount of more than 0 mol % and 40 mol % or less.

Assignees

Inventors

Classifications

  • Presence of oils, fats or waxes · CPC title

  • Presence of homo or copolymers of propene · CPC title

  • Presence of homo or copolymers of ethene · CPC title

  • Adhesives based on oils, fats or waxes; Adhesives based on derivatives thereof · CPC title

  • Copolymers of ethene with aliphatic 1-olefins · CPC title

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What does patent US12018182B2 cover?
The present invention relates to a thermoplastic resin composition containing a base polymer containing a propylene-based polymer (A) in which a melting endotherm (ΔH-D) is 0 J/g or more and 60 J/g or less, and a melting point (Tm-D) is not observed or is 0° C. or higher and 120° C. or lower; and a propylene-based polymer (C) in which a melting endotherm (ΔH-D) is 20 J/g or more and 120 J/g or …
Who is the assignee on this patent?
Idemitsu Kosan Co
What technology area does this patent fall under?
Primary CPC classification C09J123/12. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Jun 25 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 9 related publications on this page (citations in our corpus or others sharing the same primary CPC).