Composite repair armature
US-2018264759-A1 · Sep 20, 2018 · US
Fitting method and repair method
US12017424B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12017424-B2 |
| Application number | US-202017437985-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 28, 2020 |
| Priority date | Mar 14, 2019 |
| Publication date | Jun 25, 2024 |
| Grant date | Jun 25, 2024 |
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- Title
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Abstract
Official abstract text for this publication.
A fitting method is for fitting a material to be repaired and a repair patch to be adhesively bonded to the material at adhesive surfaces, each adhesive surface having at least two or more of curved portions. The fitting method includes measuring a shape of the material; measuring a shape of the repair patch; dividing repair patch shape measurement data acquired at measuring the shape of repair patch into pieces of divided data each including one or less of the curved portions; performing, at the adhesive surfaces, fitting processing of the pieces of divided data acquired at dividing the repair patch shape measurement data to material-to-be-repaired shape measurement data acquired at measuring the shape of material; and calculating a gap amount between the material-to-be-repaired shape measurement data and repair patch shape fitting data acquired from the fitting processing at the adhesive surfaces.
First claim
Opening claim text (preview).
The invention claimed is: 1. A fitting method for fitting a material to be repaired and a repair patch to be adhesively bonded to the material to be repaired at adhesive surfaces where the material to be repaired and the repair patch are adhesively bonded, each adhesive surface having at least two or more of curved portions, the fitting method comprising: measuring a shape of the material to be repaired; measuring a shape of the repair patch; dividing repair patch shape measurement data acquired at measuring the shape of repair patch into a plurality of pieces of divided data each including one or less of the curved portions; performing, at the adhesive surfaces, fitting processing of the pieces of divided data acquired at dividing the repair patch shape measurement data to material-to-be-repaired shape measurement data acquired at measuring the shape of material to be repaired; and calculating a gap amount between the material-to-be-repaired shape measurement data and repair patch shape fitting data acquired from the fitting processing at the adhesive surfaces. 2. The fitting method according to claim 1 , wherein, at dividing the repair patch shape measurement data, two pieces of the divided data share a major fitting planar portion that is a planar portion where the material to be repaired and the repair patch are actually fitted with the gap amount equal to or smaller than a certain amount. 3. The fitting method according to claim 1 , further comprising calculating an additional amount of an adhesive additionally disposed on the adhesive surfaces based on the calculated gap amount. 4. A repair method for repairing a material to be repaired by adhesively bonding a repair patch to the material to be repaired, the repair method comprising: machining an adhesive surface of the material to be repaired; forming the repair patch to coincide with the adhesive surface of the material to be repaired; processing fitting computation based on the fitting method according to claim 1 ; and adhesively bonding the repair patch to the material to be repaired based on the gap amount calculated at the fitting computation.
Assignees
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Classifications
- B29C73/10Primary
using patches sealing on the surface of the article (B29C73/14 takes precedence) · CPC title
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Frequently asked questions
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- What does patent US12017424B2 cover?
- A fitting method is for fitting a material to be repaired and a repair patch to be adhesively bonded to the material at adhesive surfaces, each adhesive surface having at least two or more of curved portions. The fitting method includes measuring a shape of the material; measuring a shape of the repair patch; dividing repair patch shape measurement data acquired at measuring the shape of repair…
- Who is the assignee on this patent?
- Mitsubishi Heavy Ind Ltd
- What technology area does this patent fall under?
- Primary CPC classification B29C73/10. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Jun 25 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).