Insulated wire with bonding layer
US-2022084721-A1 · Mar 17, 2022 · US
Insulated wire with bonding layer of polyolefin and polyamide
US12014849B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12014849-B2 |
| Application number | US-201917422291-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 26, 2019 |
| Priority date | Jan 16, 2019 |
| Publication date | Jun 18, 2024 |
| Grant date | Jun 18, 2024 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
An insulated wire with bonding layer includes: a conductor; an insulating coating layer that covers an outer circumference of the conductor; and a bonding layer that is provided on an outer side of the insulating coating layer and is bonded by heat, wherein the insulating coating layer contains polyvinyl chloride, and the bonding layer contains a modified polyolefin resin and a polyamide resin.
First claim
Opening claim text (preview).
What is claimed is: 1. An insulated wire with bonding layer comprising: a conductor; an insulating coating layer that covers an outer circumference of the conductor; and a bonding layer that is provided on an outer side of the insulating coating layer and is bonded by heat, wherein the insulating coating layer contains polyvinyl chloride, the bonding layer contains a modified polyolefin resin and a polyamide resin, and does not contain a polymer component apart from the modified polyolefin resin and the polyamide resin or contains only at most 30 parts by mass of the polymer component apart from the modified polyolefin resin and the polyamide resin with respect to 100 parts by mass of the total polymer components, the modified polyolefin resin is obtained by introducing an ester group into a base polyolefin, the polyamide resin is a nylon-based hot-melt resin, and the nylon-based hot-melt resin has a structure of one of an amino acid, a dicarboxylic acid, and a diamine, and has a saturated aliphatic compound having 6 to 11 carbon atoms as a monomer. 2. The insulated wire with bonding layer according to claim 1 , wherein the bonding layer contains at least 5 parts by mass of the polyamide resin with respect to 100 parts by mass of the polymer components. 3. The insulated wire with bonding layer according to claim 1 , wherein the bonding layer is provided on the outer side of the insulating coating layer over the entire circumference in the circumference direction. 4. The insulated wire with bonding layer according to claim 1 , wherein the insulated wire with bonding layer is bonded via the bonding layer to a member containing a polyolefin resin. 5. The insulated wire with bonding layer according to claim 1 , wherein the bonding layer is an extrusion molded body having a thickness of 0.03 to 0.12 mm. 6. The insulated wire with bonding layer according to claim 1 , wherein the content of the polyamide resin in the bonding layer is at most 70 parts by mass with respect to 100 parts by mass of the polymer components. 7. The insulated wire with bonding layer according to claim 1 , wherein the base polyolefin of the modified polyolefin resin is a polyolefin derived from α-olefin as a monomer. 8. The insulated wire with bonding layer according to claim 7 , wherein the base polyolefin of the modified polyolefin resin is polypropylene.
Assignees
Inventors
Classifications
- H01B13/148Primary
Selection of the insulating material therefor · CPC title
comprising one or more extruded layers of insulation · CPC title
- H01B7/40Primary
with arrangements for facilitating mounting or securing · CPC title
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Frequently asked questions
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- What does patent US12014849B2 cover?
- An insulated wire with bonding layer includes: a conductor; an insulating coating layer that covers an outer circumference of the conductor; and a bonding layer that is provided on an outer side of the insulating coating layer and is bonded by heat, wherein the insulating coating layer contains polyvinyl chloride, and the bonding layer contains a modified polyolefin resin and a polyamide resin.
- Who is the assignee on this patent?
- Autonetworks Technologies Ltd, Sumitomo Wiring Systems, Sumitomo Electric Industries
- What technology area does this patent fall under?
- Primary CPC classification H01B13/148. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jun 18 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).