Multilayer ceramic electronic component and manufacturing method thereof
US-2021035740-A1 · Feb 4, 2021 · US
US12014879B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12014879-B2 |
| Application number | US-202217903302-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 6, 2022 |
| Priority date | Sep 8, 2021 |
| Publication date | Jun 18, 2024 |
| Grant date | Jun 18, 2024 |
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A multilayer electronic component includes a plurality of dielectric layers and a plurality of electrode layers that are alternately stacked. A skewness of a distribution of thicknesses of the plurality of dielectric layers at a plurality of arbitrary locations of the plurality of dielectric layers is 0.2 or more.
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What is claimed is: 1. A multilayer electronic component, comprising: a plurality of dielectric layers; and a plurality of electrode layers, wherein the plurality of dielectric layers and the plurality of electrode layers are alternately stacked, wherein a skewness of a distribution of thicknesses of the plurality of dielectric layers at a plurality of arbitrary locations of the plurality of dielectric layers is 0.2 or more. 2. The multilayer electronic component according to claim 1 , wherein the skewness of the distribution is 0.6 or less. 3. The multilayer electronic component according to claim 1 , wherein a kurtosis of the distribution is 3.2 or more. 4. The multilayer electronic component according to claim 3 , wherein the kurtosis of the distribution is 5.0 or less. 5. The multilayer electronic component according to claim 1 , wherein an average value of the thicknesses of the plurality of dielectric layers is 0.4 μm or less.
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