Substrate for color conversion, manufacturing method therefor, and display device comprising same
US-2017299792-A1 · Oct 19, 2017 · US
US12013609B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12013609-B2 |
| Application number | US-202318156286-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 18, 2023 |
| Priority date | Apr 16, 2021 |
| Publication date | Jun 18, 2024 |
| Grant date | Jun 18, 2024 |
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A display may have a pixel array such as a liquid crystal pixel array. The pixel array may be illuminated with backlight illumination from a direct-lit backlight unit. The backlight unit may include an array of light-emitting diodes on a printed circuit board. The backlight unit may include first, second, and third light spreading layers formed over the array of light-emitting diodes. A color conversion layer may be formed over the first, second, and third light spreading layers. First and second brightness enhancement films may be formed over the color conversion layer.
Opening claim text (preview).
What is claimed is: 1. A display, comprising: a printed circuit board; and an array of light sources mounted on the printed circuit board, wherein the printed circuit board comprises: a white core layer that has a reflectivity of more than 80%; a first conductive layer on the white core layer; and a white solder resist layer on the first conductive layer, wherein the white solder resist layer has a reflectivity of more than 80%. 2. The display defined in claim 1 , wherein the printed circuit board further comprises: a second conductive layer, wherein the white core layer is interposed between the first and second conductive layers. 3. The display defined in claim 2 , wherein the printed circuit board further comprises: a prepreg layer, wherein the second conductive layer is interposed between the white core layer and the prepreg layer. 4. The display defined in claim 3 , wherein the printed circuit board further comprises: a third conductive layer, wherein the prepreg layer is interposed between the second and third conductive layers. 5. The display defined in claim 4 , wherein the printed circuit board further comprises: an additional white solder resist layer, wherein the third conductive layer is interposed between the prepreg layer and the additional white solder resist layer and wherein the additional white solder resist layer has a reflectivity of more than 80%. 6. The display defined in claim 5 , wherein the prepreg layer has a lower dielectric constant than the additional white solder resist layer. 7. The display defined in claim 6 , wherein the additional white solder resist layer has a lower dielectric constant than the white core layer. 8. The display defined in claim 7 , wherein the white core layer has a lower dielectric constant than the white solder resist layer. 9. The display defined in claim 5 , wherein the printed circuit board further comprises: a conductive shield attached to a lower surface of the additional white solder resist layer using a layer of adhesive. 10. The display defined in claim 5 , wherein the white core layer is thicker than the first conductive layer, the white solder resist layer, the second conductive layer, the prepreg layer, the third conductive layer, and the additional white solder resist layer. 11. The display defined in claim 5 , wherein the additional white solder resist layer has a lower thickness than the white solder resist layer. 12. The display defined in claim 1 , wherein each light source is mounted to the printed circuit board in a respective rectangular opening in the white solder resist layer.
including means for improving the brightness uniformity · CPC title
including a specially adapted diffusing, scattering or light controlling members · CPC title
using photoluminescence, e.g. phosphors illuminated by UV or blue light · CPC title
including particular frames or supporting means · CPC title
Electrical details · CPC title
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