Self-terminating etching interfaces using iodine-based chemistries

Patent metadata

Field	Value
Publication number	US-12017276-B2
Application number	US-202217697814-A
Country	US
Kind code	B2
Filing date	Mar 17, 2022
Priority date	Mar 17, 2021
Publication date	Jun 25, 2024
Grant date	Jun 25, 2024

Abstract

A method is provided to remove a selective amount of material from a metal component fabricated by additive manufacturing in a self-terminating manner. The method can be used to remove support structures and trapped powder from a metal component as well as to smooth surfaces of a 3D printed metal component. In some embodiments, selected surfaces of the metal component are treated to make the selected surfaces at least one of mechanically and chemically unstable. The unstable portion of the metal support can then be removed chemically, electrochemically, or through vapor-phase etching. The method can be used for processing any fluid or vapor-accessible regions and surfaces of a 3D printed metal component.

First claim

What is claimed is:

1. A self-terminating process for removing a sensitized region of a material, comprising:
applying a sensitizing agent to a surface of the material, wherein the material comprises a metal material, and the sensitizing agent comprises a halide material in a gaseous state;
heating the material at an elevated temperature between approximately 30 and 900° C. to cause the sensitizing agent to diffuse into the material and create the sensitized region in the material adjacent to the surface; and
applying an etchant to the sensitized region to dissolve and remove the sensitized region of the material.

2. The process of claim 1 , wherein the metal material comprises at least one of a copper, a chromium, a niobium, a stainless steel material, an Inconel material, a nickel based alloy, a titanium material, or an aluminum material.

3. The process of claim 1 , wherein the heating is conducted for between approximately 20 and 1200 minutes.

4. The process of claim 1 , wherein the sensitized region has a depth between approximately 10 and 200 μm.

5. The process of claim 1 , wherein the material is a part and a support joined at a connection having a separation dimension from an outer perimeter of the connection, wherein the sensitized region has a depth that is greater than or equal to the separation dimension.

6. The process of claim 5 , wherein the connection has a cross section with a circular shape, and the separation dimension is a radius of the circular shape.

7. The process of claim 5 , wherein the material further includes the part and a second support joined at a second connection that has a second separation dimension from an outer perimeter of the second connection, wherein the second separation dimension is larger than the separation dimension, and the sensitized region has a depth that is greater than or equal to the second separation dimension such that dissolution of the sensitized region separates the second support from the part.

Assignees

• Colorado School Of Mines

Inventors

• Hildreth Owen
• Heilig Meredith
• Yazdanparast Sanaz
• Raikar Subbarao

Classifications

• C23F1/12

  Gaseous compositions · CPC title

• B22F2301/205

  Titanium, zirconium or hafnium · CPC title

• B22F2301/15

  Nickel or cobalt · CPC title

• B22F2301/10

  Copper · CPC title

• C23F3/02

  Light metals · CPC title