Encapsulating composition

Patent metadata

Field	Value
Publication number	US-12016187-B2
Application number	US-201916972233-A
Country	US
Kind code	B2
Filing date	Sep 10, 2019
Priority date	Sep 11, 2018
Publication date	Jun 18, 2024
Grant date	Jun 18, 2024

Abstract

The present application provides an encapsulating composition which can effectively block moisture or oxygen introduced into an organic electronic device from the outside, and has excellent spreadability, is applicable to thin organic electronic devices and has excellent hardness of the cured product after curing, without causing an inter-circuit interference problem.

First claim

The invention claimed is:

1. An encapsulating composition comprising an aliphatic carbobicycle compound having one or more functional groups; an epoxy compound having a cyclic structure in the molecular structure; a linear or branched aliphatic epoxy compound; and a compound having an oxetane group,
wherein the aliphatic carbobicycle compound is included in a range of 1 part by weight to 50 parts by weight relative to 100 parts by weight of the encapsulating composition,
the epoxy compound having a cyclic structure in the molecular structure is included in a range of 5 parts by weight to 150 parts by weight relative to 100 parts by weight of the aliphatic carbobicycle compound,
the linear or branched aliphatic epoxy compound is included in a range of 20 parts by weight to 300 parts by weight relative to 100 parts by weight of the aliphatic carbobicycle compound, and
the compound having an oxetane group is included in a range of 40 parts by weight to 800 parts by weight relative to 100 parts by weight of the aliphatic carbobicycle compound, and
wherein the encapsulating composition has a viscosity of 50 cP or less as measured at room temperature.

2. The encapsulating composition according to claim 1 , wherein an organic layer formed by curing the encapsulating composition has a dielectric constant in a range of 2.0 to 3.5.

3. The encapsulating composition according to claim 1 further comprising a photoinitiator.

4. The encapsulating composition according to claim 3 , wherein the photoinitiator is included in a range of 5 parts by weight to 80 parts by weight relative to 100 parts by weight of the aliphatic carbobicycle compound.

5. The encapsulating composition according to claim 1 , wherein the encapsulating composition is photo-cured at a light quantity of 300 mJ/cm 2 to 6,000 mJ/cm 2 .

6. The encapsulating composition according to claim 1 , wherein a cured product of the encapsulating composition has pencil hardness of 2H or more.

7. The encapsulating composition according to claim 1 , wherein the encapsulating composition is an ink composition in a solventless form.

8. The encapsulating composition according to claim 1 , wherein the aliphatic carbobicycle compound has one or more functional groups selected from an epoxy group or a (meth)acryl group.

9. The encapsulating composition according to claim 1 , wherein the aliphatic carbobicycle compound is bicyclo[2.2.1]heptane, biscyclo[3.1.1]heptane, bicyclo[3.2.1]octane, bicyclo[4.3.2]undecane, or biscyclo[3.3.3]undecane.

10. The encapsulating composition according to claim 1 , wherein the aliphatic carbobicycle compound is represented by Formula 1 or Formula 2 below:

in Formulas 1 and 2 above,
R represents a C 1-6 alkylene group unsubstituted or substituted with a C 1-4 alkyl group, and
R 1 to R 6 each independently represent hydrogen, a C 1-4 alkyl group, or a (meth)acryl group, or together with an adjacent substituent form an alicyclic ring or an epoxy group,
where Formulas 1 and 2 comprise at least one (meth)acryl group or epoxy group.

11. The encapsulating composition according to claim 1 , wherein the epoxy compound having a cyclic structure in the molecular structure is 3,4-epoxycyclohexylmethyl-3′,4′-epoxycyclohexane carboxylate, vinylcyclohexene dioxide, 1,4-cyclohexanedimethanol bis(3,4-epoxycyclohexanecarboxylate), 1,2-epoxy-4-vinylcyclohexane, 1,1′-bi-7-oxabicyclo[4.1.0]heptane, or derivatives thereof.

12. The encapsulating composition according to claim 1 , wherein the linear or branched aliphatic epoxy compound is 1,4-butanediol diglycidyl ether, ethyleneglycol diglycidyl ether, 1,6-hexanediol diglycidyl ether, propyleneglycol diglycidyl ether, diethyleneglycol diglycidyl ether, butyl glycidyl ether, 2-ethylhexyl glycidyl ether or neopentylglycol diglycidyl ether.

13. The encapsulating composition according to claim 1 , wherein the compound having an oxetane group is bis[1-ethyl(3-oxetyl)]methyl ether, 3-ethyl-3-(cyclohexyl)methyl oxetane, oxetane silicate, 3-ethyl-3-hydroxymethyl-oxetane, 1,4-bis[{(3-ethyloxetan-1-yl)methoxy}methyl]benzene, 3-ethyl-3-[(2-ethylhexyloxy)methyl]oxetane, 3-ethyl-3-hydroxymethyl-oxetane, 4,4′-bis[(3-ethyl-3-oxetanyl)methoxymethyl]bisphenyl, bis[(3-ethyl-3-oxetanyl)methyl] terephthalate or (3-ethyl-3-oxetanyl)methoxymethyl methacrylate.

Assignees

• Lg Chemical Ltd

Inventors

• Kwak Ji Won
• Kim Joon Hyung
• Choi Kook Hyun
• Yu Mi Lim
• Lee Yung Jong

Classifications

• H10K59/873

  Encapsulations · CPC title

• H10K10/88 Primary

  Passivation; Containers; Encapsulations · CPC title

• C09D11/38 Primary

  characterised by non-macromolecular additives other than solvents, pigments or dyes · CPC title

• C09D11/101

  Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing · CPC title

• C08K5/01

  Hydrocarbons {(C08K5/0091 takes precedence)} · CPC title