Molding device

Patent metadata

Field	Value
Publication number	US-12017401-B2
Application number	US-202318164268-A
Country	US
Kind code	B2
Filing date	Feb 3, 2023
Priority date	Feb 24, 2022
Publication date	Jun 25, 2024
Grant date	Jun 25, 2024

Abstract

A molding device may comprise a mold, a plate, and a ring. The mold may comprise: a lower surface; an upper surface parallel to the lower surface; a hole defined in a part of the upper surface; and a through hole extending from a bottom surface of the hole to the lower surface of the mold. The plate may comprise a surface with a gas outlet defined therein. The ring may be arranged between the lower surface of the mold and the surface of the plate and connecting the mold and the plate. The ring may surround the through hole exposed on the lower surface of the mold and the gas outlet exposed on the surface of the plate. In a region where the ring is not arranged, a space may be defined between the lower surface of the mold and the surface of the plate.

First claim

What is claimed is:

1. A molding device comprising a mold, a plate, and a ring, wherein
the mold comprises:
a lower surface,
an upper surface parallel to the lower surface,
a hole in a part of the upper surface, and
a through hole extending from a bottom surface of the hole to the lower surface of the mold;

the plate comprises a surface with a gas outlet;
the ring is a separate member from the plate and the mold;
the surface of the plate includes a first recess corresponding to a shape of the ring;
the ring is in the first recess and an upper end of the ring protrudes out from the surface of the plate;
the ring and the first recess have a circular ring shape centered on a center axis which extends through a center of the hole and is orthogonal to the lower surface of the mold;
a radius from the center axis to an outer circumference of the ring is equal to a radius from the center axis to an inner circumference of the first recess;
the ring is between the lower surface of the mold and the surface of the plate and connects the mold and the plate;
the ring surrounds the through hole on the lower surface of the mold and the gas outlet on the surface of the plate; and
in a region where the ring is not, a space is between the lower surface of the mold and the surface of the plate.

2. The molding device according to claim 1 , wherein a melting point of the ring is equal to or higher than 800° C.

3. The molding device according to claim 1 , wherein a distance from the center axis to the outer circumference of the ring is smaller than a distance from the center axis to an outer circumference of the mold.

4. The molding device according to claim 1 , wherein the ring has the circular ring shape when seen along a direction orthogonal to the lower surface of the mold.

5. The molding device according to claim 1 , wherein the surface of the plate further includes a second recess that is on an inner circumferential side of the first recess, and
the second recess has a greater depth than the first recess.

6. The molding device according to claim 1 , wherein the ring has a circular cross-section.

7. A molding device comprising a mold, a plate, a first ring and a second ring, wherein
the mold comprises:
a lower surface,
an upper surface parallel to the lower surface,
a hole in a part of the upper surface, and
a through hole extending from a bottom surface of the hole to the lower surface of the mold;

the plate comprises a surface with a gas outlet;
the first ring is integrated with the plate and protrudes out from the surface of the plate;
the second ring is integrated with the mold and protrudes out from the lower surface of the mold;
the first ring includes a first tapered surface on a radially inner side of the first ring;
the second ring includes a second tapered surface on a radially outer side of the second ring;
the first tapered surface and the second tapered surface are in contact with each other and connect the mold and the plate;
the first ring surrounds the through hole on the lower surface of the mold and the gas outlet on the surface of the plate; and
in a region where the ring is not, a space is between the lower surface of the mold and the surface of the plate.

Assignees

• Toyota Chuo Kenkyusho Kk

Inventors

• Fujitsuka Norio
• Shimaoka Keiichi
• Akashi Teruhisa
• Harada Shota
• Inagaki Yuuki
• Goto Katsuaki
• Ito Keitaro
• Yoshida Takahiko

Classifications

• B29C51/08

  Deep drawing or matched-mould forming, i.e. using mechanical means only · CPC title

• B29C51/18

  Thermoforming apparatus · CPC title

• B29C51/10

  Forming by pressure difference, e.g. vacuum · CPC title

• B29C51/421

  of preforms, specially adapted for thermoforming (preheating sheets in general B29B13/023; B29C51/427 takes precedence) · CPC title

• B29C51/40 Primary

  Venting means · CPC title