Multilayer electronic component

US12014879B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12014879-B2
Application numberUS-202217903302-A
CountryUS
Kind codeB2
Filing dateSep 6, 2022
Priority dateSep 8, 2021
Publication dateJun 18, 2024
Grant dateJun 18, 2024

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A multilayer electronic component includes a plurality of dielectric layers and a plurality of electrode layers that are alternately stacked. A skewness of a distribution of thicknesses of the plurality of dielectric layers at a plurality of arbitrary locations of the plurality of dielectric layers is 0.2 or more.

First claim

Opening claim text (preview).

What is claimed is: 1. A multilayer electronic component, comprising: a plurality of dielectric layers; and a plurality of electrode layers, wherein the plurality of dielectric layers and the plurality of electrode layers are alternately stacked, wherein a skewness of a distribution of thicknesses of the plurality of dielectric layers at a plurality of arbitrary locations of the plurality of dielectric layers is 0.2 or more. 2. The multilayer electronic component according to claim 1 , wherein the skewness of the distribution is 0.6 or less. 3. The multilayer electronic component according to claim 1 , wherein a kurtosis of the distribution is 3.2 or more. 4. The multilayer electronic component according to claim 3 , wherein the kurtosis of the distribution is 5.0 or less. 5. The multilayer electronic component according to claim 1 , wherein an average value of the thicknesses of the plurality of dielectric layers is 0.4 μm or less.

Assignees

Inventors

Classifications

  • Ceramic dielectrics {(H01G4/085 takes precedence)} · CPC title

  • Form of non-self-supporting electrodes · CPC title

  • H01G4/30Primary

    Stacked capacitors (H01G4/33 takes precedence) · CPC title

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Frequently asked questions

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What does patent US12014879B2 cover?
A multilayer electronic component includes a plurality of dielectric layers and a plurality of electrode layers that are alternately stacked. A skewness of a distribution of thicknesses of the plurality of dielectric layers at a plurality of arbitrary locations of the plurality of dielectric layers is 0.2 or more.
Who is the assignee on this patent?
Tdk Corp
What technology area does this patent fall under?
Primary CPC classification H01G4/30. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jun 18 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).