Electronic device including antenna

Patent metadata

Field	Value
Publication number	US-12015193-B2
Application number	US-202017423724-A
Country	US
Kind code	B2
Filing date	Jan 7, 2020
Priority date	Jan 23, 2019
Publication date	Jun 18, 2024
Grant date	Jun 18, 2024

Abstract

Disclosed is an electronic device including: a housing including a first plate, a second plate facing away from the first plate, and a side member surrounding a space between the first plate and the second plate, connected to the second plate or integrally formed with the second plate, and including a first portion comprising a conductive material, wherein the first portion of the side member includes a plurality of through-holes aligned in a first direction substantially parallel to the first plate and a non-conductive material inside the through-holes; a structure disposed inside the space to face the through-holes and including at least one conductive path; and a wireless communication circuit electrically connected to the conductive path. Various other embodiments inferred from the specification are also possible.

First claim

The invention claimed is:

1. An electronic device comprising:
a housing including a first plate, a second plate facing away from the first plate, and a side member surrounding a space between the first plate and the second plate, connected with the second plate or integrally formed with the second plate, and including a first portion including a conductive material, wherein the first portion of the side member includes:
a plurality of through-holes arranged in a first direction substantially parallel to the first plate;
a structure disposed in the space so as to face the through-holes and including a plurality of feeding parts; and
a wireless communication circuit electrically connected with the plurality of feeding parts,
wherein each of the plurality of through-holes includes:
a first slit extended in a third direction being different from the first direction or a second direction perpendicular to the first direction; and
a second slit extended in a fourth direction perpendicular to the third direction, and wherein the plurality of feeding parts includes:
a first feeding part overlapping the first slit and extended in the fourth direction; and
a second feeding part overlapping the second slit and extended in the third direction, wherein each of the first feeding part and the second feeding part includes:
a plurality of conductive paths including a first path, a second path, and a third path; and
a slit of a triangle form disposed at a junction at which the first path is coupled with the second path and the third path.

2. The electronic device of claim 1 , wherein the first feeding part is disposed in a first layer; and
the second feeding part is disposed in a second layer beneath the first layer.

3. The electronic device of claim 2 ,
wherein the second path is extended from one end of the first path;
wherein the third path is extended from the one end of the first path and spaced from the second path, and
wherein connection parts of the first path are connected with the wireless communication circuit.

4. The electronic device of claim 3 , further comprising:
a first conductive pattern connected with an end portion of the second path; and
a second conductive pattern connected with an end portion of the third path.

5. The electronic device of claim 3 ,
wherein a line width of the first path increases as a distance from one side at which the first path is coupled with the second path and the third path decreases.

6. An electronic device comprising:
a housing including a side member;
a radiator formed at a first portion of the side member, the first portion including a conductive material; and
a plurality of feeding parts configured to feed the radiator,
wherein the radiator includes:
a plurality of through-holes disposed in a slot form and arranged in a first direction,
wherein each of the plurality of feeding parts includes a plurality of conductive paths, and
wherein at least two feeding parts among the plurality of feeding parts are disposed to partially overlap the same through-hole,
wherein each of the plurality of through-holes includes:
a first slit extended in a third direction being different from the first direction or a second direction perpendicular to the first direction; and
a second slit extended in a fourth direction perpendicular to the third direction, and wherein the at least two feeding parts include:
a first feeding part overlapping the first slit and extended in the fourth direction; and
a second feeding part overlapping the second slit and extended in the third direction, wherein each of the first feeding part and the second feeding part includes:
a plurality of conductive paths including a first path, a second path, and a third path; and
a slit of a triangle form disposed at a junction at which the first path is coupled with the second path and the third path.

7. The electronic device of claim 6 , wherein the at least two feeding parts disposed to partially overlap the same through-hole transfer in-phase signals to the same through-hole.

8. The electronic device of claim 7 , further comprising:
a wireless communication circuit including a plurality of power amplifiers,
wherein the plurality of power amplifiers are respectively electrically connected with the plurality of conductive paths.

9. The electronic device of claim 6 , wherein the first feeding part is disposed in a first layer,
wherein the second feeding part is disposed in a second layer beneath the first layer, and
wherein the first feeding part and the second feeding part feed signals polarized in different phases.

10. The electronic device of claim 6 , wherein the first slit and the second slit are fed by using different feeding parts.

11. The electronic device of claim 6 , wherein the first slit and the second slit form an angle of 45 degrees with the first direction in which the plurality of through-holes are arranged, and
wherein the first slit and the second slit are fed with signals polarized to have a phase difference of 90 degrees.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Kim Dongyeon
• Park Seongjin
• Park Sehyun
• Yun Sumin
• Jeong Myunghun
• Jong Jehun
• Jo Jaehoon

Classifications

• H01Q1/40

  Radiating elements coated with or embedded in protective material · CPC title

• H01Q1/38

  formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface  H01Q15/142)} · CPC title

• H01Q5/35

  using two or more simultaneously fed points · CPC title

• H01Q1/46

  Electric supply lines or communication lines · CPC title

• H04M1/0277

  for a printed circuit board assembly · CPC title